Patents by Inventor Masaki Iwata
Masaki Iwata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11979122Abstract: An isolation amplifier of an embodiment includes: a primary circuit including an encoder configured to encode an input signal and output the encoded input signal and an anomaly detection circuit configured to detect anomaly having occurred to the input signal and generate a detection signal; an isolation unit configured to insulate the primary circuit from a secondary circuit; an output circuit configured to generate an output signal corresponding to the input signal; and an anomaly-input sensing-output circuit configured to generate an output signal from the secondary circuit by changing the output signal from the output circuit based on the detection signal.Type: GrantFiled: September 7, 2021Date of Patent: May 7, 2024Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATIONInventors: Makoto Arai, Masaki Nishikawa, Shoji Ootaka, Tadashi Arai, Manabu Yamada, Shigeyasu Iwata, Takeshi Murasaki
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Patent number: 9237675Abstract: Cooling is performed efficiently by constituting: a fan which is provided with an outlet; a heatsink which is provided with an inlet with a larger size than that of the outlet of the fan in a height direction and through the interior of which an airflow generated by the fan passes; and a guide member which is disposed between the fan and the heatsink and which is configured to guide the airflow to an outer surface of the heatsink.Type: GrantFiled: June 27, 2013Date of Patent: January 12, 2016Assignee: FUJITSU LIMITEDInventor: Masaki Iwata
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Publication number: 20140268557Abstract: An information processing apparatus includes a body, a frame, and a hinge that allows the frame to be attached to a side face of the body in such a manner as to be rotatable and stoppable at any angle.Type: ApplicationFiled: March 12, 2014Publication date: September 18, 2014Applicant: FUJITSU LIMITEDInventors: Masaki Iwata, Masuo Ohnishi
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Publication number: 20130286590Abstract: Cooling is performed efficiently by constituting: a fan which is provided with an outlet; a heatsink which is provided with an inlet with a larger size than that of the outlet of the fan in a height direction and through the interior of which an airflow generated by the fan passes; and a guide member which is disposed between the fan and the heatsink and which is configured to guide the airflow to an outer surface of the heatsink.Type: ApplicationFiled: June 27, 2013Publication date: October 31, 2013Inventor: Masaki IWATA
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Patent number: 8303870Abstract: A tire forming method is disclosed in which letters and lines having different colors are formed in a side wall portion of the tire.Type: GrantFiled: May 25, 2012Date of Patent: November 6, 2012Assignee: Toyo Tire & Rubber Co.,Ltd.Inventors: Masaki Iwata, Shigemi Ohsuna
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Publication number: 20120241081Abstract: A tire forming method is disclosed in which letters and lines having different colors are formed in a side wall portion of the tire.Type: ApplicationFiled: May 25, 2012Publication date: September 27, 2012Applicant: TOYO TIRE & RUBBER CO., LTD.Inventors: Masaki Iwata, Shigemi Ohsuna
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Patent number: 8215938Abstract: A tire forming mold is disclosed in which letters and lines having different colors are formed in a side wall portion of the tire.Type: GrantFiled: August 20, 2010Date of Patent: July 10, 2012Assignee: Toyo Tire & Rubber Co., Ltd.Inventors: Masaki Iwata, Shigemi Ohsuna
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Publication number: 20120091572Abstract: The semiconductor package includes a package wiring board having an element housing recessed portion on its top surface to house a semiconductor element; multiple side electrodes which are arranged on the outer side surface of the package wiring board and soldered to multiple motherboard electrodes arranged on a motherboard; a semiconductor element fixed onto the bottom surface of the element housing recessed portion; and an element electrode arranged on the bottom of the element housing recessed portion and electrically connected to the semiconductor element and the side electrodes. The package wiring board has a multilayered structure in which woven fabric and a resin adhesive layer are alternately laminated, and the resin adhesive layer is formed of a resin adhesive that contains inorganic filler particles.Type: ApplicationFiled: June 22, 2009Publication date: April 19, 2012Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Tsuneo Hamaguchi, Ikio Sugiura, Hiroo Sakamoto, Masaki Iwata, Takashi Shirase, Takashi Okamuro
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Patent number: 8081433Abstract: An electronic apparatus includes a keyboard unit that has an upper surface on which a plurality of keys are provided, and one side and a different side each of which has an attachment section, the different side facing the one side, a fixing section that fixes the keyboard unit in cooperation with the attachment sections of the keyboard unit, and a mounting section on which the keyboard unit is mounted in a state in which the keyboard is upwardly curved with respect to a predetermined reference surface when the keyboard unit is fixed by the attachment sections of the keyboard unit and the fixing section.Type: GrantFiled: February 24, 2009Date of Patent: December 20, 2011Assignee: Fujitsu LimitedInventor: Masaki Iwata
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Patent number: 7957125Abstract: An assembly includes a first housing, a second housing that houses a plate member, and a connecting section that connects the first housing to the second housing in such a way that the first housing is openable and closable with respect to the second housing on one side of the second housing. The connecting section includes a first fastening section fastened to the plate member.Type: GrantFiled: February 24, 2009Date of Patent: June 7, 2011Assignee: Fujitsu LimitedInventor: Masaki Iwata
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Publication number: 20110048613Abstract: The invention provides a tire forming mold and a tire forming method such that letters and lines of a formed tire can be clearly displayed in the case of forming the tire in which the letters and the lines having different colors are formed in a side wall portion.Type: ApplicationFiled: August 20, 2010Publication date: March 3, 2011Applicant: Toyo Tire & Rubber Co., Ltd.Inventors: Masaki Iwata, Shigemi Ohsuna
