Abstract: The purpose of the present invention is to provide: a film having high thermal stability, high bending strength (tensile elongation), small retardation in the thickness direction, a low coefficient of thermal expansion, and high transparency; and a polyamic acid or varnish for obtaining the film. The film satisfies all of requirements (i)-(vi) below. (i) The average value of the coefficient of thermal expansion in the range of 100-200° C. is 35 ppm/K or less. (ii) The absolute value of the retardation in the thickness direction is 200 nm or less per 10 ?m of thickness. (iii) The glass transition temperature is 340° C. or higher. (iv) The total light transmittance is at least 85%. (v) The b* value in the L*a*b* color system is 5 or less. (vi) The tensile elongation is at least 10%.

Abstract: The purpose of the present invention is to provide: a polyimide film which is able to be formed at relatively low temperatures, while being less susceptible to coloring and having high transparency; and a polyamide acid or varnish for achieving this polyimide film. This polyimide film contains a polyimide which is a polymerization product of a tetracarboxylic acid dianhydride component and a diamine component. The tetracarboxylic acid dianhydride component contains from 60% by mole to 100% by mole of a tetracarboxylic acid dianhydride of a specific structure relative to the total amount of the tetracarboxylic acid dianhydride; and the diamine component contains from 30% by mole to 70% by mole of an alicyclic diamine and from 30% by mole to 70% by mole of an alkylene diamine relative to the total amount of the diamine component.

Abstract: The purpose of the present invention is to provide a medical film having excellent transparency, heat resistance, and solvent resistance. This medical film is a medical film including a heat-resistant resin having a glass transition temperature measured by thermomechanical analysis TMA of 190° C. or higher wherein the medical film has a total light transmittance of 80% or higher at a thickness of 10 ?m and a b* value in the L*a*b* color system of 10 or lower.

Abstract: The present invention addresses the problem of providing a flexible electronic element substrate comprising a polyimide layer that has both low ultraviolet transmittance and high visible light transmittance and that is capable of suppressing ultraviolet degradation without any reduction in the performance of an electronic element. In order to solve this problem, the flexible electronic element substrate comprises a polyimide layer that satisfies all of (1) through (3) below: (1) maximum transmittance at a wavelength of 400±5 nm is 70% or higher at a thickness of 5 ?m; (2) the b* value in an L*a*b* color system is 5 or less at a thickness of 5 ?m; and (3) transmittance of light at a wavelength of 350 nm is 10% or less at a thickness of 5 ?m.

Abstract: The purpose of the present invention is to provide: a film having high thermal stability, high bending strength (tensile elongation), small retardation in the thickness direction, a low coefficient of thermal expansion, and high transparency; and a polyamic acid or varnish for obtaining the film. The film satisfies all of requirements (i)-(vi) below. (i) The average value of the coefficient of thermal expansion in the range of 100-200° C. is 35 ppm/K or less. (ii) The absolute value of the retardation in the thickness direction is 200 nm or less per 10 ?m of thickness. (iii) The glass transition temperature is 340° C. or higher. (iv) The total light transmittance is at least 85%. (v) The b* value in the L*a*b* color system is 5 or less. (vi) The tensile elongation is at least 10%.

Abstract: The purpose of the present invention is to provide a medical film having excellent transparency, heat resistance, and solvent resistance. This medical film is a medical film including a heat-resistant resin having a glass transition temperature measured by thermomechanical analysis TMA of 190° C. or higher wherein the medical film has a total light transmittance of 80% or higher at a thickness of 10 ?m and a b* value in the L*a*b* color system of 10 or lower.

Abstract: Provided are a block polyamide acid imide having an appropriate solubility in aqueous alkaline solutions, and block polyimides that are obtained using same and have high transparency and a low coefficient of linear thermal expansion (low CTE). The block polyimide comprises blocks configured from repeating structural units represented by defined formula (1A) and blocks configured from repeating structural units represented by defined formula (1B).

Abstract: The present invention addresses the problem of providing: a polyimide film that has a small phase difference in the thickness direction and has a low coefficient of linear thermal expansion; and a polyamic acid and varnish to obtain the same. In order to solve this problem, the present invention provides a polyimide film which comprises polyimide that is produced by reacting a diamine component and a tetracarboxylic dianhydride component, the polyimide film having a coefficient of linear thermal expansion of 35 ppm/K or less over a temperature range of 100 to 200 DEG C, an absolute value of phase difference in the thickness direction of 200 nm or less per 10 ?m thickness, a glass transition temperature of 260 DEG C or more, and a total light transmittance of 85% or more.

Abstract: The present invention addresses the problem of providing a high-transparency polyimide film in which the thickness-direction phase difference Rth is kept within a predetermined range. The present invention also addresses the problem of providing a polyamic acid and a varnish used to obtain the polyimide film. In order to overcome the aforementioned problem, the present invention is a polyimide film containing a polyimide obtained by bringing about a reaction between a tetracarboxylic dianhydride and a diamine, the polyimide film having (a) a thickness-direction phase difference Rth of ?5 to 100 nm per 10 ?m of thickness, (b) a transmittance of 80% or more with respect to light having a wavelength of 400 nm, (c) a haze of 3% or less, and (d) a glass transition point of 250° C. or higher.

