Patents by Inventor Masakazu Nakada

Masakazu Nakada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210272479
    Abstract: A heart model includes a deformable body forming a simulated ventricle therein that expand and contract; and a restraint body outside of the simulated ventricle and having a spiral outer shape, the restraint body regulating deformation of the deformable to generate a twist in the deformable body when the simulated ventricle expands.
    Type: Application
    Filed: May 13, 2021
    Publication date: September 2, 2021
    Applicant: ASAHI INTECC CO., LTD.
    Inventors: Nobuyoshi YAMANAKA, Satoshi NAMIMA, Masakazu NAKADA
  • Publication number: 20210272480
    Abstract: A vascular model that includes a flow path forming portion, and a diffusion portion formed with a porous body fluidly connected to the fluid flow path.
    Type: Application
    Filed: May 17, 2021
    Publication date: September 2, 2021
    Applicant: ASAHI INTECC CO., LTD.
    Inventors: Rina YONEYAMA, Nobuyoshi YAMANAKA, Satoshi NAMIMA, Masakazu NAKADA
  • Publication number: 20210272481
    Abstract: An organ simulator that includes an organ model, a vascular model adjacent to the organ model, and a flow path forming portion positioned near an opening at a distal end of the vascular model and forming a diffusive flow path.
    Type: Application
    Filed: May 17, 2021
    Publication date: September 2, 2021
    Applicant: ASAHI INTECC CO., LTD.
    Inventors: Satoshi NAMIMA, Masakazu NAKADA
  • Patent number: 8178272
    Abstract: An external additive including titanium dioxide having a water-soluble component of at least 0.2% by weight and a fluorosilane compound, wherein the titanium dioxide is surface-reformed by the fluorosilane compound.
    Type: Grant
    Filed: September 11, 2008
    Date of Patent: May 15, 2012
    Assignee: Ricoh Company Limited
    Inventors: Masanori Rimoto, Masakazu Nakada, Hideyuki Ueda
  • Patent number: 7776503
    Abstract: The present invention provides a method for manufacturing particles, where a viscous material is sprayed with a high-pressure gas for atomization while the viscous material is being discharged in a chamber, and cooling air is introduced in the chamber for granulation. The present invention also provides a method for manufacturing a toner, where a mixture containing at least a binding resin and a colorant is melt mixed under pressure or melt mixed with an injection of a supercritical fluid, the obtained melt-mixed substance is sprayed with a high-pressure gas for atomization while the melt-mixed substance is being discharged in a chamber, and cooling air is introduced in the chamber from an air inlet formed on the chamber.
    Type: Grant
    Filed: March 22, 2006
    Date of Patent: August 17, 2010
    Assignee: Ricoh Company, Ltd.
    Inventors: Nobuyasu Makino, Masakazu Nakada
  • Patent number: 7642468
    Abstract: To improve reliability of interlayer connection of a multilayer wiring board. Plural metal conductor pattern layers are formed on a base material made of thermoplastic resin. Then, high melting metal containing copper, low melting metal containing tin, and binder resin are packed into a via hole. Subsequently, predetermined heat and pressure are applied. Then, while half-melted metal mixture droplets of the low and high melting metals and melted binder resin are phase separated from each other, the surfaces of the conductor patterns that face the openings of the via and the low melting metal are alloyed with each other to form an alloy layer as well as the high and low meting metals are alloyed with each other to form a columnar-shaped interlayer connection part. As a result, an intermediate layer is formed between the outer surface of the columnar-shaped interlayer connection part and inner surface of the via hole.
    Type: Grant
    Filed: July 18, 2006
    Date of Patent: January 5, 2010
    Assignee: Sony Corporation
    Inventors: Masakazu Nakada, Minoru Ogawa
  • Publication number: 20090068580
    Abstract: An external additive including titanium dioxide having a water-soluble component of at least 0.2% by weight and a fluorosilane compound, wherein the titanium dioxide is surface-reformed by the fluorosilane compound.
    Type: Application
    Filed: September 11, 2008
    Publication date: March 12, 2009
    Inventors: Masanori Rimoto, Masakazu Nakada, Hideyuki Ueda
  • Patent number: 7318990
    Abstract: A toner includes toner particles which have a binder resin and a colorant. The toner has a weight average particle diameter of from 4 to 7 ?m and includes toner particles having a circle equivalent diameter of from 0.6 to 2.0 ?m in an amount not greater than 5% by quantity, toner particles having a particle diameter of from 3.17 to 4.00 ?m in an amount of from 10 to 40% by quantity, toner particles having a diameter of from 4.00 to 5.04 ?m in an amount of from 20 to 40% by quantity, and toner particles having a diameter not less than 12.7 ?m in an amount of from 0 to 1.0% by weight. The toner satisfies the following relationship: 1.04?D4/D1?1.30, wherein D4 represents the weight average particle diameter and D1 represents a number average particle diameter of the toner.
