Patents by Inventor Masaki Sanada

Masaki Sanada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pad structure and mounted structure
    Patent number: 9392703
    Abstract: A pad structure includes an insulating layer; a first metal layer formed on one surface of the insulating layer and including an intermetallic compound layer of copper and tin or a tin layer; and a second metal layer formed on the first metal layer and including a gold layer.
    Type: Grant
    Filed: June 13, 2014
    Date of Patent: July 12, 2016
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Masaki Sanada, Syota Miki
  • PAD STRUCTURE AND MOUNTED STRUCTURE
    Publication number: 20140374149
    Abstract: A pad structure includes an insulating layer; a first metal layer formed on one surface of the insulating layer and including an intermetallic compound layer of copper and tin or a tin layer; and a second metal layer formed on the first metal layer and including a gold layer.
    Type: Application
    Filed: June 13, 2014
    Publication date: December 25, 2014
    Inventors: Masaki SANADA, Syota MIKI
  • Solder bump forming method
    Patent number: 7807560
    Abstract: A solder bump forming method of carrying out a reflow treatment over a conductive ball mounted on a plurality of pads, thereby forming a solder bump, includes a metal film forming step of forming a metal film capable of chemically reacting to a tackifying compound on the pads, an organic sticking layer forming step of causing a solution containing the tackifying compound to chemically react to the metal film, thereby forming an organic sticking layer on the metal film, and a conductive ball mounting step of supplying the conductive ball on the pads having the organic sticking layer formed thereon, thereby mounting the conductive ball on the pads through the metal film.
    Type: Grant
    Filed: July 16, 2008
    Date of Patent: October 5, 2010
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Kei Imafuji, Masao Nakazawa, Masaki Sanada, Sachiko Oda, Tadashi Kodaira, Kinji Nagata, Masaru Yamazaki, Kenjiro Enoki
  • SOLDER BUMP FORMING METHOD
    Publication number: 20090023281
    Abstract: A solder bump forming method of carrying out a reflow treatment over a conductive ball mounted on a plurality of pads, thereby forming a solder bump, includes a metal film forming step of forming a metal film capable of chemically reacting to a tackifying compound on the pads, an organic sticking layer forming step of causing a solution containing the tackifying compound to chemically react to the metal film, thereby forming an organic sticking layer on the metal film, and a conductive ball mounting step of supplying the conductive ball on the pads having the organic sticking layer formed thereon, thereby mounting the conductive ball on the pads through the metal film.
    Type: Application
    Filed: July 16, 2008
    Publication date: January 22, 2009
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Kei Imafuji, Masao Nakazawa, Masaki Sanada, Sachiko Oda, Tadashi Kodaira, Kinji Nagata, Masaru Yamazaki, Kenjiro Enoki
  • Non-cyanide electroless gold plating solution and process for electroless gold plating
    Patent number: 7384458
    Abstract: The non-cyanide electroless gold plating solution according to the invention is a non-cyanide electroless gold plating solution free from a cyanide compound, wherein bis-(3-sulfopropyl)disulfide is added, as a complexing agent for gold stabilization, to the electroless gold plating solution.
    Type: Grant
    Filed: March 14, 2007
    Date of Patent: June 10, 2008
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Masaki Sanada
  • NON-CYANIDE ELECTROLESS GOLD PLATING SOLUTION AND PROCESS FOR ELECTROLESS GOLD PLATING
    Publication number: 20070218212
    Abstract: The non-cyanide electroless gold plating solution according to the invention is a non-cyanide electroless gold plating solution free from a cyanide compound, wherein bis-(3-sulfopropyl)disulfide is added, as a complexing agent for gold stabilization, to the electroless gold plating solution.
    Type: Application
    Filed: March 14, 2007
    Publication date: September 20, 2007
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Masaki Sanada
  • Non-cyanide electroless gold plating solution and process for electroless gold plating
    Patent number: 7264848
    Abstract: The present invention provides a non-cyanide electroless gold plating solution free from a cyanide compound, comprising, as a completing agent of gold, a compound represented by the formula shown below or a salt thereof: X—(CH2)n—SH wherein n is 2 or 3 and X is SO3H or NH2, and having a pH value of 7 or less. The invention also provides a process for electroless gold plating using the non-cyanide electroless gold plating solution.
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: September 4, 2007
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Masaki Sanada, Masao Nakazawa, Kei Imafuji
  • Non-cyanide electroless gold plating solution and process for electroless gold plating
    Publication number: 20060062927
    Abstract: The present invention provides a non-cyanide electroless gold plating solution free from a cyanide compound, comprising, as a completing agent of gold, a compound represented by the formula shown below or a salt thereof: X—(CH2)n—SH wherein n is 2 or 3 and X is SO3H or NH2, and having a pH value of 7 or less. The invention also provides a process for electroless gold plating using the non-cyanide electroless gold plating solution.
    Type: Application
    Filed: September 14, 2005
    Publication date: March 23, 2006
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Masaki Sanada, Masao Nakazawa, Kei Imafuji