Patents by Inventor Masakazu Nakada
Masakazu Nakada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240042177Abstract: The guide wire includes a core shaft, a coil body with a wire helically wound around the outer periphery of the core shaft, and a coating layer provided on the outer periphery of the coil body. The coating layer has a peak portion protruding in the outer peripheral direction of the guide wire in a swollen state. On a cross-section including a central axis of the coil body, an apex of the peak portion is present at a position on a proximal end side of a first virtual straight line that extends through a central point of a first transverse section of the wire and is perpendicular to the central axis and at a position on a distal end side of a second virtual straight line that extends through a central point of second transverse section of the wire and is perpendicular to the central axis.Type: ApplicationFiled: October 12, 2023Publication date: February 8, 2024Applicant: ASAHI INTECC CO., LTD.Inventors: Soichi FUTAMI, Masakazu NAKADA, Junji SATOZAKI, Yumi TAKATA
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Publication number: 20220114916Abstract: A heart simulator includes: a heart model simulating the heart and having a cardiac apex portion and a cardiac base portion; a cardiovascular model arranged outside the heart model; and a pericardium member covering the heart model and the cardiovascular model. The pericardium member has a plurality of through-holes that penetrate the inside and the outside of the pericardium member.Type: ApplicationFiled: December 22, 2021Publication date: April 14, 2022Applicant: ASAHI INTECC CO., LTD.Inventors: Satoshi NAMIMA, Masakazu NAKADA
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Publication number: 20210272481Abstract: An organ simulator that includes an organ model, a vascular model adjacent to the organ model, and a flow path forming portion positioned near an opening at a distal end of the vascular model and forming a diffusive flow path.Type: ApplicationFiled: May 17, 2021Publication date: September 2, 2021Applicant: ASAHI INTECC CO., LTD.Inventors: Satoshi NAMIMA, Masakazu NAKADA
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Publication number: 20210272479Abstract: A heart model includes a deformable body forming a simulated ventricle therein that expand and contract; and a restraint body outside of the simulated ventricle and having a spiral outer shape, the restraint body regulating deformation of the deformable to generate a twist in the deformable body when the simulated ventricle expands.Type: ApplicationFiled: May 13, 2021Publication date: September 2, 2021Applicant: ASAHI INTECC CO., LTD.Inventors: Nobuyoshi YAMANAKA, Satoshi NAMIMA, Masakazu NAKADA
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Publication number: 20210272480Abstract: A vascular model that includes a flow path forming portion, and a diffusion portion formed with a porous body fluidly connected to the fluid flow path.Type: ApplicationFiled: May 17, 2021Publication date: September 2, 2021Applicant: ASAHI INTECC CO., LTD.Inventors: Rina YONEYAMA, Nobuyoshi YAMANAKA, Satoshi NAMIMA, Masakazu NAKADA
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Patent number: 8178272Abstract: An external additive including titanium dioxide having a water-soluble component of at least 0.2% by weight and a fluorosilane compound, wherein the titanium dioxide is surface-reformed by the fluorosilane compound.Type: GrantFiled: September 11, 2008Date of Patent: May 15, 2012Assignee: Ricoh Company LimitedInventors: Masanori Rimoto, Masakazu Nakada, Hideyuki Ueda
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Patent number: 7776503Abstract: The present invention provides a method for manufacturing particles, where a viscous material is sprayed with a high-pressure gas for atomization while the viscous material is being discharged in a chamber, and cooling air is introduced in the chamber for granulation. The present invention also provides a method for manufacturing a toner, where a mixture containing at least a binding resin and a colorant is melt mixed under pressure or melt mixed with an injection of a supercritical fluid, the obtained melt-mixed substance is sprayed with a high-pressure gas for atomization while the melt-mixed substance is being discharged in a chamber, and cooling air is introduced in the chamber from an air inlet formed on the chamber.Type: GrantFiled: March 22, 2006Date of Patent: August 17, 2010Assignee: Ricoh Company, Ltd.Inventors: Nobuyasu Makino, Masakazu Nakada
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Patent number: 7642468Abstract: To improve reliability of interlayer connection of a multilayer wiring board. Plural metal conductor pattern layers are formed on a base material made of thermoplastic resin. Then, high melting metal containing copper, low melting metal containing tin, and binder resin are packed into a via hole. Subsequently, predetermined heat and pressure are applied. Then, while half-melted metal mixture droplets of the low and high melting metals and melted binder resin are phase separated from each other, the surfaces of the conductor patterns that face the openings of the via and the low melting metal are alloyed with each other to form an alloy layer as well as the high and low meting metals are alloyed with each other to form a columnar-shaped interlayer connection part. As a result, an intermediate layer is formed between the outer surface of the columnar-shaped interlayer connection part and inner surface of the via hole.Type: GrantFiled: July 18, 2006Date of Patent: January 5, 2010Assignee: Sony CorporationInventors: Masakazu Nakada, Minoru Ogawa