    Type: Grant
    Filed: December 13, 2004
    Date of Patent: January 15, 2008
    Assignee: Ricoh Company, Ltd.
    Inventors: Nobuyasu Makino, Masakazu Nakada, Tohru Suganuma, Fumitoshi Murakami
  • Patent number: 7244675
    Abstract: The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection material 100 for electrically connecting an electrical connection portion of a first object 4 and an electrical connection portion of a second object 2. The electrical connection material 100 comprises a first film-like adhesive layer 6 which is a film-like adhesive layer arranged on the first object 4 and is composed of a plurality of conductive particles 7, a first binder 8 containing the conductive particles 7, and a first filler F1 and a second film-like adhesive layer 9 which is arranged on the first film-like adhesive layer 6 and is composed of a second binder 9A whose viscosity is lower than that of the first binder 8 and a second filler F2.
    Type: Grant
    Filed: March 23, 2001
    Date of Patent: July 17, 2007
    Assignee: Sony Corporation
    Inventors: Noriyuki Honda, Nobuhiro Hanai, Masakazu Nakada
  • Publication number: 20060274510
    Abstract: To improve reliability of interlayer connection of a multilayer wiring board. Plural metal conductor pattern layers are formed on a base material made of thermoplastic resin. Then, high melting metal containing copper, low melting metal containing tin, and binder resin are packed into a via hole. Subsequently, predetermined heat and pressure are applied. Then, while half-melted metal mixture droplets of the low and high melting metals and melted binder resin are phase separated from each other, the surfaces of the conductor patterns that face the openings of the via and the low melting metal are alloyed with each other to form an alloy layer as well as the high and low meting metals are alloyed with each other to form a columnar-shaped interlayer connection part. As a result, an intermediate layer is formed between the outer surface of the columnar-shaped interlayer connection part and inner surface of the via hole.
    Type: Application
    Filed: July 18, 2006
    Publication date: December 7, 2006
    Inventors: Masakazu Nakada, Minoru Ogawa
  • Publication number: 20060222980
    Abstract: The present invention provides a method for manufacturing particles, where a viscous material is sprayed with a high-pressure gas for atomization while the viscous material is being discharged in a chamber, and cooling air is introduced in the chamber for granulation. The present invention also provides a method for manufacturing a toner, where a mixture containing at least a binding resin and a colorant is melt mixed under pressure or melt mixed with an injection of a supercritical fluid, the obtained melt-mixed substance is sprayed with a high-pressure gas for atomization while the melt-mixed substance is being discharged in a chamber, and cooling air is introduced in the chamber from an air inlet formed on the chamber.
    Type: Application
    Filed: March 22, 2006
    Publication date: October 5, 2006
    Inventors: Nobuyasu Makino, Masakazu Nakada
  • Patent number: 7078807
    Abstract: The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection material 100 for electrically connecting an electrical connection portion of a first object 4 and an electrical connection portion of a second object 2. The electrical connection material 100 comprises a first film-like adhesive layer 6 which is a film-like adhesive layer arranged on the first object 4 and is composed of a plurality of conductive particles 7, a first binder 8 containing the conductive particles 7, and a first filler F1 and a second film-like adhesive layer 9 which is arranged on the first film-like adhesive layer 6 and is composed of a second binder 9A whose viscosity is lower than that of the first binder 8 and a second filler F2.
    Type: Grant
    Filed: April 28, 2005
    Date of Patent: July 18, 2006
    Assignee: Sony Corporation
    Inventors: Noriyuki Honda, Nobuhiro Hanai, Masakazu Nakada
  • Publication number: 20050194680
    Abstract: The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection material 100 for electrically connecting an electrical connection portion of a first object 4 and an electrical connection portion of a second object 2. The electrical connection material 100 comprises a first film-like adhesive layer 6 which is a film-like adhesive layer arranged on the first object 4 and is composed of a plurality of conductive particles 7, a first binder 8 containing the conductive particles 7, and a first filler F1 and a second film-like adhesive layer 9 which is arranged on the first film-like adhesive layer 6 and is composed of a second binder 9A whose viscosity is lower than that of the first binder 8 and a second filler F2.
    Type: Application
    Filed: April 28, 2005
    Publication date: September 8, 2005
    Inventors: Noriyuki Honda, Nobuhiro Hanai, Masakazu Nakada
  • Publication number: 20050158648
    Abstract: A toner includes toner particles which have a binder resin and a colorant. The toner has a weight average particle diameter of from 4 to 7 ?m and includes toner particles having a circle equivalent diameter of from 0.6 to 2.0 ?m in an amount not greater than 5% by quantity, toner particles having a particle diameter of from 3.17 to 4.00 ?m in an amount of from 10 to 40% by quantity, toner particles having a diameter of from 4.00 to 5.04 ?m in an amount of from 20 to 40% by quantity, and toner particles having a diameter not less than 12.7 ?m in an amount of from 0 to 1.0% by weight. The toner satisfies the following relationship: 1.04?D4/D1?1.30, wherein D4 represents the weight average particle diameter and D1 represents a number average particle diameter of the toner.