Abstract: Provided is a polyimide excellent in heat resistance and colorless transparency and also excellent in flexibility and ultraviolet ray transmittance. The polyimide includes a structural unit represented by Formula (1a) and a structural unit represented by Formula (1b) wherein R is a specific aromatic group.

Abstract: The purpose of the present invention is to provide a polyimide resin which exhibits higher heat resistance than that of a conventional polyimide resin by controlling the geometric configuration of the constituent units. Provided is a polyamic acid which comprises repeating units represented by general formula (1), wherein the 1,4-bismethylenecyclohexane skeleton units consist of both trans- and cis-form units, and the contents of the trans- and cis-form units are 60 to 100% and 0 to 40% respectively (with the sum total of the trans- and cis-form units being 100%).

Abstract: Provided are a block polyamide acid imide having an appropriate solubility in aqueous alkaline solutions, and block polyimides that are obtained using same and have high transparency and a low coefficient of linear thermal expansion (low CTE). The block polyimide comprises blocks configured from repeating structural units represented by defined formula (1A) and blocks configured from repeating structural units represented by defined formula (1B).

Abstract: A semiconductor device includes a plurality of gate electrodes. Each gate electrode includes a first portion extending from a first end to a second end and a second portion extending parallel the first portion from a first end to a second end. The first and second portions are spaced from each other. A third portion of at least one gate electrode connects the first end of the first portion to the first end of the second portion of the gate electrode. A first insulating film is on the plurality of gate electrodes. A first interconnect portion is disposed on the first or second portion the gate electrode to electrically connecting the gate electrode to a gate pad. A second interconnect portion is disposed on semiconductor regions between the gate electrodes and electrically connects the semiconductor regions to an emitter pad.

Abstract: A semiconductor device includes a plurality of gate electrodes. Each gate electrode includes a first portion extending from a first end to a second end and a second portion extending parallel the first portion from a first end to a second end. The first and second portions are spaced from each other. A third portion of at least one gate electrode connects the first end of the first portion to the first end of the second portion of the gate electrode. A first insulating film is on the plurality of gate electrodes. A first interconnect portion is disposed on the first or second portion the gate electrode to electrically connecting the gate electrode to a gate pad. A second interconnect portion is disposed on semiconductor regions between the gate electrodes and electrically connects the semiconductor regions to an emitter pad.

Abstract: Provided is a semiconductor device including a first electrode, a second electrode, a semiconductor substrate having a first plane, a second plane, a first conductivity-type first region, and a plurality of second conductivity-type second regions provided around the first electrode, the second regions being in contact with the first plane, at least a portion of the semiconductor substrate being provided between the first electrode and the second electrode, a first insulating film provided on or above the second regions, the first insulating film including positive charges, and a second insulating film provided on or above the second regions, second insulating film including negative charges.

Abstract: Provided is a low-cost polyimide, containing cyclohexane diamine as a diamine unit, that has a low thermal expansion coefficient. Said block polyimide contains blocks having the repeating structural unit shown in formula (1A) and blocks having the repeating structural unit shown in formula (1B). This block polyimide is preferably obtained by imidizing a block polyamide acid imide that contains blocks having the repeating structural unit shown in formula (2A) and blocks having the repeating structural unit shown in formula (2B).

Abstract: Provided is a polyimide excellent in heat resistance and colorless transparency and also excellent in flexibility and ultraviolet ray transmittance. The polyimide includes a structural unit represented by Formula (1a) and a structural unit represented by Formula (1b) wherein R is a specific aromatic group.

Abstract: The purpose of the present invention is to provide a block polyamide acid imide having an appropriate solubility in aqueous alkaline solutions, and block polyimides that are obtained using same and have high transparency and a low coefficient of linear thermal expansion (low CTE). This block polyimide comprises blocks configured from repeating structural units represented by formula (1A) and blocks configured from repeating structural units represented by formula (1B).

Abstract: The present invention addresses the problem of providing a high-transparency polyimide film in which the thickness-direction phase difference Rth is kept within a predetermined range. The present invention also addresses the problem of providing a polyamic acid and a varnish used to obtain the polyimide film. In order to overcome the aforementioned problem, the present invention is a polyimide film containing a polyimide obtained by bringing about a reaction between a tetracarboxylic dianhydride and a diamine, the polyimide film having (a) a thickness-direction phase difference Rth of ?5 to 100 nm per 10 ?m of thickness, (b) a transmittance of 80% or more with respect to light having a wavelength of 400 nm, (c) a haze of 3% or less, and (d) a glass transition point of 250° C. or higher.

Abstract: The present invention addresses the problem of providing: a polyimide film that has a small phase difference in the thickness direction and has a low coefficient of linear thermal expansion; and a polyamic acid and varnish to obtain the same. In order to solve this problem, the present invention provides a polyimide film which comprises polyimide that is produced by reacting a diamine component and a tetracarboxylic dianhydride component, the polyimide film having a coefficient of linear thermal expansion of 35 ppm/K or less over a temperature range of 100 to 200 DEG C, an absolute value of phase difference in the thickness direction of 200 nm or less per 10 ?m thickness, a glass transition temperature of 260 DEG C or more, and a total light transmittance of 85% or more.