Patents by Inventor Masaki OZAKI
Masaki OZAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11975787Abstract: The control device (20) corrects a basic movement command for a mobile body (1), which is based on an operator's maneuvering operation, in accordance with a positional relationship between the mobile body and an obstacle, and performs movement control of the mobile body (1) in accordance with the corrected movement command. The control device (20) is configured to correct the basic movement command, when a distance d between the obstacle and the mobile body (1) has become a predetermined value d1 or less, to cause a yaw rate in a direction away from the obstacle to be additionally generated on the mobile body (1), and also configured to correct the basic movement command so as to cause a rate of increase in magnitude of the yaw rate with respect to a decrease of the distance to be increased as the distance d is closer to the predetermined value d1.Type: GrantFiled: December 22, 2020Date of Patent: May 7, 2024Assignee: HONDA MOTOR CO., LTD.Inventors: Masaki Goto, Shinya Shirokura, Makoto Hasegawa, Kazumasa Ozaki
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Publication number: 20240085066Abstract: A turbo-Brayton refrigeration machine (11) includes a first circulation path (L1) in which a first refrigerant circulates, a second circulation path (L2) in which a second refrigerant which is a cooling target circulates, a subcooler (22) disposed over the first circulation path (L1) and the second circulation path (L2) and configured to have a single heat-exchanging unit, and an expansion turbine (21) positioned on a primary side of the subcooler (22) in the first circulation path (L1), in which the pressure ratio of the expansion turbine (21) is the pressure ratio at which the outlet temperature of the expansion turbine (21) is higher than a freezing point of the second refrigerant.Type: ApplicationFiled: March 8, 2022Publication date: March 14, 2024Inventors: Shinsuke OZAKI, Hirokazu HIRAI, Masaki ISHII
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Patent number: 11887877Abstract: An electrostatic chuck device includes: an electrostatic chuck part having a sample placing surface on which a sample is placed and having a first electrode for electrostatic attraction; a cooling base part placed on a side opposite to the sample placing surface with respect to the electrostatic chuck part to cool the electrostatic chuck part; and an adhesive layer that bonds the electrostatic chuck part and the cooling base part together, in which the electrostatic chuck part has a recess and protrusion on the adhesive layer side, and a sheet resistance value of the first electrode is higher than 1.0?/? and lower than 1.0×1010?/?.Type: GrantFiled: September 26, 2018Date of Patent: January 30, 2024Assignee: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Mamoru Kosakai, Masaki Ozaki, Keisuke Maeda
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Patent number: 11848223Abstract: An electrostatic chuck device includes: a mounting table provided with amounting surface on which a plate-shaped sample is mounted; an annular focus ring; and a cooling element for cooling the focus ring, in which the mounting table has a holding portion provided to surround the mounting surface, and the holding portion includes an annular groove surrounding the mounting surface, and a through-hole that is open on a bottom surface of the groove, wherein a tubular insulator has been inserted into the through-hole, the holding portion has upper surfaces, which are located on both sides of the groove in a width direction, as holding surfaces that are in contact with the focus ring and hold the focus ring, wherein the holding surface satisfies the following conditions (i) to (iii); (i) surface roughness is 0.05 ?m or less, (ii) a flatness is 20 ?m or less, and (iii) the holding surface does not have a recess having a depth of 1.0 ?m or more and extending in a direction intersecting the holding surface.Type: GrantFiled: February 19, 2019Date of Patent: December 19, 2023Assignee: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Hironori Kugimoto, Masaki Ozaki, Takeshi Watanabe, Kentaro Takahashi
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Patent number: 11664261Abstract: An object of the present invention is to reduce non-uniformity of etching in a plane of a wafer. An electrostatic chuck device includes: an electrostatic chuck part having a sample mounting surface on which a sample is mounted and having a first electrode for electrostatic attraction; a cooling base part placed on a side opposite to the sample mounting surface with respect to the electrostatic chuck part to cool the electrostatic chuck part; and an adhesive layer that bonds the electrostatic chuck part and the cooling base part together, in which the cooling base part has a function of a second electrode that is an RF electrode, a third electrode for RF electrode or LC adjustment is provided between the electrostatic chuck part and the cooling base part, and the third electrode is bonded to the electrostatic chuck part and the cooling base part and insulated from the cooling base part.Type: GrantFiled: September 12, 2018Date of Patent: May 30, 2023Assignee: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Mamoru Kosakai, Masaki Ozaki, Keisuke Maeda
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Patent number: 11471987Abstract: An electrostatic chuck device comprising a mounting table having a mounting surface, a focus ring; and a cooling element, wherein the mounting table has a holding portion surrounding the mounting surface, the holding portion has an annular groove portion having a through-hole, the holding portion has inner and outer peripheral surfaces which hold the focus ring and are located on both sides of the groove portion, the holding surface satisfies conditions (i) and (ii), (i) a straight line connecting a first point corresponding to an innermost periphery of the holding surface and a second point corresponding to an outermost periphery of the holding surface has a positive or a negative inclination from the innermost periphery toward the outermost periphery, wherein a difference between a height of the first point and a height of the second point is 0 ?m to 10 ?m, and (ii) leak areas of the inner peripheral surface and the outer peripheral surface are less than 0.7 mm2.Type: GrantFiled: August 2, 2019Date of Patent: October 18, 2022Assignee: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Keisuke Maeda, Masaki Ozaki, Masayuki Shiojiri, Takeshi Watanabe, Shinichi Maeta, Yuuki Kinpara
