Abstract: A thermoelectric generation module includes a first substrate and a second substrate, a plurality of first electrodes and second electrodes that are arranged on the first substrate and the second substrate, a thermoelectric conversion element arranged between the first electrode and the second electrode, and a terminal pin connected to the second electrode. The second substrate includes an insulator layer made of an electrical insulating material, a through-hole that penetrates the insulator layer for insertion of the terminal pin, and an annular metal layer arranged at a peripheral portion of the through-hole. A space between the terminal pin and the through-hole is sealed by solder.

Abstract: A thermoelectric power generation device includes: a high-temperature plate having an upper face; a low-temperature plate having a lower face; a thermoelectric module disposed between the upper face and the lower face; a sealing portion disposed between the upper and lower faces, the sealing portion sealing the thermoelectric module at a circumferential portion of the upper face and a circumferential portion of the lower face; a first positioning portion disposed at the circumferential portion of the upper face; and a second positioning portion disposed at the circumferential portion of the lower face. The first positioning portion positions the sealing portion at the circumferential portion of the upper face, and the second positioning portion positions the sealing portion at the circumferential portion of the lower face.

Abstract: A thermoelectric power generation device includes: a high-temperature plate having an upper face; a low-temperature plate having a lower face; a thermoelectric module disposed between the upper face and the lower face; a sealing portion disposed between the upper and lower faces, the sealing portion sealing the thermoelectric module at a circumferential portion of the upper face and a circumferential portion of the lower face; a first positioning portion disposed at the circumferential portion of the upper face; and a second positioning portion disposed at the circumferential portion of the lower face. The first positioning portion positions the sealing portion at the circumferential portion of the upper face, and the second positioning portion positions the sealing portion at the circumferential portion of the lower face.

Abstract: A thermoelectric generator module includes a first base material that is formed into a sheet and that has a thermoplastic layer, a second base material that is formed into a sheet and that has a thermoplastic layer, a plurality of thermoelectric conversion elements arranged between the first base material and the second base material, a plurality of first electrodes arranged between the first base material and the thermoelectric conversion elements, a plurality of second electrodes arranged between the second base material and the thermoelectric conversion elements, and a joint that joins the first base material to the second base material. The thermoelectric conversion elements, the plurality of first electrodes, and the plurality of second electrodes are sealed by the joint.

Abstract: A thermoelectric power generation module includes two substrates, a thermoelectric conversion element, a sealing portion sealing peripheral edges of upper and lower surfaces, a first solder between the upper surface and the sealing portion, and a second solder between the lower surface and the sealing portion. At least one of outer and inner edges of the first solder or the sealing portion is deviated from the first solder or the sealing portion. At least one of outer and inner edges of the second solder or the sealing portion is deviated from the second solder or the sealing portion. At least one of the outer and inner edges of the first solder has a fillet shape between the upper surface and the sealing portion. At least one of the outer and inner edges of the second solder has a fillet shape between the lower surface and the sealing portion.

Abstract: A thermoelectric power generation device includes: a high-temperature plate having an upper face; a low-temperature plate having a lower face; a thermoelectric module disposed between the upper face and the lower face; a sealing portion disposed between the upper and lower faces, the sealing portion sealing the thermoelectric module at a circumferential portion of the upper face and a circumferential portion of the lower face; a first positioning portion disposed at the circumferential portion of the upper face; and a second positioning portion disposed at the circumferential portion of the lower face. The first positioning portion positions the sealing portion at the circumferential portion of the upper face, and the second positioning portion positions the sealing portion at the circumferential portion of the lower face.

Abstract: A thermoelectric generation module includes a first substrate and a second substrate, a plurality of first electrodes and second electrodes that are arranged on the first substrate and the second substrate, a thermoelectric conversion element arranged between the first electrode and the second electrode, and a terminal pin connected to the second electrode. The second substrate includes an insulator layer made of an electrical insulating material, a through-hole that penetrates the insulator layer for insertion of the terminal pin, and an annular metal layer arranged at a peripheral portion of the through-hole. A space between the terminal pin and the through-hole is sealed by solder.

Abstract: A thermoelectric power generation module includes two substrates, a thermoelectric conversion element, a sealing portion sealing peripheral edges of upper and lower surfaces, a first solder between the upper surface and the sealing portion, and a second solder between the lower surface and the sealing portion. At least one of outer and inner edges of the first solder or the sealing portion is deviated from the first solder or the sealing portion. At least one of outer and inner edges of the second solder or the sealing portion is deviated from the second solder or the sealing portion. At least one of the outer and inner edges of the first solder has a fillet shape between the upper surface and the sealing portion. At least one of the outer and inner edges of the second solder has a fillet shape between the lower surface and the sealing portion.

Abstract: A sensor-fitted substrate allowing a sensor-fitted wafer for measuring the temperature or strain to be produced inexpensively, moreover, allowing measurements of the temperature or strain to be carried out with satisfactory accuracy, and a method for producing such a sensor-fitted substrate. An undercoat film is formed on the surface of a substrate, the film being configured, compared to when no undercoat film is formed, to allow the strength of close contact of a dispersed nano-particle ink with the substrate to be increased, the diffusion of the dispersed nano-particle ink into the substrate to be suppressed, and the growth of metal crystal particles contained in the dispersed nano-particle ink to be suppressed. A wiring pattern of the sensor is traced on the surface of the undercoat film of the substrate surface by using the dispersed nano-particle ink, and the dispersed nano-particle ink is baked and metalized.