Abstract: A fuel fill opening structure for a fuel tank includes a fuel filler pipe, a fuel fill opening, and a flow guide. The flow guide includes a main guide wall which partitions a fuel introduction region inside the fuel filler pipe into an upper space communicating with a tank main body side and a lower space communicating with the fuel fill opening side, and a partition wall provided to be continuous with the main guide wall and configured to close a space between an upper surface side of the main guide wall and an inner surface of the fuel filler pipe. The main guide wall includes a bent inclined part that is bent and inclined downward from a middle portion in running from the fuel fill opening side toward the tank main body side. The bent inclined part has a shape in which a width thereof becomes smaller when viewed from above as it inclines downward.

Abstract: A fuel fill opening structure for a fuel tank includes a fuel filler pipe, a fuel fill opening, and a flow guide. The flow guide includes a main guide wall which partitions a fuel introduction region inside the fuel filler pipe into an upper space communicating with a tank main body side and a lower space communicating with the fuel fill opening side, and a partition wall provided to be continuous with the main guide wall and configured to close a space between an upper surface side of the main guide wall and an inner surface of the fuel filler pipe. The main guide wall includes a bent inclined part that is bent and inclined downward from a middle portion in running from the fuel fill opening side toward the tank main body side. The bent inclined part has a shape in which a width thereof becomes smaller when viewed from above as it inclines downward.

Abstract: A substrate (100) is a light-transmitting substrate. A light-emitting unit (140) includes a first electrode (110), an organic layer (120), and a second electrode (130). In addition, a light-emitting device (10) includes a first region (102), a second region (104), and a third region (106). The first region (102) is a region overlapping a second electrode (130). In a case where the second electrode (130) has light shielding characteristics, the first region (102) is a region through which light does not pass. The second region (104) is a region including an insulating film (150) among regions between a plurality of light-emitting units (140). The third region (106) is a region which does not include the insulating film (150) among the regions between a plurality of light-emitting units (140). A width of the second region (104) is smaller than a width of the third region (106).

Abstract: A laminate for forming a substrate with wires in which a silver type material is used for a conductor layer and the layer is covered with a conductive protection layer for protection, the laminate for forming a substrate with wires exhibiting an extremely low contact resistance between the conductive protection layer and a cathode superposed thereon, is presented. A laminate for forming a substrate with wires, which comprises a substrate, a conductor layer comprising silver or a silver alloy, formed on the substrate, and a conductive protection layer comprising indium zinc oxide, formed on the conductor layer to cover the conductor layer, wherein the conductive protection layer is a conductive protection layer formed by sputtering in an atmosphere wherein the oxidizing gas content in the sputtering gas is not more than 1.5 vol %.

Abstract: A laminate for forming a substrate with wires in which a silver type material is used for a conductor layer and the layer is covered with a conductive protection layer for protection, the laminate for forming a substrate with wires exhibiting an extremely low contact resistance between the conductive protection layer and a cathode superposed thereon, is presented. A laminate for forming a substrate with wires, which comprises a substrate, a conductor layer comprising silver or a silver alloy, formed on the substrate, and a conductive protection layer comprising indium zinc oxide, formed on the conductor layer to cover the conductor layer, wherein the conductive protection layer is a conductive protection layer formed by sputtering in an atmosphere wherein the oxidizing gas content in the sputtering gas is not more than 1.5 vol %.