Patents by Inventor Masaki Norimatsu

Masaki Norimatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT DISSIPATING STRUCTURE AND MANUFACTURE THEREOF
    Publication number: 20120325454
    Abstract: A heat dissipating structure includes a heat source; a heat dissipating part disposed to oppose to the heat source; a concave portion formed in at least one of opposing surfaces of the heat source and the heat dissipating part; and a heat conducting structure comprising a filler layer of thermoplastic material disposed between the heat source and the heat dissipating part and contacting with the opposing surfaces of the heat source and the heat dissipating part, and an assembly of carbon nanotubes that are distributed in the thermoplastic material, oriented perpendicularly to the surfaces of the filler layer, contacting, at both ends, with the opposing surfaces of the heat source and the heat dissipating part, and limited its distribution in the opposing surfaces by the concave portion.
    Type: Application
    Filed: September 5, 2012
    Publication date: December 27, 2012
    Applicant: FUJITSU LIMITED
    Inventors: Taisuke IWAI, Daiyu Kondo, Yoshitaka Yamaguchi, Shinichi Hirose, Yukie Sakita, Yohei Yagishita, Masaki Norimatsu