Abstract: An electronic device includes at least two boards and support pillars. The at least two boards include hole portions. The support pillars inserted into the hole portions such that the at least two boards are held mutually separated. The hole portions include tapered surfaces that incline toward center portions of the hole portions from a surface on a side from which the support pillars of the boards are inserted.

Abstract: An electronic device includes at least two boards and support pillars. The at least two boards include hole portions. The support pillars inserted into the hole portions such that the at least two boards are held mutually separated. The hole portions include tapered surfaces that incline toward center portions of the hole portions from a surface on a side from which the support pillars of the boards are inserted.

Abstract: A metal base having plural protrusions at its bottom is engaged with and placed on standing metal pins in plural through holes provided in a base board, and a circuit board is fitted to an upper end of the metal pins. A crystal resonator is arranged on the circuit board via a heater element, and the metal base is covered with a metal cover, thereby obtaining a sealed structure of the crystal resonator. A two-stage counterbored portion including a first-stage and a second-stage counterbored portions is formed in the bottom of the base board, and a solder or conductive resin is filled in a gap between the first-stage counterbored portion formed around the metal pin inserted into the through hole, and the through hole and the metal pin to fix the metal pin in the though hole. Slits penetrating through the base board are formed around the metal pin.

Abstract: A metal base having plural protrusions at its bottom is engaged with and placed on standing metal pins in plural through holes provided in a base board, and a circuit board is fitted to an upper end of the metal pins. A crystal resonator is arranged on the circuit board via a heater element, and the metal base is covered with a metal cover, thereby obtaining a sealed structure of the crystal resonator. A two-stage counterbored portion including a first-stage and a second-stage counterbored portions is formed in the bottom of the base board, and a solder or conductive resin is filled in a gap between the first-stage counterbored portion formed around the metal pin inserted into the through hole, and the through hole and the metal pin to fix the metal pin in the though hole. Slits penetrating through the base board are formed around the metal pin.

Abstract: A method of manufacturing a surface mounted (crystal) device comprising: the steps of providing an aggregated sheet material having a plurality of container main bodies lengthwise and crosswise, accommodating at least a crystal piece inside the concavities of the plurality of container main bodies formed in the aggregated sheet material, and then parting the aggregated sheet material into individual container main bodies. The method further includes: the steps of providing annular grooves on outer perimeters between the container main bodies of the aggregated sheet material; positioning an outer peripheral edge of an electrode roller having an inclined face of a seam welder inside the annular groove; abutting the inclined face against a metal cover tacked to the container main body; bonding the metal cover to an aperture end face of the container main body, by seam welding; and then parting the aggregated sheet material into individual container main bodies.

Abstract: The invention relates to a method of manufacturing a surface mounted (crystal) device comprising: the steps of providing an aggregated sheet material having a plurality of container main bodies lengthwise and crosswise, accommodating at least a crystal piece inside the concavities of the plurality of container main bodies formed in the aggregated sheet material, and then parting the aggregated sheet material into individual container main bodies. The method further includes: the steps of providing annular grooves on outer perimeters between the container main bodies of the aggregated sheet material; positioning an outer peripheral edge of an electrode roller having an inclined face of a seam welder inside the annular groove; abutting the inclined face against a metal cover tacked to the container main body; bonding the metal cover to an aperture end face of the container main body, by seam welding; and then parting the aggregated sheet material into individual container main bodies.

Abstract: The structure provided with a plurality of substrates of the present invention is provided with a plurality of substrates each provided with chip-shaped circuit devices connected by poles also used as electrical wiring. At least one pole connecting the plurality of substrates is also used as one of the circuit devices. Simultaneously, the circuit devices also used as poles are mounted on each substrate in a standing posture.

Abstract: A method of manufacturing a mounting substrate accommodating therein an electronic component for use in a surface mount crystal oscillator and adapted to be joined to a bottom surface of a crystal unit has the steps of defining a recess with a bottom wall and a frame wall having an opening, placing the electronic component in the recess, filling the recess with a resin for protecting the electronic component, and, after the resin is cured, removing at least a portion of the frame wall. The electronic component typically comprises an IC (Integrated Circuit) chip incorporating an integrated oscillating circuit that employs a crystal unit.

Abstract: The structure provided with a plurality of substrates of the present invention is provided with a plurality of substrates each provided with chip-shaped circuit devices connected by poles also used as electrical wiring. At least one pole connecting the plurality of substrates is also used as one of the circuit devices. Simultaneously, the circuit devices also used as poles are mounted on each substrate in a standing posture.

Abstract: A surface-mount quartz crystal oscillator has a casing having a recess defined therein, a quartz crystal blank fixedly mounted on the bottom of the recess, and an IC (Integrated Circuit) chip having an integrated oscillating circuit connected to the crystal blank. The casing has a frame wall which defines the recess. The IC chip has an outer peripheral edge joined to an upper surface of the frame wall. The crystal blank is hermetically sealed in a space surrounded by the casing and the IC chip. IC connecting terminals are disposed on the upper surface of the frame wall for connection to IC terminals on the IC chip.

Abstract: A method of manufacturing a mounting substrate accommodating therein an electronic component for use in a surface mount crystal oscillator and adapted to be joined to a bottom surface of a crystal unit has the steps of defining a recess with a bottom wall and a frame wall having an opening, placing the electronic component in the recess, filling the recess with a resin for protecting the electronic component, and, after the resin is cured, removing at least a portion of the frame wall. The electronic component typically comprises an IC (Integrated Circuit) chip incorporating an integrated oscillating circuit that employs a crystal unit.

Abstract: A surface-mount quartz crystal oscillator has a casing having a recess defined therein, a quartz crystal blank fixedly mounted on the bottom of the recess, and an IC (Integrated Circuit) chip having an integrated oscillating circuit connected to the crystal blank. The casing has a frame wall which defines the recess. The IC chip has an outer peripheral edge joined to an upper surface of the frame wall. The crystal blank is hermetically sealed in a space surrounded by the casing and the IC chip. IC connecting terminals are disposed on the upper surface of the frame wall for connection to IC terminals on the IC chip.