    Type: Application
    Filed: December 13, 2004
    Publication date: July 21, 2005
    Inventors: Nobuyasu Makino, Masakazu Nakada, Tohru Suganuma, Fumitoshi Murakami
  • Patent number: 6854493
    Abstract: A powder filling apparatus includes a first container configured to contain a powder. A weighing tank is configured to receive the powder from the first container and discharge a predetermined amount of the powder to a second container, which includes an opening configured to discharge the powder into the second container and a regulator configured to open and close the opening to discharge the predetermined amount of the powder into the second container. A connector is configured to feed the powder from the first container into the weighing tank.
    Type: Grant
    Filed: January 30, 2003
    Date of Patent: February 15, 2005
    Assignee: Ricoh Company, Ltd.
    Inventors: Hideo Ichikawa, Masanori Rimoto, Masakazu Nakada
  • Publication number: 20030155035
    Abstract: A powder filling apparatus includes a first container configured to contain a powder. A weighing tank is configured to receive the powder from the first container and discharge a predetermined amount of the powder to a second container, which includes an opening configured to discharge the powder into the second container and a regulator configured to open and close the opening to discharge the predetermined amount of the powder into the second container. A connector is configured to feed the powder from the first container into the weighing tank.
    Type: Application
    Filed: January 30, 2003
    Publication date: August 21, 2003
    Inventors: Hideo Ichikawa, Masanori Rimoto, Masakazu Nakada
  • Publication number: 20030011077
    Abstract: A sealing resin for flip chip mounting. It permits a semiconductor chip to be mounted on a printed circuit board with high reliability. It contributes to high productivity and cost reduction in flip chip mounting. When in use for flip chip mounting, it fills the gap between a semiconductor chip and a printed circuit board, thereby sealing solder connections between them. It comprises an epoxy resin, an acid anhydride hardener to cure said epoxy resin, a flux to remove oxide film from solder bumps or solder balls on the semiconductor chip and printed circuit board, and an inorganic particulate filler with an average diameter ranging from 10 &mgr;m to 20 &mgr;m.
    Type: Application
    Filed: August 21, 2002
    Publication date: January 16, 2003
    Inventors: Masayuki Morishima, Kaoru Iwabuchi, Masakazu Nakada
  • Publication number: 20020173145
    Abstract: The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection material 100 for electrically connecting an electrical connection portion of a first object 4 and an electrical connection portion of a second object 2. The electrical connection material 100 comprises a first film-like adhesive layer 6 which is a film-like adhesive layer arranged on the first object 4 and is composed of a plurality of conductive particles 7, a first binder 8 containing the conductive particles 7, and a first filler F1 and a second film-like adhesive layer 9 which is arranged on the first film-like adhesive layer 6 and is composed of a second binder 9A whose viscosity is lower than that of the first binder 8 and a second filler F2.
    Type: Application
    Filed: May 28, 2002
    Publication date: November 21, 2002
    Inventors: Noriyuki Honda, Nobuhiro Hanai, Masakazu Nakada
  • Patent number: 5983059
    Abstract: A recyclable toner container having a hollow cylindrical body, a toner outlet at one end of the container, and a removable cap fitted in the toner outlet. The cap have a plurality of circumferential protuberances on an outer periphery thereof and contacting the inner periphery of the toner outlet. The diameters of the plurality of protuberances are sequentially increased from a downstream side toward an upstream side in a direction in which the cap is inserted into the toner outlet.
    Type: Grant
    Filed: September 8, 1997
    Date of Patent: November 9, 1999
    Assignee: Ricoh Company, Ltd.
    Inventors: Seiji Oka, Yasushi Akiba, Masumi Ikesue, Masakazu Nakada, Hiroyasu Itou
  • Patent number: 5740507
    Abstract: A toner container densely packed with toner to be replenished into a developing unit included in an image forming apparatus, and a method of producing the same. The toner is packed in the container with a ratio of a packing density to a saturation bulk density greater than 1.0, a mean penetration greater than 5.0 mm inclusive, and a standard deviation of penetration not exceeding one-fifth of the mean penetration. The toner can be smoothly and continuously replenished into the developing unit so as to form a number of images matching the amount thereof.
    Type: Grant
    Filed: April 4, 1996
    Date of Patent: April 14, 1998
    Assignee: Ricoh Company, Ltd.
    Inventors: Hideo Ichikawa, Sunao Ikeda, Nobuhiro Makita, Michiharu Narushima, Seiji Terazawa, Masakazu Nakada, Kazuhiko Umemura