Abstract: A semiconductor device including: a first lead; a semiconductor element provided with a first electrode; a conductive member electrically connecting the first lead and the first electrode to each other; a first conductive joining layer conductively joining the first lead and the conductive member to each other; and a second conductive joining layer conductively joining the first electrode and the conductive member to each other. The conductive member includes a first surface facing the first lead in a thickness direction of the semiconductor element, and a second surface facing the first lead in a first direction orthogonal to the thickness direction. The first lead includes a third surface facing the first surface, and a fourth surface facing the second surface. The first conductive joining layer is in contact with the first surface and the third surface.

Abstract: There is provided a gear pair evaluation apparatus capable of performing accurate tooth surface analysis based on actual tooth surface measurement information without using information about a reference tooth surface. A processing unit 6 associates three-dimensional coordinate data on a gear tooth surface 102G and three-dimensional coordinate data on a pinion tooth surface 102P with each other at a predetermined meshing rotational position and converts the three-dimensional coordinate data into three-dimensional coordinate data on a cylindrical coordinate system based on the gear 101G. The processing unit 6 generates functions representing points on the pinion tooth surface 102P on the basis of the three-dimensional coordinate data on the pinion tooth surface 102P and calculates the coordinates of points on the pinion tooth surface 102P that correspond to points (grid points) on the gear tooth surface 102G by using the functions.

Abstract: There is provided a gear pair evaluation apparatus capable of performing accurate tooth surface analysis based on actual tooth surface measurement information without using information about a reference tooth surface. A processing unit 6 associates three-dimensional coordinate data on a gear tooth surface 102G and three-dimensional coordinate data on a pinion tooth surface 102P with each other at a predetermined meshing rotational position and converts the three-dimensional coordinate data into three-dimensional coordinate data on a cylindrical coordinate system based on the gear 101G. The processing unit 6 generates functions representing points on the pinion tooth surface 102P on the basis of the three-dimensional coordinate data on the pinion tooth surface 102P and calculates the coordinates of points on the pinion tooth surface 102P that correspond to points (grid points) on the gear tooth surface 102G by using the functions.