Abstract: A wheel loader includes a lift arm, bucket, a lift cylinder that rotates the lift arm, a hydraulic force detection unit that detects a hydraulic force of the lift cylinder, an arm angle detection unit that detects a rotation angle of the lift arm, and a controller that calculates a weight of the load. A hydraulic force measurement unit measures a hydraulic force with the rotation angle of the lift arm within a predetermined measurement angle range; and a hydraulic-force-change-rate calculation unit calculates a change rate of the hydraulic force with respect to the rotation angle of the lift arm, and then calculates a new hydraulic force change rate within the measurement angle range. The controller corrects an error of the weight of the load occurring due to the inclination angle of the body on the basis of the new hydraulic force change rate calculated by the hydraulic-force-change-rate calculation unit.

Abstract: According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.

Abstract: According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.

Abstract: According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.

Abstract: A diode exhibiting a high reverse breakdown voltage is manufactured by employing a flame-resisting epoxy resin, the extract of which when extracted under predetermined conditions exhibits electrical conductivity of 250 ?S/cm or lower. According to the invention, sealant resins for high-voltage diodes with excellent moisture resistance are selected by employing the electrical resistance value found to be appropriate for a reference value not by assembling a high-voltage diode, but rather by conducting the predetermined humidity resistance test on the sealant resins. The sealant resin selection according to the invention facilitates reducing the resin costs, and, therefore, manufacturing high-voltage diodes exhibiting excellent humidity resistance with low manufacturing costs.