Patents by Inventor Masaki Murasawa

Masaki Murasawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5262221
    Abstract: A thermosensitive stencil paper contains a main component layer formed of a thermoplastic film and an ink-permeable support bonded together with adhesive, in which the ink-permeable support is a porous thin paper containing polynosic fibers as the main fibrous component. Optionally, the thermosensitive stencil paper has a plastic film layer whose surface is coated with a mold release layer containing as a main component a silicone oil having a kinematic viscosity of 500,000 cs or more. The transfer operation of the stencil paper in an automatic printer is excellent and its ink feeding performance during printing is high because of the polynosic fiber-containing porous thin paper support. Nonprinted spot defects are reduced because of the small number of bundled fibers in the stencil paper. Stencil paper containing the mold release layer are free of offsetting when rolled and cause no sticking for a long period of time, thereby providing thermosensitive stencil paper with excellent performance.
    Type: Grant
    Filed: December 6, 1991
    Date of Patent: November 16, 1993
    Assignee: Kohjin Co., Ltd.
    Inventors: Yukihiro Terada, Toshihiro Asai, Masaki Murasawa