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Publication number: 20090068580Abstract: An external additive including titanium dioxide having a water-soluble component of at least 0.2% by weight and a fluorosilane compound, wherein the titanium dioxide is surface-reformed by the fluorosilane compound.Type: ApplicationFiled: September 11, 2008Publication date: March 12, 2009Inventors: Masanori Rimoto, Masakazu Nakada, Hideyuki Ueda
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Patent number: 7318990Abstract: A toner includes toner particles which have a binder resin and a colorant. The toner has a weight average particle diameter of from 4 to 7 ?m and includes toner particles having a circle equivalent diameter of from 0.6 to 2.0 ?m in an amount not greater than 5% by quantity, toner particles having a particle diameter of from 3.17 to 4.00 ?m in an amount of from 10 to 40% by quantity, toner particles having a diameter of from 4.00 to 5.04 ?m in an amount of from 20 to 40% by quantity, and toner particles having a diameter not less than 12.7 ?m in an amount of from 0 to 1.0% by weight. The toner satisfies the following relationship: 1.04?D4/D1?1.30, wherein D4 represents the weight average particle diameter and D1 represents a number average particle diameter of the toner.Type: GrantFiled: December 13, 2004Date of Patent: January 15, 2008Assignee: Ricoh Company, Ltd.Inventors: Nobuyasu Makino, Masakazu Nakada, Tohru Suganuma, Fumitoshi Murakami
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Patent number: 7244675Abstract: The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection material 100 for electrically connecting an electrical connection portion of a first object 4 and an electrical connection portion of a second object 2. The electrical connection material 100 comprises a first film-like adhesive layer 6 which is a film-like adhesive layer arranged on the first object 4 and is composed of a plurality of conductive particles 7, a first binder 8 containing the conductive particles 7, and a first filler F1 and a second film-like adhesive layer 9 which is arranged on the first film-like adhesive layer 6 and is composed of a second binder 9A whose viscosity is lower than that of the first binder 8 and a second filler F2.Type: GrantFiled: March 23, 2001Date of Patent: July 17, 2007Assignee: Sony CorporationInventors: Noriyuki Honda, Nobuhiro Hanai, Masakazu Nakada
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Publication number: 20060274510Abstract: To improve reliability of interlayer connection of a multilayer wiring board. Plural metal conductor pattern layers are formed on a base material made of thermoplastic resin. Then, high melting metal containing copper, low melting metal containing tin, and binder resin are packed into a via hole. Subsequently, predetermined heat and pressure are applied. Then, while half-melted metal mixture droplets of the low and high melting metals and melted binder resin are phase separated from each other, the surfaces of the conductor patterns that face the openings of the via and the low melting metal are alloyed with each other to form an alloy layer as well as the high and low meting metals are alloyed with each other to form a columnar-shaped interlayer connection part. As a result, an intermediate layer is formed between the outer surface of the columnar-shaped interlayer connection part and inner surface of the via hole.Type: ApplicationFiled: July 18, 2006Publication date: December 7, 2006Inventors: Masakazu Nakada, Minoru Ogawa
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Publication number: 20060222980Abstract: The present invention provides a method for manufacturing particles, where a viscous material is sprayed with a high-pressure gas for atomization while the viscous material is being discharged in a chamber, and cooling air is introduced in the chamber for granulation. The present invention also provides a method for manufacturing a toner, where a mixture containing at least a binding resin and a colorant is melt mixed under pressure or melt mixed with an injection of a supercritical fluid, the obtained melt-mixed substance is sprayed with a high-pressure gas for atomization while the melt-mixed substance is being discharged in a chamber, and cooling air is introduced in the chamber from an air inlet formed on the chamber.Type: ApplicationFiled: March 22, 2006Publication date: October 5, 2006Inventors: Nobuyasu Makino, Masakazu Nakada
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Patent number: 7078807Abstract: The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection material 100 for electrically connecting an electrical connection portion of a first object 4 and an electrical connection portion of a second object 2. The electrical connection material 100 comprises a first film-like adhesive layer 6 which is a film-like adhesive layer arranged on the first object 4 and is composed of a plurality of conductive particles 7, a first binder 8 containing the conductive particles 7, and a first filler F1 and a second film-like adhesive layer 9 which is arranged on the first film-like adhesive layer 6 and is composed of a second binder 9A whose viscosity is lower than that of the first binder 8 and a second filler F2.Type: GrantFiled: April 28, 2005Date of Patent: July 18, 2006Assignee: Sony CorporationInventors: Noriyuki Honda, Nobuhiro Hanai, Masakazu Nakada