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Patent number: 7817409Abstract: An electronic apparatus includes: a case having a first cover and a second cover, which form an internal space of the case in combination; a circuit substrate loaded with an electronic circuit and disposed in the internal space of the case; and a board member extending between the circuit substrate and the second cover, of the internal space of the case. The board member has: a first fixing section that fixes the circuit substrate between the first cover and the board member; and a second fixing section that is formed at a position different from the first fixing section and fixes the board member on the second cover.Type: GrantFiled: April 21, 2008Date of Patent: October 19, 2010Assignee: Fujitsu LimitedInventors: Masaki Iwata, Tadanori Tachikawa
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Patent number: 7746628Abstract: The present invention relates to an electronic device having two casings connected with each other through a hinge member such that the casings can open and close with respect to each other. The electronic device includes a hinge member suitable for mounting a large size display panel. The second casing includes a back face and a sidewall having a projection which projects inward between the back face and the sidewall, the hinge member includes a first fixing member fixed to the first casing and a second fixing member fixed to the second casing, and one end of the second fixing member is engaged with and fixed to the second casing in a state where the one end enters a gap between the back face and the projection.Type: GrantFiled: July 18, 2008Date of Patent: June 29, 2010Assignee: Fujitsu LimitedInventors: Masaya Takayanagi, Masaki Iwata
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Publication number: 20090323268Abstract: An electronic apparatus includes a keyboard unit that has an upper surface on which a plurality of keys are provided, and one side and a different side each of which has an attachment section, the different side facing the one side, a fixing section that fixes the keyboard unit in cooperation with the attachment sections of the keyboard unit, and a mounting section on which the keyboard unit is mounted in a state in which the keyboard is upwardly curved with respect to a predetermined reference surface when the keyboard unit is fixed by the attachment sections of the keyboard unit and the fixing section.Type: ApplicationFiled: February 24, 2009Publication date: December 31, 2009Applicant: FUJITSU LIMITEDInventor: Masaki Iwata
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Publication number: 20090323269Abstract: An assembly includes a first housing, a second housing that houses a plate member, and a connecting section that connects the first housing to the second housing in such a way that the first housing is openable and closable with respect to the second housing on one side of the second housing. The connecting section includes a first fastening section fastened to the plate member.Type: ApplicationFiled: February 24, 2009Publication date: December 31, 2009Applicant: FUJITSU LIMITEDInventor: Masaki Iwata
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Publication number: 20090059494Abstract: The present invention relates to an electronic device having two casings connected with each other through a hinge member such that the casings can open and close with respect to each other. The electronic device includes a hinge member suitable for mounting a large size display panel. The second casing includes a back face and a sidewall having a projection which projects inward between the back face and the sidewall, the hinge member includes a first fixing member fixed to the first casing and a second fixing member fixed to the second casing, and one end of the second fixing member is engaged with and fixed to the second casing in a state where the one end enters a gap between the back face and the projection.Type: ApplicationFiled: July 18, 2008Publication date: March 5, 2009Applicant: FUJITSU LIMITEDInventors: Masaya Takayanagi, Masaki Iwata
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Publication number: 20080259539Abstract: An electronic apparatus includes: a case having a first cover and a second cover, which form an internal space of the case in combination; a circuit substrate loaded with an electronic circuit and disposed in the internal space of the case; and a board member extending between the circuit substrate and the second cover, of the internal space of the case. The board member has: a first fixing section that fixes the circuit substrate between the first cover and the board member; and a second fixing section that is formed at a position different from the first fixing section and fixes the board member on the second cover.Type: ApplicationFiled: April 21, 2008Publication date: October 23, 2008Applicant: FUJITSU LIMITEDInventors: Masaki Iwata, Tadanori Tachikawa
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Publication number: 20080259565Abstract: A heat radiator has two or more heat radiation fins arranged at intervals, and conducts heat from the heat radiation fins to air that flows in space of the heat radiation fins. The heat radiation fins have notches formed such that central parts of edges of the heat radiation fins in at least one of the air inflow side and the air outflow side of the heat radiation fins are cut alternately or on a circulating basis in an array direction of the heat radiation fins.Type: ApplicationFiled: April 21, 2008Publication date: October 23, 2008Applicant: FUJITSU LIMITEDInventors: Masaki Iwata, Tadanori Tachikawa
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Patent number: 7405933Abstract: A cooling device for cooling electronic components mounted on a substrate, comprising a radiating member having a pair of mounting plates formed of a conductive sheet metal member in generally channel shape in cross section and positioned parallel with each other and a connection plate for connecting the pair of mounting plates to each other and a cooling fan mounted on one of the mounting plates of the radiating member, wherein the other of the mounting plates of the radiating member is formed so as to be mountable on the substrate in an abutting state thereof on the electronic components mounted on the substrate.Type: GrantFiled: November 4, 2005Date of Patent: July 29, 2008Assignee: Fujitsu LimitedInventors: Sonomasa Kobayashi, Kaigo Tanaka, Masaki Iwata
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Publication number: 20060133048Abstract: A cooling device for cooling electronic components mounted on a substrate, comprising a radiating member having a pair of mounting plates formed of a conductive sheet metal member in generally channel shape in cross section and positioned parallel with each other and a connection plate for connecting the pair of mounting plates to each other and a cooling fan mounted on one of the mounting plates of the radiating member, wherein the other of the mounting plates of the radiating member is formed so as to be mountable on the substrate in an abutting state thereof on the electronic components mounted on the substrate.Type: ApplicationFiled: November 4, 2005Publication date: June 22, 2006Inventors: Sonomasa Kobayashi, Kaigo Tanaka, Masaki Iwata