Patents by Inventor Masaki Kizaki

Masaki Kizaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240124258
    Abstract: A tape affixing system capable of automatically switching or replacing a dicing tape. A tape affixing system 1 includes a stocker 5 that stores tape magazines 4 each accommodating a dicing tape DT wound in a roll shape, an affixing apparatus 3 which includes movable guide rollers 32a and 32b, fixed guide rollers 33a and 33b, and a knife plate 35 that regulate a reel-out region R of the dicing tape DT to a predetermined track, on which each of the tape magazines 4 is replaceably mountable, and which affixes the dicing tape DT to a dicing frame DT and a workpiece W, and a first conveyance robot 6 that delivers the tape magazine 4 between the stocker 5 and the affixing apparatus 3.
    Type: Application
    Filed: November 12, 2021
    Publication date: April 18, 2024
    Inventors: Kiyotaka KIZAKI, Masaki KANAZAWA, Hitoshi AOKI
  • Patent number: 7786389
    Abstract: A flexible printed wiring board includes a first conductor layer in the element mounting part adjacent to the top surface of the wiring board; a second conductor layer in the element mounting part adjacent to the bottom surface of the wiring board; and a third conductor layer between the first conductor layer and the second conductor layer, wherein the first and third conductor layers extend through and beyond the bending part, and the second conductor layer is absent in the bending part.
    Type: Grant
    Filed: November 14, 2007
    Date of Patent: August 31, 2010
    Assignee: Ibiden Co., Ltd.
    Inventors: Kiyotaka Tsukada, Terumasa Ninomaru, Masaki Kizaki
  • Publication number: 20080115963
    Abstract: A flexible printed wiring board includes a first conductor layer in the element mounting part adjacent to the top surface of the wiring board; a second conductor layer in the element mounting part adjacent to the bottom surface of the wiring board; and a third conductor layer between the first conductor layer and the second conductor layer, wherein the first and third conductor layers extend through and beyond the bending part, and the second conductor layer is absent in the bending part.
    Type: Application
    Filed: November 14, 2007
    Publication date: May 22, 2008
    Applicant: IBIDEN CO., LTD
    Inventors: Kiyotaka TSUKADA, Terumasa NINOMARU, Masaki KIZAKI
  • Patent number: 7312401
    Abstract: A flexible printed wiring board includes a first conductor layer in the element mounting part adjacent to the top surface of the wiring board; a second conductor layer in the element mounting part adjacent to the bottom surface of the wiring board; and a third conductor layer between the first conductor layer and the second conductor layer, wherein the first and third conductor layers extend through and beyond the bending part, and the second conductor layer is absent in the bending part.
    Type: Grant
    Filed: September 20, 2005
    Date of Patent: December 25, 2007
    Assignee: Ibiden Co., Ltd.
    Inventors: Kiyotaka Tsukada, Terumasa Ninomaru, Masaki Kizaki
  • Publication number: 20060068613
    Abstract: A flexible printed wiring board includes a first conductor layer in the element mounting part adjacent to the top surface of the wiring board; a second conductor layer in the element mounting part adjacent to the bottom surface of the wiring board; and a third conductor layer between the first conductor layer and the second conductor layer, wherein the first and third conductor layers extend through and beyond the bending part, and the second conductor layer is absent in the bending part.
    Type: Application
    Filed: September 20, 2005
    Publication date: March 30, 2006
    Inventors: Kiyotaka Tsukada, Terumasa Ninomaru, Masaki Kizaki