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Patent number: 11328948Abstract: An electrostatic chuck device (1) including: an electrostatic chuck part (2) which includes a base material (11) having a mounting surface (11a) on which a plate-like sample W is mounted, and an internal electrostatic attraction electrode (13) which electrostatically attracts the plate-like sample (W) to the mounting surface (11a); a cooling base part (3) which is configured to cool the electrostatic chuck part (2); and an adhesive layer (4) which is interposed therebetween, in which a shape of the mounting surface of the base material (11) includes a concave surface (23) or a convex surface, which is a curved surface that gradually curves from a center (11b) of the mounting surface (11a) toward an outer periphery (11c) of the mounting surface (11a) and includes no inflection point, and an absolute value of a difference between a height of a center of the concave surface (23) or the convex surface from a position of a main surface (3a) of the cooling base part (3) as a reference and a height of an outer peripType: GrantFiled: July 19, 2019Date of Patent: May 10, 2022Assignee: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Masaki Ozaki, Norito Morishita
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Publication number: 20210308812Abstract: An electrostatic chuck device includes: a mounting table provided with a mounting surface; a focus ring; and a cooling element, in which a holding portion of the mounting table is provided with an annular groove portion surrounding the mounting table, a through-hole that is open on a bottom surface of the groove portion, upper surfaces on both sides of the groove portion in a width direction in the holding portion form a holding surface that comes into contact with the focus ring and holds the focus ring, the holding surface is composed of an inner peripheral surface located further on an inner periphery side than the groove portion and an outer peripheral surface located further on an outer periphery side than the groove portion, and the holding surface satisfies the following conditions (i) and (ii), wherein (i) the holding surface has a shape in which in a cross section in a thickness direction, a straight line connecting a first point corresponding to an innermost periphery of the holding surface and a seType: ApplicationFiled: August 2, 2019Publication date: October 7, 2021Inventors: Keisuke MAEDA, Masaki OZAKI, Masayuki SHIOJIRI, Takeshi WATANABE, Shinchi MAETA, Yuuki KINPARA
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Publication number: 20210074570Abstract: An electrostatic chuck device includes: a mounting table provided with amounting surface on which a plate-shaped sample is mounted; an annular focus ring; and a cooling element for cooling the focus ring, in which the mounting table has a holding portion provided to surround the mounting surface, and the holding portion includes an annular groove surrounding the mounting surface, and a through-hole that is open on a bottom surface of the groove, wherein a tubular insulator has been inserted into the through-hole, the holding portion has upper surfaces, which are located on both sides of the groove in a width direction, as holding surfaces that are in contact with the focus ring and hold the focus ring, wherein the holding surface satisfies the following conditions (i) to (iii); (i) surface roughness is 0.05 ?m or less, (ii) a flatness is 20 ?m or less, and (iii) the holding surface does not have a recess having a depth of 1.0 ?m or more and extending in a direction intersecting the holding surface.Type: ApplicationFiled: February 19, 2019Publication date: March 11, 2021Inventors: Hironori KUGIMOTO, Masaki OZAKI, Takeshi WATANABE, Kentaro TAKAHASHI
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Publication number: 20200303229Abstract: An electrostatic chuck device (1) including: an electrostatic chuck part (2) which includes a base material (11) having a mounting surface (11a) on which a plate-like sample W is mounted, and an internal electrostatic attraction electrode (13) which electrostatically attracts the plate-like sample (W) to the mounting surface (11a); a cooling base part (3) which is configured to cool the electrostatic chuck part (2); and an adhesive layer (4) which is interposed therebetween, in which a shape of the mounting surface of the base material (11) includes a concave surface (23) or a convex surface, which is a curved surface that gradually curves from a center (11b) of the mounting surface (11a) toward an outer periphery (11c) of the mounting surface (11a) and includes no inflection point, and an absolute value of a difference between a height of a center of the concave surface (23) or the convex surface from a position of a main surface (3a) of the cooling base part (3) as a reference and a height of an outer peripType: ApplicationFiled: July 19, 2019Publication date: September 24, 2020Applicant: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Masaki OZAKI, Norito MORISHITA
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Publication number: 20200273736Abstract: An object of the present invention is to reduce non-uniformity of etching in a plane of a wafer. An electrostatic chuck device includes: an electrostatic chuck part having a sample mounting surface on which a sample is mounted and having a first electrode for electrostatic attraction; a cooling base part placed on a side opposite to the sample mounting surface with respect to the electrostatic chuck part to cool the electrostatic chuck part; and an adhesive layer that bonds the electrostatic chuck part and the cooling base part together, in which the cooling base part has a function of a second electrode that is an RF electrode, a third electrode for RF electrode or LC adjustment is provided between the electrostatic chuck part and the cooling base part, and the third electrode is bonded to the electrostatic chuck part and the cooling base part and insulated from the cooling base part.Type: ApplicationFiled: September 12, 2018Publication date: August 27, 2020Applicant: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Mamoru KOSAKAI, Masaki OZAKI, Keisuke MAEDA
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Publication number: 20200266088Abstract: An electrostatic chuck device includes: an electrostatic chuck part having a sample placing surface on which a sample is placed and having a first electrode for electrostatic attraction; a cooling base part placed on a side opposite to the sample placing surface with respect to the electrostatic chuck part to cool the electrostatic chuck part; and an adhesive layer that bonds the electrostatic chuck part and the cooling base part together, in which the electrostatic chuck part has a recess and protrusion on the adhesive layer side, and a sheet resistance value of the first electrode is higher than 1.0 ?/? and lower than 1.0×1010 ?/?.Type: ApplicationFiled: September 26, 2018Publication date: August 20, 2020Applicant: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Mamoru KOSAKAI, Masaki OZAKI, Keisuke MAEDA