Abstract: A small and thin IC socket allowing BGA/LGA IC package to be connected to a printed circuit board is disclosed. The IC socket includes a socket body having a plurality of main through-holes formed between the top and bottom surfaces thereof, corresponding to respective ones of the terminals of the IC. In each of the main through-holes, a pair of an upper contact member and a lower contact member which are accommodated and are electrically connected to each other. At least the upper contact member is slidably accommodated and biased to protrude from the top surface of the body. An external connection printed circuit board is fixed to the top surface of the socket body and has a plurality of upper plated through-holes corresponding to respective ones of the main through-holes. The upper contact member protrudes through a corresponding one of the upper through-holes and is electrically connected to a corresponding one of wiring conductors.

Abstract: A multiple-pin terminal adapter comprising a substrate and a multiplicity of electrical contact pins extending from above and below the substrate for connection with printed circuit boards. A first group of contact pins extend downwardly for connection with the underlying printed circuit board, while a second group of contact pins extend upwardly out of axial alignment with the first group to assume a generally meander or otherwise random formation whereby adjacent contact pins in the second group are spaced a sufficient distance apart from one another to facilitate access for solder connection. A relay socket means is also provided for use in combination with the terminal adapter to provide easy access for connection to printed circuit boards packed with high density electrical components.