Patents by Inventor Masaki Chiba

Masaki Chiba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220377944
    Abstract: The present invention provides an attachment for a server rack cooling system having at least one heat exchange condenser, the attachment includes: a pipe extension configured to connect to a portion of the server rack cooling system at which air and refrigerant are able to be transferred into the attachment from the at least one heat exchange condenser; a valve on the pipe extension configured to allow exhaust to the outside through the pipe extension at an open position and to block exhaust to the outside at a closed position; and an sensor disposed at a position inside of the pipe extension between the at least one heat exchange condenser and the valve and configured to provide a detection signal determined by a presence of fluid at the position of the sensor; wherein, the valve is opened and closed based on the detection signal from the sensor.
    Type: Application
    Filed: October 2, 2019
    Publication date: November 24, 2022
    Applicant: NEC Corporation
    Inventors: Nirmal Singh RAJPUT, Masaki CHIBA, Mahiro HACHIYA, Takafumi NATSUMEDA, Yoshinori MIYAMOTO, Minoru YOSHIKAWA
  • Publication number: 20220341669
    Abstract: A heat-radiation apparatus includes a housing and a plurality of heat-radiation modules which are aligned in a vertically-slanted manner with a predetermined inclination angle to a vertical line in the housing. A plurality of heat-radiation modules includes a plurality of heat exchangers which is aligned together in parallel and equipped with a plurality of fans to parallelize axial lines thereof with each other. In a manufacturing method of the heat-radiation apparatus, the number of heat-radiation modules is adjusted according to a radiation amount which is determined in advance.
    Type: Application
    Filed: April 21, 2022
    Publication date: October 27, 2022
    Applicant: NEC Corporation
    Inventors: Mahiro HACHIYA, Minoru YOSHIKAWA, Masaki CHIBA
  • Patent number: 11465503
    Abstract: Disclosed is an interior structure (1, 100, 200) for a vehicle, which comprises a vehicle interior structural component (12, 114, 216) arranged within a field-of-view of a driver, wherein at least one outline (12a, 114a, 216a) of the vehicle interior structural component is approximately coincident with an axis line (Ab, Af, Ad) oriented toward a vehicle interior of the vehicle, among a plurality of axis lines radially extending from a vanishing point (P) defined when the driver visually views forwardly while being seated in a driver seat.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: October 11, 2022
    Assignee: MAZDA MOTOR CORPORATION
    Inventors: Seishi Nakamura, Tomonori Ohtsubo, Taro Oike, Masaki Chiba
  • Publication number: 20220279682
    Abstract: A cooling system includes: a local cooler that is positioned near a heat source and evaporates a liquid-phase refrigerant by receiving heat from the heat source; a turbo compressor that compresses a gas-phase refrigerant that absorbed the heat in the local cooler; an outdoor unit that condenses the gas-phase refrigerant supplied from the turbo compressor by heat dissipation; and an expansion valve that depressurizes the refrigerant supplied from the outdoor unit and sends the refrigerant to the local cooler. The refrigerant is a low-pressure refrigerant having a condensing pressure lower than a predetermined value.
    Type: Application
    Filed: July 9, 2019
    Publication date: September 1, 2022
    Applicant: NEC Corporation
    Inventors: Takafumi NATSUMEDA, Minoru YOSHIKAWA, Masaki CHIBA
  • Patent number: 11428442
    Abstract: A cooling device includes a first evaporation unit, a second evaporation unit, a first condensation unit, a second condensation unit, common piping, a compressor, an expansion valve, a first valve, and a second valve. The common piping combines liquid-phase refrigerant flowing from the first condensation unit and liquid-phase refrigerant flowing from the second condensation unit. The first valve adjusts the liquid-phase refrigerant amount flowing into the first evaporation unit. The second valve adjusts the liquid-phase refrigerant amount flowing into the second evaporation unit. In addition, the pressure inside the common pipe is greater than the respective pressures inside the first evaporation unit and the second evaporation unit.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: August 30, 2022
    Assignee: NEC CORPORATION
    Inventors: Hisato Sakuma, Koichi Todoroki, Masaki Chiba, Takafumi Natsumeda, Minoru Yoshikawa
  • Publication number: 20220192057
    Abstract: A local cooler includes: a housing formed into a box shape; a heat exchanger provided along a slope extending upward to a rear portion from a lower position located on the front side of the housing; a first intake/exhaust port provided on a front surface of the housing; a second intake/exhaust port provided on a bottom surface of the housing; third intake/exhaust ports provided at a plurality of locations among side surfaces, upper surface and rear surface of the housing; and a closing plate capable of selectively shielding these intake/exhaust ports.
