Patents by Inventor Masaki Endou

Masaki Endou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
    Publication number: 20130298398
    Abstract: The invention relates to a photosensitive resin composition comprising a binder polymer having a (meth)acrylic acid-based structural unit, with a dispersity (weight-average molecular weight/number-average molecular weight) of no greater than 1.6, a photopolymerizable compound, a photopolymerization initiator and a sensitizing dye.
    Type: Application
    Filed: November 15, 2011
    Publication date: November 14, 2013
    Inventors: Masahiro Miyasaka, Masaki Endou, Masataka Kushida, Yukiko Muramatsu, Makoto Kaji
  • Photosensitive resin composition, photosensitive element, production method of resist pattern and production method for printed circuit board
    Patent number: 7517636
    Abstract: A photosensitive resin composition is here disclosed which satisfies the following (1) and (2): (1) when a 1.0 wt % aqueous sodium carbonate solution is sprayed by a spray on a layer of the photosensitive resin composition having a thickness of 37 to 42 ?m under the following conditions, the photosensitive resin composition layer being able to be removed within 20 seconds, the above conditions being that an internal diameter of a nozzle of the spray is 1.2 mm, a spraying pressure is 0.05 MPa, and a distance between a point of the spray nozzle which is closest to the photosensitive resin composition layer and the photosensitive resin composition layer is 50 mm; and (2) when the 1.
    Type: Grant
    Filed: May 29, 2001
    Date of Patent: April 14, 2009
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Takahiro Fukaya, Masaki Endou, Takuji Abe, Katsutoshi Itagaki
  • Photosensitive resin composition, photosensitive element employing it, resist pattern forming method, and printed wiring board fabrication method
    Patent number: 7067228
    Abstract: A photosensitive resin composition which comprises (A) a binder polymer, (B) a photopolymerizing compound having at least one ethylenic unsaturated bond in the molecule and (C) a photopolymerization initiator, wherein the binder polymer as component (A) comprises two or more binder polymers and/or has a dispersity of 2.5-6.0, and wherein the photopolymerizing compound as component (B) has in the molecule at least one ethylene glycol chain and at least one C3-C6 alkylene glycol chain.
    Type: Grant
    Filed: June 22, 2001
    Date of Patent: June 27, 2006
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Noriyo Kimura, Tomoaki Aoki, Kenji Kamio, Masaki Endou
  • Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board
    Publication number: 20040101777
    Abstract: A photosensitive resin composition which comprises (A) a binder polymer, (B) a photopolymerizing compound having at least one ethylenic unsaturated bond in the molecule and (C) a photopolymerization initiator, wherein the binder polymer as component (A) comprises two or more binder polymers and/or has a dispersity of 2.5-6.0, and wherein the photopolymerizing compound as component (B) has in the molecule at least one ethylene glycol chain and at least one C3-C6 alkylene glycol chain.
    Type: Application
    Filed: July 22, 2003
    Publication date: May 27, 2004
    Inventors: Noriyo Kimura, Tomoaki Aoki, Kenji Kamio, Masaki Endou
  • Photosensitive resin composition, photosensitive element, production method of resist pattern and production method for printed circuit board
    Publication number: 20030186166
    Abstract: A photosensitive resin composition is here disclosed which satisfies the following (1) and (2):
    Type: Application
    Filed: May 28, 2003
    Publication date: October 2, 2003
    Inventors: Takahiro Fukaya, Masaki Endou, Takuji Abe, Katsutoshi Itagaki