Patents by Inventor Masaki Tanaka

Masaki Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4542356
    Abstract: A high frequency narrow-band pass multi-mode filter in constructed in such manner that SAW of SSBW resonators are closely disposed to each other on a single piezo-electric substrate to generate different vibration modes of different resonance frequencies, conditions that the resonators are acoustically coupled to each other to cause these vibration modes, are experimentally found, and the above conditions are satisfied by the filter.In order to reduce the ohmic loss of a very narrow common bus bar, the number of strip pairs of electrode in both interdigital transducers (hereinafter referred to as IDT) is minimized and instead reflectors are provided on the both sides of said TDTs to compensate for the reduction of its Q value. A part of the bus bar for the IDT electrodes is formed integral with some or all of gratings of the reflectors, whereby the connecting positions of the grating electrodes with respect to lead terminals can be positioned with a high freedom.
    Type: Grant
    Filed: July 26, 1983
    Date of Patent: September 17, 1985
    Assignee: Toyo Communication Equipment Co., Ltd.
    Inventors: Yuzo Nakazawa, Kazuo Ono, Masaki Tanaka, Takao Morita, Takefumi Kurosaki
  • Patent number: 4495227
    Abstract: The invention provides a novel silicone-containing curable composition capable of foaming by virtue of the blowing agent contained therein together with a curable liquid silicone composition. The composition is suitable for the water-repellent and waterproof treatment of fabric materials without decreasing the air and moisture permeability of the treated fabric material.
    Type: Grant
    Filed: April 21, 1983
    Date of Patent: January 22, 1985
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Masaki Tanaka
  • Patent number: 4419391
    Abstract: The invention provides a novel method for finishing fabrics of not only synthetic but also natural, e.g. cotton, fibers to be imparted with improved touch of softness, slipperiness and sliminess durable against laundering. The method is characterized by the use of a specific organopolysiloxane as the fabric-finishing agent. The organopolysiloxane is a linear diorganopolysiloxane having at least one amino-substituted hydrocarbon group such as an aminopropyl group as the pendant group and the molecular chain ends of the molecule are terminated with alkoxy groups such as methoxy and ethoxy groups.
    Type: Grant
    Filed: March 23, 1982
    Date of Patent: December 6, 1983
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Masaki Tanaka, Koichi Yamaguchi
  • Patent number: 4196273
    Abstract: The present invention presents a novel curable organopolysiloxane composition capable of being adhesively bonded firmly to the surface of various substrates with which it has been in contact during its curing by heating without the primer treatment of the surface. The composition is essentially composed of a diorganopolysiloxane terminated at both chain ends with vinyl groups as the base component, optionally, in combination of a copolymeric organopolysiloxane composed of vinyl-containing monofunctional siloxane units and tetrafunctional siloxane units SiO.sub.2, an organohydrogen-polysiloxane having at least three silicon-bonded hydrogen atoms per molecule as a crosslinking agent by the addition reaction with the vinyl groups in the base component, a platinum catalyst to accelerate the above addition reaction and an alkoxy silane having an aliphatically unsaturated group which serves as a "self-bonding" improver in the composition with or without the addition of a filler.
    Type: Grant
    Filed: August 16, 1978
    Date of Patent: April 1, 1980
    Assignee: Shin-Etsu Chemical Co. Ltd.
    Inventors: Kiyoshi Imai, Masaki Tanaka
  • Patent number: 4139519
    Abstract: The curable composition provided by the present invention comprises a butadiene polymer having organosilicon groups as the pendant groups, an ethylenically unsaturated polymerizable compound, an organic peroxide, and optionally a filler. The butadiene polymer being the base of this composition can readily be obtained by the platinum-catalyzed addition reaction between an organosilicon compound having a hydrogen atom directly bonded to the silicon atom in a molecule and the ethylenic unsaturation of a conventional butadiene polymer.The compositions of the invention are remarkably superior in many respects to those composition based on ordinary butadiene polymers, and useful for applications in a wide variety including the production of electrically insulating materials and various kinds of industrial articles.
    Type: Grant
    Filed: August 17, 1977
    Date of Patent: February 13, 1979
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kunio Itoh, Kiyoshi Imai, Masaki Tanaka, Kimitaka Kumagae
  • Patent number: 3969310
    Abstract: Silicone rubber compositions consisting essentially of an organopolysiloxane containing in a molecule at least one linearly-linked cyclic siloxane unit and at least two alkenyl groups directly bonded to silicon atoms, an organohydrogenpolysiloxane, and a platinum catalyst. These compositions are cured to form solid elastomers which exhibit a very low permeability to water vapor, and are useful for enclosing electronic units.
    Type: Grant
    Filed: August 21, 1975
    Date of Patent: July 13, 1976
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kunio Itoh, Naohiko Harada, Masaki Tanaka
  • Patent number: 3957717
    Abstract: Organopolysiloxane compositions comprising cyclic diorganosiloxane polymers containing at least two silicon-bonded unsaturated hydrocarbon groups per molecule, organopolysiloxanes composed of the triorganosiloxy and SiO.sub.2 groups, and organohydrogenpolysiloxanes containing at least two silicon-bonded hydrogen atoms per molecule, including platinum catalysts, and fillers are disclosed. Cured products prepared from these materials are safe from cracking and possess excellent mechanical properties as well as very low moisture permeability. The compositions are suitable for various fields of applications including encapsulation of electronic parts.
    Type: Grant
    Filed: April 4, 1975
    Date of Patent: May 18, 1976
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Naohiko Harada, Masaki Tanaka