    Type: Application
    Filed: April 13, 2020
    Publication date: June 16, 2022
    Applicant: NEC Corporation
    Inventors: Koichi TODOROKI, Minoru YOSHIKAWA, Kunihiko ISHIHARA, Masaki CHIBA, Yoshinori MIYAMOTO, Takafumi NATSUMEDA, Nirmal Singh RAJPUT
  • Patent number: 11363744
    Abstract: When an enclosed space is formed, by at least one of surfaces forming an exterior shape of a shielding member and an intake or exhaust surface among surfaces forming an exterior shape of heat-generating housings, in such a way that a taken-in airflow and an exhausted airflow of the heat-generating housings installed in at least two rows can be separated or substantially separated, a cooling system includes: a duct formed to be able to separate or substantially separate a first airflow and a second airflow being intake/exhaust of a specific heat-generating housing among the heat-generating housings, and heat-generating housings other than the specific heat-generating housing, respectively; and a cooling enhancement unit enhancing cooling for the specific heat-generating housing by acting on the first airflow, thereby avoiding occurrence of a hot spot due to a high-heat-generating housing, in a system building an air-conditioning environment such as aisle capping.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: June 14, 2022
    Assignee: NEC CORPORATION
    Inventors: Minoru Yoshikawa, Hisato Sakuma, Yoshinori Miyamoto, Masaki Chiba
  • Publication number: 20220154988
    Abstract: A liquid separator including a cylindrical closed container in which a refrigerant is stored, a refrigerant inflow pipe that allows the refrigerant to flow into the closed container, and a refrigerant outflow pipe that allows the vapor-phase refrigerant in a space inside the closed container to flow out, in which the refrigerant inflow pipe and the refrigerant outflow pipe are each connected from the upper part of the closed container toward the inside thereof, and the closed container has a short cylindrical shape in which the height is smaller relative to the diameter.
    Type: Application
    Filed: March 6, 2020
    Publication date: May 19, 2022
    Applicant: NEC Corporation
    Inventors: Takafumi NATSUMEDA, Masaki CHIBA, Koichi TODOROKI, Minoru YOSHIKAWA
  • Publication number: 20220146167
    Abstract: A cooling apparatus includes a heat receiver that evaporates a low pressure heat transfer medium; a compressor that compresses the evaporated heat transfer medium in a gas phase state, a condenser that condenses the compressed heat transfer medium, a receiver tank that receives and stores at least one of the heat transfer medium from any place in a flow path of the heat transfer medium in the gas phase state that returns the heat transfer medium to the heat receiver and the condensed heat transfer medium in a liquid phase state, an air storage tank that introduces and stores air separated from the heat transfer medium in the receiver tank, and a liquid level controller that controls a liquid level in the receiver tank such that the heat transfer medium in the liquid phase state is stored in the receiver tank at a predetermined liquid level height.
