Patents by Inventor Masakazu Shindome

Masakazu Shindome has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package and semiconductor module
    Publication number: 20060164813
    Abstract: A semiconductor package includes a plate-like semiconductor element having a first power terminal and a control terminal on a main surface, and a second power terminal on a rear surface; a first power electrode plate positioned to face with the main surface of the semiconductor element, and including a first power electrode joined to the first power terminal by soldering; a second power electrode plate positioned to face with the rear surface of the semiconductor element, and including a second power electrode joined to the second power terminal by soldering; and an insulating substrate positioned between the semiconductor element and the first electrode plate, and including a control electrode joined to the control terminal by soldering.
    Type: Application
    Filed: November 30, 2005
    Publication date: July 27, 2006
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Shimpei Yoshioka, Yukihiro Ikeya, Naotake Watanabe, Nobumitsu Tada, Masakazu Shindome