Patents by Inventor Masakazu Otake

Masakazu Otake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for layered structure breaking strength estimation
    Patent number: 6792812
    Abstract: Method for layered structure breaking strength estimation in which an edge of a cutting blade is inserted into an upper layer of the structure and the cutting blade is moved substantially in parallel with an interface between the upper layer and a lower layer of the structure while automatically controlling a depth of the cutting blade to a depth slightly higher than the interface. A force exerted on the cutting blade substantially in parallel with the interface is measured. An apparatus for performing the method is also disclosed.
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: September 21, 2004
    Assignees: Diapola Wintes Co., Ltd., Mekong Co., Ltd.
    Inventors: Yoshio Kishima, Masakazu Otake
  • Method and apparatus for layered structure breaking strength estimation
    Publication number: 20020095996
    Abstract: The method comprises the steps of inserting an edge of a cutting blade into an upper layer of the structure, moving the cutting blade substantially in parallel with an interface between the upper layer and a lower layer of the structure while a depth of the edge of the cutting blade being controlled to such a depth slightly upper than the interface and a cutting piece remains on the cutting blade, and measuring a force exerted on the cutting blade substantially in parallel with the interface.
    Type: Application
    Filed: December 26, 2001
    Publication date: July 25, 2002
    Inventors: Yoshio Kishima, Masakazu Otake