Patents by Inventor Masaki Okazaki

Masaki Okazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240182645
    Abstract: This poly(amic acid) composition contains a poly(amic acid). Aromatic monomers account for 95 mol % or more of all monomers that constitute the poly(amic acid). The aromatic monomers include 40-95 mol % of a monomer (A) having a prescribed diphenyl ether skeleton, 0-60 mol % of a monomer (B) having a benzophenone skeleton and 0-60 mol % of a monomer (C) having a biphenyl skeleton, each relative to the total amount of monomers. The monomer (A) having a diphenyl ether skeleton includes 20 mol % or more of a monomer (A-1) having at least three aromatic rings relative to the total amount of monomers. The diamine/tetracarboxylic acid dianhydride molar ratio is 0.90-0.999.
    Type: Application
    Filed: March 25, 2022
    Publication date: June 6, 2024
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Masaki OKAZAKI, Ko TAKASE, Tatsuhiro URAKAMI, Yoshihiro SAKATA
  • Publication number: 20240182765
    Abstract: The polyamic acid composition according to the present disclosure comprises a polyamic acid. The monomers constituting the polyamic acid include, relative to the total monomers, 30-95 mol % of monomer (A) that has a diphenyl ether skeleton represented by general formula (1) or (2) but no benzophenone skeleton, and 0-5 mol % of monomer (B) that has a benzophenone skeleton. The diamines constituting the polyamic acid include aromatic diamine (?1) that has a diphenyl ether skeleton represented by general formula (2) and aliphatic diamine (?2) represented by general formula (3) or (4), and the molar ratio b/a of the diamines b to tetracarboxylic dianhydride a constituting the polyamic acid is 0.90-0.999.
    Type: Application
    Filed: March 11, 2022
    Publication date: June 6, 2024
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Masaki OKAZAKI, Ko TAKASE, Tatsuhiro URAKAMI, Yoshihiro SAKATA
  • Patent number: 11945911
    Abstract: The purpose of the present invention is to provide: a film having high thermal stability, high bending strength (tensile elongation), small retardation in the thickness direction, a low coefficient of thermal expansion, and high transparency; and a polyamic acid or varnish for obtaining the film. The film satisfies all of requirements (i)-(vi) below. (i) The average value of the coefficient of thermal expansion in the range of 100-200° C. is 35 ppm/K or less. (ii) The absolute value of the retardation in the thickness direction is 200 nm or less per 10 ?m of thickness. (iii) The glass transition temperature is 340° C. or higher. (iv) The total light transmittance is at least 85%. (v) The b* value in the L*a*b* color system is 5 or less. (vi) The tensile elongation is at least 10%.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: April 2, 2024
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Masaki Okazaki, Kenichi Fukukawa, Tatsuhiro Urakami
  • Publication number: 20220372226
    Abstract: The purpose of the present invention is to provide: a polyimide film which is able to be formed at relatively low temperatures, while being less susceptible to coloring and having high transparency; and a polyamide acid or varnish for achieving this polyimide film. This polyimide film contains a polyimide which is a polymerization product of a tetracarboxylic acid dianhydride component and a diamine component. The tetracarboxylic acid dianhydride component contains from 60% by mole to 100% by mole of a tetracarboxylic acid dianhydride of a specific structure relative to the total amount of the tetracarboxylic acid dianhydride; and the diamine component contains from 30% by mole to 70% by mole of an alicyclic diamine and from 30% by mole to 70% by mole of an alkylene diamine relative to the total amount of the diamine component.
    Type: Application
    Filed: April 6, 2020
    Publication date: November 24, 2022
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Kenichi FUKUKAWA, Masaki OKAZAKI, Tatsuhiro URAKAMI, Yutaka HISAMUNE
  • Patent number: 11198280
    Abstract: The purpose of the present invention is to provide a medical film having excellent transparency, heat resistance, and solvent resistance. This medical film is a medical film including a heat-resistant resin having a glass transition temperature measured by thermomechanical analysis TMA of 190° C. or higher wherein the medical film has a total light transmittance of 80% or higher at a thickness of 10 ?m and a b* value in the L*a*b* color system of 10 or lower.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: December 14, 2021
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Kenichi Fukukawa, Masaki Okazaki, Tatsuhiro Urakami, Hiroshi Miyasako
  • Publication number: 20210328162
    Abstract: The present invention addresses the problem of providing a flexible electronic element substrate comprising a polyimide layer that has both low ultraviolet transmittance and high visible light transmittance and that is capable of suppressing ultraviolet degradation without any reduction in the performance of an electronic element. In order to solve this problem, the flexible electronic element substrate comprises a polyimide layer that satisfies all of (1) through (3) below: (1) maximum transmittance at a wavelength of 400±5 nm is 70% or higher at a thickness of 5 ?m; (2) the b* value in an L*a*b* color system is 5 or less at a thickness of 5 ?m; and (3) transmittance of light at a wavelength of 350 nm is 10% or less at a thickness of 5 ?m.
    Type: Application
    Filed: March 4, 2019
    Publication date: October 21, 2021
    Applicants: RIKEN, Mitsui Chemicals, Inc.
