Patents by Inventor Masaki Fujihira

Masaki Fujihira has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for the production of electronic parts
    Patent number: 6337288
    Abstract: A method of supporting a semiconductor substrate according to the present invention can be applied to the step of processing the semiconductor substrate at a high temperature of 350° C. or higher, and there is provided a process for the production of electronic parts, comprising the steps of forming semiconductor circuits on one surface (surface A) of a semiconductor substrate (SEC) having a thickness of at least 0.2 mm, supporting the semiconductor substrate on a supporting substrate (BP) by bonding (AS) of said surface A to the supporting substrate (BP), grinding and polishing the exposed other surface (surface B) of the semiconductor substrate (SEC) by a physical method, a chemical method or a method of combination of these methods, to decrease the thickness of the semiconductor substrate (SEC) to less than 0.
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: January 8, 2002
    Assignee: Mitsubishi Gas Chemical Co., Inc.
    Inventors: Kazuyuki Ohya, Masaki Fujihira, Kazuhiro Otsu, Hideki Kobayashi