    Type: Application
    Filed: November 8, 2021
    Publication date: May 12, 2022
    Applicant: NEC Corporation
    Inventors: Yoshinori MIYAMOTO, Minoru YOSHIKAWA, Masaki CHIBA
  • Patent number: 11262136
    Abstract: Provided are a phase change cooler with enhanced cooling performance and enhanced pressure resistance performance, and an electronic device using such a phase change cooler. The phase change cooler includes a heat receiving unit, a heat dissipating unit, a vapor pipe and a liquid pipe that interconnect the heat receiving unit and the heat dissipating unit to form a loop, and refrigerant encapsulated inside the phase change cooler. The heat receiving unit has an approximately semicircular cross section, and the vapor pipe is coupled to an inclined face of the heat receiving unit.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: March 1, 2022
    Assignee: NEC CORPORATION
    Inventors: Mahiro Hachiya, Masaki Chiba
  • Publication number: 20220049856
    Abstract: An air conditioner includes: a turbo compressor that compresses a heat medium; a heat exchanger that exchanges heat of the heat medium supplied from the turbo compressor with an atmosphere; and a supply flow path and a discharge flow path that connect the turbo compressor and the heat exchanger. At least one of the supply flow path and the discharge flow path includes piping, and the piping includes a gas barrier layer that covers a surface of a synthetic resin.
    Type: Application
    Filed: August 12, 2021
    Publication date: February 17, 2022
    Applicant: NEC Corporation
    Inventors: Masaki CHIBA, Kunihko ISHIHARA, Minoru YOSHIKAWA, Junichi MIYAMOTO, Yoshinori MIYAMOTO
  • Publication number: 20220049880
    Abstract: A heating medium compression apparatus includes: first and second compressors compressing a heating medium; suction side and discharge side pipings connecting the first and second compressors to a heat exchanger; a connection piping connecting a discharge side of the first compressor and a suction side of the second compressor in series; and a control unit controlling a flow rate of the heating medium flowing in the suction side piping, the discharge side piping, and the connection piping. The control unit alternatively connects the first or second compressor to the suction side and discharge side pipings, or connects the first and second compressors in series between the suction side and discharge side pipings and performs control such that the flow rate of the heating medium suctioned into the second compressor connected in series becomes higher than that of the heating medium discharged from the first compressor.
    Type: Application
    Filed: August 10, 2021
    Publication date: February 17, 2022
    Applicant: NEC Corporation
    Inventors: Masaki CHIBA, Minoru Yoshikawa, Yoshinori Miyamoto
  • Publication number: 20220053670
    Abstract: A cooling device includes: a duct that guides air that has absorbed heat generated inside a cooling target and has been discharged, to the cooling target; a cooler that is provided in the duct and cools the air flowing inside the duct; and an adjusting mechanism that is located on a downstream side of the cooler, adjusts an amount of the air discharged from the duct into a room where the cooling target is installed.
    Type: Application
    Filed: August 10, 2021
    Publication date: February 17, 2022
    Applicant: NEC Corporation
    Inventors: Kenji KOBAYASHI, Koichi TODOROKI, Nirmal Singh RAJPUT, Yoshinori MIYAMOTO, Masaki CHIBA, Minoru YOSHIKAWA
  • Publication number: 20210368648
    Abstract: To provide a cooling device capable of cooling a heat-generating body using simple configuration, the cooling device comprises two evaporators, two condensers, a compressor and an expansion valve, and is configured so that any one among a first flow path setting, a second flow path setting, a third flow path setting, and a fourth flow path setting can be selected.
    Type: Application
    Filed: January 21, 2019
    Publication date: November 25, 2021
    Applicant: NEC Corporation
    Inventors: Masaki CHIBA, Minoru YOSHIKAWA, Hisato SAKUMA, Takafumi NATSUMEDA
  • Patent number: 11180848
    Abstract: A plasma atomic layer deposition apparatus includes: a source gas supply port functioning also as a cleaning gas supply port provided on a first side wall of a film-forming container; and a source gas exhaust port functioning also as a cleaning gas exhaust port provided on a second side wall opposed to the first side wall of the film-forming container.
    Type: Grant
    Filed: August 4, 2018
    Date of Patent: November 23, 2021
    Assignee: THE JAPAN STEEL WORKS, LTD.