    Inventors: Kenjiro FUKUDA, Hiroki KIMURA, Takao SOMEYA, Kenichi FUKUKAWA, Masaki OKAZAKI, Tatsuhiro URAKAMI
  • Publication number: 20210261732
    Abstract: The purpose of the present invention is to provide: a film having high thermal stability, high bending strength (tensile elongation), small retardation in the thickness direction, a low coefficient of thermal expansion, and high transparency; and a polyamic acid or varnish for obtaining the film. The film satisfies all of requirements (i)-(vi) below. (i) The average value of the coefficient of thermal expansion in the range of 100-200° C. is 35 ppm/K or less. (ii) The absolute value of the retardation in the thickness direction is 200 nm or less per 10 ?m of thickness. (iii) The glass transition temperature is 340° C. or higher. (iv) The total light transmittance is at least 85%. (v) The b* value in the L*a*b* color system is 5 or less. (vi) The tensile elongation is at least 10%.
    Type: Application
    Filed: June 20, 2019
    Publication date: August 26, 2021
    Inventors: Masaki OKAZAKI, Kenichi FUKUKAWA, Tatsuhiro URAKAMI
  • Publication number: 20200129377
    Abstract: The purpose of the present invention is to provide a medical film having excellent transparency, heat resistance, and solvent resistance. This medical film is a medical film including a heat-resistant resin having a glass transition temperature measured by thermomechanical analysis TMA of 190° C. or higher wherein the medical film has a total light transmittance of 80% or higher at a thickness of 10 ?m and a b* value in the L*a*b* color system of 10 or lower.
    Type: Application
    Filed: July 20, 2017
    Publication date: April 30, 2020
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Kenichi Fukukawa, Masaki Okazaki, Tatsuhiro Urakami, Hiroshi Miyasako
  • Patent number: 10351673
    Abstract: Provided are a block polyamide acid imide having an appropriate solubility in aqueous alkaline solutions, and block polyimides that are obtained using same and have high transparency and a low coefficient of linear thermal expansion (low CTE). The block polyimide comprises blocks configured from repeating structural units represented by defined formula (1A) and blocks configured from repeating structural units represented by defined formula (1B).
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: July 16, 2019
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Kenichi Fukukawa, Masaki Okazaki, Yoshihiro Sakata, Tatsuhiro Urakami, Atsushi Okubo
  • Patent number: 9902810
    Abstract: The present invention addresses the problem of providing: a polyimide film that has a small phase difference in the thickness direction and has a low coefficient of linear thermal expansion; and a polyamic acid and varnish to obtain the same. In order to solve this problem, the present invention provides a polyimide film which comprises polyimide that is produced by reacting a diamine component and a tetracarboxylic dianhydride component, the polyimide film having a coefficient of linear thermal expansion of 35 ppm/K or less over a temperature range of 100 to 200 DEG C, an absolute value of phase difference in the thickness direction of 200 nm or less per 10 ?m thickness, a glass transition temperature of 260 DEG C or more, and a total light transmittance of 85% or more.
    Type: Grant
    Filed: April 1, 2014
    Date of Patent: February 27, 2018
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Tatsuhiro Urakami, Masaki Okazaki, Kenichi Fukukawa, Yoshihiro Sakata, Atsushi Okubo
  • Patent number: 9856399
    Abstract: The present invention addresses the problem of providing a high-transparency polyimide film in which the thickness-direction phase difference Rth is kept within a predetermined range. The present invention also addresses the problem of providing a polyamic acid and a varnish used to obtain the polyimide film. In order to overcome the aforementioned problem, the present invention is a polyimide film containing a polyimide obtained by bringing about a reaction between a tetracarboxylic dianhydride and a diamine, the polyimide film having (a) a thickness-direction phase difference Rth of ?5 to 100 nm per 10 ?m of thickness, (b) a transmittance of 80% or more with respect to light having a wavelength of 400 nm, (c) a haze of 3% or less, and (d) a glass transition point of 250° C. or higher.
    Type: Grant
    Filed: April 1, 2014
    Date of Patent: January 2, 2018
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Kenichi Fukukawa, Masaki Okazaki, Yoshihiro Sakata, Tatsuhiro Urakami, Atsushi Okubo
  • Patent number: 9850346
    Abstract: Provided is a polyimide excellent in heat resistance and colorless transparency and also excellent in flexibility and ultraviolet ray transmittance. The polyimide includes a structural unit represented by Formula (1a) and a structural unit represented by Formula (1b) wherein R is a specific aromatic group.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: December 26, 2017
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Kenichi Fukukawa, Masaki Okazaki, Yoshihiro Sakata, Tatsuhiro Urakami, Atsushi Okubo
  • Patent number: 9752030
    Abstract: The purpose of the present invention is to provide a polyimide resin which exhibits higher heat resistance than that of a conventional polyimide resin by controlling the geometric configuration of the constituent units. Provided is a polyamic acid which comprises repeating units represented by general formula (1), wherein the 1,4-bismethylenecyclohexane skeleton units consist of both trans- and cis-form units, and the contents of the trans- and cis-form units are 60 to 100% and 0 to 40% respectively (with the sum total of the trans- and cis-form units being 100%).
