Abstract: A converter circuit converts AC electric power into DC power. An inverter circuit converts the DC power into AC power. A capacitor is connected in parallel to each of the converter circuit and the inverter circuit between these circuits. The capacitor allows variation of an output voltage from the converter circuit, and absorbs variation of an output voltage from the inverter circuit due to a switching operation. An overvoltage protection circuit includes a resistor and a semiconductor element connected in series to each other. The overvoltage protection circuit is connected in parallel to the capacitor to protect the inverter circuit from an overvoltage. First and second control units respectively control the inverter circuit and the overvoltage protection circuit.

Abstract: According to one embodiment, a control device is connected to a first switching controller and a second switching controller. The control device includes a transmitter/receiver configured to communicate with the first switching controller and the second switching controller, and a timing controller configured to control operation time points of the first switching controller and the second switching controller, based on a first distance corresponding to a distance between a target point corresponding to a point where electromagnetic noise emitted from the first switching controller and the second switching controller is suppressed and the first switching controller, and a second distance corresponding to a distance between the target point and the second switching controller.

Abstract: According to one embodiment, a control device is connected to at least three or a plurality of switching controllers converting AC signals into DC signals and outputting the DC signals or converting DC signals into AC signals and outputting the AC signals. The control device is configured to generate the same number of carrier frequencies as the switching controllers, rearrange the generated carrier frequencies in ascending or descending order and calculate a difference between two adjacent carrier frequencies among the generated carrier frequencies, and if all the calculated differences between adjacent carrier frequencies are different, set one of the generated carrier frequencies as the carrier frequency of one of the switching controllers in order.

Abstract: An anisotropic conductive film in which conductive particles are disposed in an insulating resin layer has a particle disposition of the conductive particles such that a first orthorhombic lattice region being formed by arranging a plurality of arrangement axes of the conductive particles, disposed in an a direction at a predetermined pitch, in a b direction inclined with respect to the a direction at an angle, and a second orthorhombic lattice region being formed by arranging a plurality of arrangement axes of the conductive particles, disposed in the a direction at a predetermined pitch, in a c direction obtained by inverting the b direction with respect to the a direction are repeatedly disposed.

Abstract: An anisotropic conductive film in which conductive particles are disposed in an insulating resin layer has a particle disposition of the conductive particles such that a first orthorhombic lattice region being formed by arranging a plurality of arrangement axes of the conductive particles, disposed in an a direction at a predetermined pitch, in a b direction inclined with respect to the a direction at an angle, and a second orthorhombic lattice region being formed by arranging a plurality of arrangement axes of the conductive particles, disposed in the a direction at a predetermined pitch, in a c direction obtained by inverting the b direction with respect to the a direction are repeatedly disposed. Regardless of the shape of the terminal arrangements and the materials of electronic components, a good conduction state is ensured while the respective terminals hold conductive particles. Further, the occurrence of a short circuit is prevented.

Abstract: A thread-rolling flat die for a threaded fastener, includes a thread-rolling surface including at least a bite surface to which a workpiece of the threaded fastener is supplied, a finishing surface formed adjacent to the bite surface, and a roll-off surface formed adjacent to the finishing surface. The bite surface includes at least: a first partial bite surface having an inclination and a second partial bite surface formed continuously from the first partial bite surface and having an inclination. A length L1 along a thread-rolling direction in the first partial bite surface, a length L3 along the thread-rolling direction in the finishing surface, a length L4 along the thread-rolling direction in the roll-off surface, and a diameter of a processed portion of the workpiece of the threaded fastener have a relationship of L1>L3>L4> the diameter of the processed portion.

Abstract: [Problem to be Solved] A thread-rolling flat die for a threaded fastener capable of long life and a thread-rolling method using the thread-rolling flat die for a threaded fastener are provided. [Means for Solving the Problem] A thread-rolling flat die 1 is provided with a first partial bite surface 15 having an inclination with an angle ? with respect to a finishing surface 13, and a second partial bite surface 16 formed between the first partial bite surface 15 and the finishing surface 13 and having an inclination with an angle ? with respect to the finishing surface 13. A crest angle ?1 of a processing tooth 31 at a thread-rolling starting point 17 in the first partial bite surface 15 is larger than a crest angle ?2 of a processing tooth 31 in the finishing surface 13. Therefore, loads applied to dies 10, 50 can be reduced, and this allows a longer life of the thread-rolling flat die 1.