    Inventors: Masamitsu Toramaru, Keisuke Washio, Masaki Chiba, Masao Nakata
  • Patent number: 11047627
    Abstract: An evaporator includes: a first surface which conducts heat; a heat medium in the evaporator, which vaporizes as a result of the heat absorbed; a condenser which liquefies the heat medium in a vaporized state; a vapour pipe which guides the heat medium in the vaporized state from the evaporator to the condenser; and a liquid pipe which guides the heat medium in a liquefied state from the condenser to the evaporator. A first opening of the vapour pipe and a second opening of the liquid pipe are disposed in different positions from each other in a first direction, and are disposed so as to open into a heat medium accommodation space inside the evaporator at different positions from each other in a second direction, and which is different to the first direction, and also at different positions from each other in a third direction which intersects the first surface.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: June 29, 2021
    Assignee: NEC CORPORATION
    Inventors: Masaki Chiba, Mahiro Hachiya, Minoru Yoshikawa
  • Patent number: 10988841
    Abstract: In order to suppress a film from being formed in a gap between a mask and a substrate, a technology of improving adhesion between the mask and the substrate is provided. A film-forming method includes the step of suspending a mask MK by a suspension portion HU in a state in which the suspension portion HU is supported by a supporting portion SU and the step of bringing the mask MK suspended by the suspension portion HU into contact with a glass substrate GS in the state in which the suspension portion HU is supported by the supporting portion SU.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: April 27, 2021
    Assignee: THE JAPAN STEEL WORKS, LTD.
    Inventors: Keisuke Washio, Masaki Chiba, Masao Nakata
  • Publication number: 20210092876
    Abstract: The present invention provides a local air conditioner. In a local air conditioner system provided with a plurality of local air conditioners, an increase in the number of local air conditioners is problematic. Thus, the local air conditioner of the present invention comprising: a heat exchanger; a first main flow pipe; a second main flow pipe; a first branch pipe that connects the heat exchanger and the first main flow pipe; and a second branch pipe that connects the heat exchanger and the second main flow pipe, wherein the first main flow pipe is provided with a first connection structure on both end portions and the second main flow pipe is provided with a second connection structure on both end portions.
    Type: Application
    Filed: December 17, 2018
    Publication date: March 25, 2021
    Applicant: NEC Corporation
    Inventors: Koichi TODOROKI, Minoru YOSHIKAWA, Kunihiko ISHIHARA, Masaki CHIBA
  • Publication number: 20210031631
    Abstract: Disclosed is an interior structure (1, 100, 200) for a vehicle, which comprises a vehicle interior structural component (12, 114, 216) arranged within a field-of-view of a driver, wherein at least one outline (12a, 114a, 216a) of the vehicle interior structural component is approximately coincident with an axis line (Ab, Af, Ad) oriented toward a vehicle interior of the vehicle, among a plurality of axis lines radially extending from a vanishing point (P) defined when the driver visually views forwardly while being seated in a driver seat.
    Type: Application
    Filed: August 17, 2018
    Publication date: February 4, 2021
    Applicant: MAZDA MOTOR CORPORATION
    Inventors: Seishi NAKAMURA, Tomonori OHTSUBO, Taro OIKE, Masaki CHIBA
  • Publication number: 20210010763
    Abstract: A heat exchanger has a structure in which a heat exchanger main body through which coolant flows is obliquely installed in a box-shaped enclosure, the heat exchanger main body is constituted by a header pipe and a plurality of heat transfer pipes connected to the header pipe and disposed at predetermined intervals along a surface of a part of the header pipe, the header pipe has an area adjacent to an inner surface of the enclosure, and a seal section is provided between the inner surface of the enclosure and the area of the header pipe adjacent to the enclosure.
    Type: Application
    Filed: July 8, 2020
    Publication date: January 14, 2021
    Applicant: NEC Corporation
    Inventors: Koichi TODOROKI, Minoru YOSHIKAWA, Masaki CHIBA