Patents by Inventor Masaki Otoguro

Masaki Otoguro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Schottky diode with bump electrodes
    Patent number: 6605854
    Abstract: The package size of a diode is made smaller. On the element forming face of a semiconductor substrate having a p−-type conductive type, after a hyper-abrupt p+n+ junction of a p+-type diffusion layer, an n+-type hyper-abrupt layer, an n−-epitaxial layer, an n-type low resistance layer and an n+-type diffusion layer is formed, an anode electrode is formed on the top of the p+-type diffusion layer and a cathode electrode is formed on the top of the n+-type diffusion layer. Thereafter, electrode bumps are formed on the top of the anode electrode and the cathode electrode to thereby manufacture a small diode that can be facedown bonded onto a mounting board.
    Type: Grant
    Filed: January 17, 2002
    Date of Patent: August 12, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Hiroyuki Nagase, Shuichi Suzuki, Masaki Otoguro, Yasuharu Ichinose, Teruhiro Mitsuyasu
  • Semiconductor device and manufacturing method of the semiconductor device
    Publication number: 20020102804
    Abstract: The package size of a diode is made smaller. On the element forming face of a semiconductor substrate having a p−-type conductive type, after a hyper-abrupt p+n+ junction of a p+-type diffusion layer, an n+-type hyper-abrupt layer, an n−-epitaxial layer, an n-type low resistance layer and an n+-type diffusion layer is formed, an anode electrode is formed on the top of the p+-type diffusion layer and a cathode electrode is formed on the top of the n+-type diffusion layer. Thereafter, electrode bumps are formed on the top of the anode electrode and the cathode electrode to thereby manufacture a small diode that can be facedown bonded onto a mounting board.
    Type: Application
    Filed: January 17, 2002
    Publication date: August 1, 2002
    Applicant: Hitachi, Ltd.
    Inventors: Hiroyuki Nagase, Shuichi Suzuki, Masaki Otoguro, Yasuharu Ichinose, Teruhiro Mitsuyasu