Patents by Inventor Masakazu Sugaya

Masakazu Sugaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7341393
    Abstract: A mechanism for connecting first and second members through a sealing member sandwiched therebetween includes a position adjustment portion which adjusts a position of the first member in a direction substantially perpendicular to a surface of the second member with respect to the sealing member arranged on the second member, a reference portion which is provided to the second member and has a reference surface substantially perpendicular to the surface of the second member, and a pressing portion which presses the first member in a direction substantially parallel to the surface of the second member against the reference surface of the reference portion. A positioning member is provided to the first member and comes into contact with the reference surface of the reference portion, with the positioning member being position-adjustable with respect to a reference position of the first member.
    Type: Grant
    Filed: June 20, 2005
    Date of Patent: March 11, 2008
    Assignees: Canon Kabushiki Kaisha, Hitachi High-Technologies Corp.
    Inventors: Masaki Hosoda, Masato Muraki, Yasuhiro Someda, Mahito Negishi, Koichi Wakizaka, Masakazu Sugaya
  • Publication number: 20060056131
    Abstract: During the writing operation, the wafer potential is dynamically detected and corrected. By doing so, the positional accuracy of the circuit patterns written on a wafer can be improved. After a contact resistance between a wafer and a earth pin is measured, the current flowing from the wafer to the ground potential via the earth pin is measured. Then, based on the measurement result, the potential difference is given between the wafer and the ground potential.
    Type: Application
    Filed: September 9, 2005
    Publication date: March 16, 2006
    Inventors: Sayaka Tanimoto, Yasunari Soda, Masakazu Sugaya, Hiroshi Tooyama, Takeshi Tsutsumi, Yasuhiro Someda
  • Publication number: 20060006342
    Abstract: An assembly having first and second members arranged through a sealing member sandwiched between them is disclosed. The second member has a reference portion having a reference surface. The assembly includes a pressing portion which presses the first member against the reference surface in a direction substantially parallel to a surface of the second member. The second member is fixed to the first member while the first member abuts against the reference surface and the sealing member is compressed between the first and second members.
    Type: Application
    Filed: June 20, 2005
    Publication date: January 12, 2006
    Applicants: Canon Kabushiki Kaisha, Hitachi High-Technologies Corporation
    Inventors: Masaki Hosoda, Masato Muraki, Yasuhiro Someda, Mahito Negishi, Koichi Wakizaka, Masakazu Sugaya
  • Patent number: 6839142
    Abstract: An absolute accuracy in the range from ±2 nm to ±1 nm for a displacement measurement value is provided by a laser interferometer displacement measuring system. A fluctuating error component that appears corresponding to the wave cycle of laser light is detected and subtracted from the measurement value while a stage is moving, thereby providing a high accuracy.
    Type: Grant
    Filed: September 25, 2003
    Date of Patent: January 4, 2005
    Assignee: Hitachi, Ltd.
    Inventors: Fumio Isshiki, Masakazu Sugaya, Tatsundo Suzuki, Masahiro Yamaoka, Sumio Hosaka
  • Patent number: 6717156
    Abstract: There are disclosed a method for fabricating (processing) a micro-sample used for the observation, analysis, and measurement by, for example, a transmission electron microscope (TEM), and an equipment for specimen fabrication (processing) used for carrying out the method. With the method for specimen fabrication (processing) of the present invention, a micro-sample to be separated and extracted from a specimen substrate is sandwiched and held between a plurality of branch beams formed at the tip of a beam. The beam holding the micro-sample is transferred onto a sample holder, and the micro-sample is mounted (firmly held) on the sample holder. After mounting the micro-sample on the sample holder, the beam is detached and separated from the mounted micro-sample. By adopting such a method, it is possible to fabricate a specimen for high reliability observation, analysis, and measurement entailing less contamination, in a shorter time and with efficiency.
    Type: Grant
    Filed: February 21, 2002
    Date of Patent: April 6, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Masakazu Sugaya, Hiroyasu Shichi, Muneyuki Fukuda, Kaoru Umemura, Hidemi Koike
  • Publication number: 20040057055
    Abstract: An absolute accuracy in the range from ±2 nm to ±1 nm for a displacement measurement value is provided by a laser interferometer displacement measuring system. A fluctuating error component that appears corresponding to the wave cycle of laser light is detected and subtracted from the measurement value while a stage is moving, thereby providing a high accuracy.