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Publication number: 20050194680Abstract: The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection material 100 for electrically connecting an electrical connection portion of a first object 4 and an electrical connection portion of a second object 2. The electrical connection material 100 comprises a first film-like adhesive layer 6 which is a film-like adhesive layer arranged on the first object 4 and is composed of a plurality of conductive particles 7, a first binder 8 containing the conductive particles 7, and a first filler F1 and a second film-like adhesive layer 9 which is arranged on the first film-like adhesive layer 6 and is composed of a second binder 9A whose viscosity is lower than that of the first binder 8 and a second filler F2.Type: ApplicationFiled: April 28, 2005Publication date: September 8, 2005Inventors: Noriyuki Honda, Nobuhiro Hanai, Masakazu Nakada
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Publication number: 20050158648Abstract: A toner includes toner particles which have a binder resin and a colorant. The toner has a weight average particle diameter of from 4 to 7 ?m and includes toner particles having a circle equivalent diameter of from 0.6 to 2.0 ?m in an amount not greater than 5% by quantity, toner particles having a particle diameter of from 3.17 to 4.00 ?m in an amount of from 10 to 40% by quantity, toner particles having a diameter of from 4.00 to 5.04 ?m in an amount of from 20 to 40% by quantity, and toner particles having a diameter not less than 12.7 ?m in an amount of from 0 to 1.0% by weight. The toner satisfies the following relationship: 1.04?D4/D1?1.30, wherein D4 represents the weight average particle diameter and D1 represents a number average particle diameter of the toner.Type: ApplicationFiled: December 13, 2004Publication date: July 21, 2005Inventors: Nobuyasu Makino, Masakazu Nakada, Tohru Suganuma, Fumitoshi Murakami
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Patent number: 6854493Abstract: A powder filling apparatus includes a first container configured to contain a powder. A weighing tank is configured to receive the powder from the first container and discharge a predetermined amount of the powder to a second container, which includes an opening configured to discharge the powder into the second container and a regulator configured to open and close the opening to discharge the predetermined amount of the powder into the second container. A connector is configured to feed the powder from the first container into the weighing tank.Type: GrantFiled: January 30, 2003Date of Patent: February 15, 2005Assignee: Ricoh Company, Ltd.Inventors: Hideo Ichikawa, Masanori Rimoto, Masakazu Nakada
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Publication number: 20030155035Abstract: A powder filling apparatus includes a first container configured to contain a powder. A weighing tank is configured to receive the powder from the first container and discharge a predetermined amount of the powder to a second container, which includes an opening configured to discharge the powder into the second container and a regulator configured to open and close the opening to discharge the predetermined amount of the powder into the second container. A connector is configured to feed the powder from the first container into the weighing tank.Type: ApplicationFiled: January 30, 2003Publication date: August 21, 2003Inventors: Hideo Ichikawa, Masanori Rimoto, Masakazu Nakada
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Publication number: 20030011077Abstract: A sealing resin for flip chip mounting. It permits a semiconductor chip to be mounted on a printed circuit board with high reliability. It contributes to high productivity and cost reduction in flip chip mounting. When in use for flip chip mounting, it fills the gap between a semiconductor chip and a printed circuit board, thereby sealing solder connections between them. It comprises an epoxy resin, an acid anhydride hardener to cure said epoxy resin, a flux to remove oxide film from solder bumps or solder balls on the semiconductor chip and printed circuit board, and an inorganic particulate filler with an average diameter ranging from 10 &mgr;m to 20 &mgr;m.Type: ApplicationFiled: August 21, 2002Publication date: January 16, 2003Inventors: Masayuki Morishima, Kaoru Iwabuchi, Masakazu Nakada
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Publication number: 20020173145Abstract: The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection material 100 for electrically connecting an electrical connection portion of a first object 4 and an electrical connection portion of a second object 2. The electrical connection material 100 comprises a first film-like adhesive layer 6 which is a film-like adhesive layer arranged on the first object 4 and is composed of a plurality of conductive particles 7, a first binder 8 containing the conductive particles 7, and a first filler F1 and a second film-like adhesive layer 9 which is arranged on the first film-like adhesive layer 6 and is composed of a second binder 9A whose viscosity is lower than that of the first binder 8 and a second filler F2.Type: ApplicationFiled: May 28, 2002Publication date: November 21, 2002Inventors: Noriyuki Honda, Nobuhiro Hanai, Masakazu Nakada