Abstract: Problem: The invention provides a polyimide precursor as well as a resin composition thereof that is excellent in coating properties of slit coating as well as productivity and also excellent in optical properties that are required for applications of flexible substrates. Solution: The polyimide precursor comprises a structure unit derived from a fluorene backbone and a silicon-containing structure unit, and a weight-average molecular weight of the polyimide precursor is 90,000 to 250,000.

Abstract: This resin composition is characterized by comprising (a) 100 parts by mass of a polyimide precursor containing a structural unit represent by general formula (1) (wherein, R1 and R2 are each independently selected from a hydrogen atom, monovalent aliphatic hydrocarbons having 1-20 carbon atoms, and aromatic groups, and X1 is a tetravalent organic group having 4-32 carbon atoms), (b) 0.001-5 parts by mass of a silicone-based surfactant, and (c) an organic solvent.

Abstract: Problem: The invention provides a polyimide precursor as well as a resin composition thereof that is excellent in coating properties of slit coating as well as productivity and also excellent in optical properties that are required for applications of flexible substrates. Solution: The polyimide precursor comprises a structure unit derived from a fluorene backbone and a silicon-containing structure unit, and a weight-average molecular weight of the polyimide precursor is 90,000 to 250,000.

Abstract: A solvent for a resin composition that includes a polyimide precursor having a structure unit derived from polyamic acid and a structure unit derived from siloxane having a monovalent aliphatic hydrocarbon group of 1 to 5 carbon atoms or a monovalent aromatic group of 6 to 10 carbon atoms. The solvent is a mixture of an amide-based solvent and a non-amide-based solvent having a boiling point of 160° C. or higher, and the resin composition includes cyclic siloxane.

Abstract: This resin composition is characterized by comprising (a) 100 parts by mass of a polyimide precursor containing a structural unit represent by general formula (1) (wherein, R1 and R2 are each independently selected from a hydrogen atom, monovalent aliphatic hydrocarbons having 1-20 carbon atoms, and aromatic groups, and X1 is a tetravalent organic group having 4-32 carbon atoms), (b) 0.001-5 parts by mass of a silicone-based surfactant, and (c) an organic solvent.

Abstract: Provided is a resin composition including a polyimide precursor that has exceptional adhesiveness to glass substrates and that does not generate particles during laser detachment. A resin composition containing (a) a polyimide precursor, (b) an organic solvent, and (d) an alkoxysilane compound, wherein the resin composition shows polyimide obtained by imidation of the (a) polyimide precursor after application of the resin composition to the surface of a support, the residual stress with the support is from ?5 MPa to 10 MPa, and the 308 nm absorbance of the (d) alkoxysilane compound when made into a 0.001 mass % NMP solution is from 0.1 to 0.5 at a solution thickness of 1 cm.