    Type: Application
    Filed: September 25, 2003
    Publication date: March 25, 2004
    Inventors: Fumio Isshiki, Masakazu Sugaya, Tatsundo Suzuki, Masahiro Yamaoka, Sumio Hosaka
  • Patent number: 6687013
    Abstract: An absolute accuracy in the range from ±2 nm to ±1 nm for a displacement measurement value is provided by a laser interferometer displacement measuring system. A fluctuating error component that appears corresponding to the wave cycle of laser light is detected and subtracted from the measurement value while a stage is moving, thereby providing a high accuracy.
    Type: Grant
    Filed: March 28, 2001
    Date of Patent: February 3, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Fumio Isshiki, Masakazu Sugaya, Tatsundo Suzuki, Masahiro Yamaoka, Sumio Hosaka
  • Patent number: 6518548
    Abstract: So as to provide a substrate temperature control system capable of unifying the temperature of the substrate and capable of shortening the temperature elevation time (temperature lowering time), the substrate temperature control system is equipped with a temperature control plate (heating or cooling plate) having a plurality of projections on the surface and serving to set the temperature of the substrate, and a chuck mechanism to fix the substrate in contact to a plurality of the projections by chucking the substrate toward the direction of the temperature control plate.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: February 11, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Masakazu Sugaya, Fumio Murai, Yutaka Kaneko, Masafumi Kanetomo, Shigeki Hirasawa, Tomoji Watanabe, Tatuharu Yamamoto, Katsuhiro Kuroda
  • Publication number: 20020166976
    Abstract: There are disclosed a method for fabricating (processing) a micro-sample used for the observation, analysis, and measurement by, for example, a transmission electron microscope (TEM), and an equipment for specimen fabrication (processing) used for carrying out the method. With the method for specimen fabrication (processing) of the present invention, a micro-sample to be separated and extracted from a specimen substrate is sandwiched and held between a plurality of branch beams formed at the tip of a beam. The beam holding the micro-sample is transferred onto a sample holder, and the micro-sample is mounted (firmly held) on the sample holder. After mounting the micro-sample on the sample holder, the beam is detached and separated from the mounted micro-sample.
    Type: Application
    Filed: February 21, 2002
    Publication date: November 14, 2002
    Inventors: Masakazu Sugaya, Hiroyasu Shichi, Muneyuki Fukuda, Kaoru Umemura, Hidemi Koike
  • Publication number: 20020113056
    Abstract: So as to provide a substrate temperature control system capable of unifying the temperature of the substrate and capable of shortening the temperature elevation time (temperature lowering time), the substrate temperature control system is equipped with a temperature control plate (heating or cooling plate) having a plurality of projections on the surface and serving to set the temperature of the substrate, and a chuck mechanism to fix the substrate in contact to a plurality of the projections by chucking the substrate toward the direction of the temperature control plate.
    Type: Application
    Filed: February 28, 2002
    Publication date: August 22, 2002
    Applicant: Hitachi, Ltd.
    Inventors: Masakazu Sugaya, Fumio Murai, Yutaka Kaneko, Masafumi Kanetomo, Shigeki Hirasawa, Tomoji Watanabe, Tatuharu Yamamoto, Katsuhiro Kuroda
  • Patent number: 6394797
    Abstract: To provide a substrate temperature control system capable of unifying the temperature of the substrate and capable of shortening the temperature elevation time (temperature lowering time), the substrate temperature control system is equipped with a temperature control plate (heating or cooling plate) having a plurality of projections on its surface and acting to set the temperature of the substrate. A chuck mechanism is provided to fix the substrate in contact with a plurality of the projections by chucking the substrate toward the temperature control plate.
    Type: Grant
    Filed: March 16, 2000
    Date of Patent: May 28, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Masakazu Sugaya, Fumio Murai, Yutaka Kaneko, Masafumi Kanetomo, Shigeki Hirasawa, Tomoji Watanabe, Tatuharu Yamamoto, Katsuhiro Kuroda
  • Publication number: 20020048026
    Abstract: An absolute accuracy in the range from ±2 nm to ±1 nm for a displacement measurement value is provided by a laser interferometer displacement measuring system. A fluctuating error component that appears corresponding to the wave cycle of laser light is detected and subtracted from the measurement value while a stage is moving, thereby providing a high accuracy.
    Type: Application
    Filed: March 28, 2001
    Publication date: April 25, 2002
    Inventors: Fumio Isshiki, Masakazu Sugaya, Tatsundo Suzuki, Masahiro Yomaoka, Sumio Hosaka