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: September 5, 2017
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Kenichi Fukukawa, Masaki Okazaki, Yoshihiro Sakata, Ichiro Fujio, Wataru Yamashita
  • Publication number: 20170240705
    Abstract: Provided are a block polyamide acid imide having an appropriate solubility in aqueous alkaline solutions, and block polyimides that are obtained using same and have high transparency and a low coefficient of linear thermal expansion (low CTE). The block polyimide comprises blocks configured from repeating structural units represented by defined formula (1A) and blocks configured from repeating structural units represented by defined formula (1B).
    Type: Application
    Filed: May 8, 2017
    Publication date: August 24, 2017
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Kenichi FUKUKAWA, Masaki OKAZAKI, Yoshihiro SAKATA, Tatsuhiro URAKAMI, Atsushi OKUBO
  • Patent number: 9741838
    Abstract: A semiconductor device includes a plurality of gate electrodes. Each gate electrode includes a first portion extending from a first end to a second end and a second portion extending parallel the first portion from a first end to a second end. The first and second portions are spaced from each other. A third portion of at least one gate electrode connects the first end of the first portion to the first end of the second portion of the gate electrode. A first insulating film is on the plurality of gate electrodes. A first interconnect portion is disposed on the first or second portion the gate electrode to electrically connecting the gate electrode to a gate pad. A second interconnect portion is disposed on semiconductor regions between the gate electrodes and electrically connects the semiconductor regions to an emitter pad.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: August 22, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yukie Nishikawa, Masaki Okazaki
  • Publication number: 20170213902
    Abstract: A semiconductor device includes a plurality of gate electrodes. Each gate electrode includes a first portion extending from a first end to a second end and a second portion extending parallel the first portion from a first end to a second end. The first and second portions are spaced from each other. A third portion of at least one gate electrode connects the first end of the first portion to the first end of the second portion of the gate electrode. A first insulating film is on the plurality of gate electrodes. A first interconnect portion is disposed on the first or second portion the gate electrode to electrically connecting the gate electrode to a gate pad. A second interconnect portion is disposed on semiconductor regions between the gate electrodes and electrically connects the semiconductor regions to an emitter pad.
    Type: Application
    Filed: August 18, 2016
    Publication date: July 27, 2017
    Inventors: Yukie NISHIKAWA, Masaki OKAZAKI
  • Publication number: 20170077218
    Abstract: Provided is a semiconductor device including a first electrode, a second electrode, a semiconductor substrate having a first plane, a second plane, a first conductivity-type first region, and a plurality of second conductivity-type second regions provided around the first electrode, the second regions being in contact with the first plane, at least a portion of the semiconductor substrate being provided between the first electrode and the second electrode, a first insulating film provided on or above the second regions, the first insulating film including positive charges, and a second insulating film provided on or above the second regions, second insulating film including negative charges.
    Type: Application
    Filed: February 12, 2016
    Publication date: March 16, 2017
    Inventors: Yukie Nishikawa, Yasuhiko Akaike, Masaki Okazaki
  • Patent number: 9339992
    Abstract: Provided is a low-cost polyimide, containing cyclohexane diamine as a diamine unit, that has a low thermal expansion coefficient. Said block polyimide contains blocks having the repeating structural unit shown in formula (1A) and blocks having the repeating structural unit shown in formula (1B). This block polyimide is preferably obtained by imidizing a block polyamide acid imide that contains blocks having the repeating structural unit shown in formula (2A) and blocks having the repeating structural unit shown in formula (2B).
    Type: Grant
    Filed: March 18, 2010
    Date of Patent: May 17, 2016
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Kenichi Fukukawa, Tatsuhiro Urakami, Yoshihiro Sakata, Wataru Yamashita, Masaki Okazaki
  • Publication number: 20160115276
    Abstract: Provided is a polyimide excellent in heat resistance and colorless transparency and also excellent in flexibility and ultraviolet ray transmittance. The polyimide includes a structural unit represented by Formula (1a) and a structural unit represented by Formula (1b) wherein R is a specific aromatic group.
    Type: Application
    Filed: May 9, 2014
    Publication date: April 28, 2016
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Kenichi FUKUKAWA, Masaki OKAZAKI, Yoshihiro SAKATA, Tatsuhiro URAKAMI, Atsushi OKUBO
  • Publication number: 20160075830
    Abstract: The purpose of the present invention is to provide a block polyamide acid imide having an appropriate solubility in aqueous alkaline solutions, and block polyimides that are obtained using same and have high transparency and a low coefficient of linear thermal expansion (low CTE). This block polyimide comprises blocks configured from repeating structural units represented by formula (1A) and blocks configured from repeating structural units represented by formula (1B).
    Type: Application
    Filed: April 23, 2014
    Publication date: March 17, 2016
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Kenichi FUKUKAWA, Masaki OKAZAKI, Yoshihiro SAKATA, Tatsuhiro URAKAMI, Atsushi OKUBO