Abstract: An embodiment of a printed circuit board includes: a mounting board with a solder resist on a front surface thereof; a component mounted on the mounting board; an underfill material that fixes the component to the mounting board; and resin materials dotted between the solder resist and the underfill material.

Abstract: An embodiment of a printed circuit board includes: a mounting board with a solder resist on a front surface thereof; a component mounted on the mounting board; an underfill material that fixes the component to the mounting board; and resin materials dotted between the solder resist and the underfill material.

Abstract: A method and an apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).

Abstract: A printed wiring board supports an electronic component thereon. The printed wiring board includes an opening which is recessed from a surface of the printed wiring board. The opening has a dimension which houses the electronic component therein. A plurality of pads is disposed on a bottom surface of the opening. The plurality of pads has a skew arrangement in a grid pattern with respect to inner edges of the opening.

Abstract: A method and an apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).

Abstract: A method and a apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).

Abstract: A substrate unit includes an electronic component having a plurality of electrodes arranged in a given shape, a circuit substrate having a first face where the electronic component is mounted and the electrodes are jointed and a second face underside of the first face, and a resin-coated portion formed on the second face according to a projected area of the second face to which the given shape is projected.

Abstract: A mounting substrate includes a land connected to an electrode of an electronic part by a melt-capable connection member; and a connection member flow-generation part configured to generate a flow at the molten melt-capable connection member.

Abstract: A method and a apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).

Abstract: A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20–60 ?m. Each of the lead-free solder particles can contain Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

Abstract: A mounting substrate includes a land connected to an electrode of an electronic part by a melt-capable connection member; and a connection member flow-generation part configured to generate a flow at the molten melt-capable connection member.

Abstract: A solder alloy having a solderability comparable to that of a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and a soldered bond using the same. A solder alloy consisting of Zn: 4.0-10.0 wt %, In: 1.0 to 15.0 wt %, Al: 0.0020 to 0.0100 wt %, and the balance of Sn and unavoidable impurities. A soldered bond of an electric or electronic device composed of the above solder alloy.

Abstract: A semiconductor device includes a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.

Abstract: A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

Abstract: A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20-60 &mgr;m. Each of the lead-free solder particles can contain Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

Abstract: A solder alloy having a solderability comparable to that of a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and a soldered bond using the same.

Abstract: A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

Abstract: A solder paste, includes a flux, a solder alloy particle scattered or mixed in the flux and including Sn and Zn as composition elements, and a metal particle scattered or mixed in the flux and including an element in the IB group in the periodic table as a composition element.

Abstract: A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

Abstract: A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.