Abstract: A method of producing an electric component-mounted substrate having a cavity structure is provided. Because a supporting substrate and electric components and are connected together to a first face of a base substrate, the number of steps for the connection is reduced to shorten the producing time. When electric components are to be connected to a second face, the base substrate is supported by the supporting substrate, and the electric components and connected to the first face do not contact a processing table and therefore they undergo no damage. Thus, an electric component-mounted substrate having high reliability can be produced in a short time.

Abstract: A mounting method is provided using a thermocompression head which can mount an electric component in a short time with high connection reliability. The method is provided for mounting an electric component on a wiring board by using a thermocompression head having an elastic pressure bonding member composed of an elastomer on a heatable metal head main body. In the method, after arranging an adhesive agent on a mounting region on the wiring board, an electric component is arranged on a mounting region, and the electric component is bonded on the wiring board by thermocompression by using the thermocompression head. At the time of performing thermocompression bonding, while pressing a top region of the electric component by a metal portion of the head main body, and adhesive in the vicinity of a side portion region of the electric component is pressed by a taper section of the elastic adhesive member.

Abstract: An integrated optical device includes a plurality of semiconductor lasers which emit different wavelengths of laser light, a comparator circuit which compares voltages across terminals of the respective plurality of semiconductor lasers, and outputs a signal depending on the comparison result, a light-receiving element which outputs a photocurrent depending on the amounts of laser light emitted from the plurality of semiconductor lasers, and a current mirror circuit which switches between amplification and attenuation with respect to the photocurrent output from the light-receiving element based on the signal output from the comparator circuit, and outputs a monitor signal.

Abstract: An optical semiconductor device includes a phototransistor for receiving incident light. The phototransistor includes a collector layer of a first conductivity type formed on a semiconductor substrate, a base layer of a second conductivity type formed on the collector layer, and an emitter layer of a first conductivity type formed on the base layer. A thickness of the emitter layer is equal to or less than an absorption length of the incident light in the semiconductor substrate.

Abstract: A test circuit for testing not only characteristics of a current-voltage conversion circuit in which a light-receiving element is used but also characteristics of the light-receiving element includes: a current-mirror circuit 110 including a bipolar transistor Q1 and a bipolar transistor Q2 which are electrically connected to a light-receiving element PD1; a dummy light-receiving element PD_D which is an element identical to the light-receiving element PD1 and is equivalent in characteristics to the light-receiving element PD1; and a test terminal TP which is electrically connected to the bipolar transistor Q1 and the dummy light-receiving element PD_D.

Abstract: A connecting part for ensuring a secure connection includes first connecting terminals that are arranged on one face of a supporting member and second connecting terminals that are arranged on the back face of the supporting member. The supporting member may have an elastic body. The connecting terminals are interconnected by conductive films which are formed on the face of the supporting member. Connecting parts are arranged between circuit boards on which electronic parts are mounted, and the circuit boards are mutually fixed in the state in which the connecting parts are compressed. The first and second connecting terminals are pushed against lands on the circuit boards by restoring force of the connecting parts, and then the circuit boards are electrically interconnected.

Abstract: A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead is electrically connected with the integrated circuit device via an electrode. The integrated circuit device and the substrate are encapsulated with an encapsulation section. The substrate has an opening at a position above the photo detecting part.

Abstract: A mounting method is provided using a thermocompression head which can mount an electric component in a short time with high connection reliability. The method is provided for mounting an electric component on a wiring board by using a thermocompression head having an elastic pressure bonding member composed of an elastomer on a heatable metal head main body. In the method, after arranging an adhesive agent on a mounting region on the wiring board, an electric component is arranged on a mounting region, and the electric component is bonded on the wiring board by thermocompression by using the thermocompression head. At the time of performing thermocompression bonding, while pressing a top region of the electric component by a metal portion of the head main body, and adhesive in the vicinity of a side portion region of the electric component is pressed by a taper section of the elastic adhesive member.

Abstract: A transistor that forms an integrated circuit, a photo detector and a micromirror are mounted on the same semiconductor substrate in an optical semiconductor device of the present invention, which has an antireflection film that is formed on the photo detector, a first insulating film which is formed on the antireflection film and in which an opening is created in the state where the antireflection film is exposed, and an etching stopping film which is formed on the first insulating film and which has been left in the periphery around the opening in the first insulating film on the antireflection film and in the periphery around the portion above the micromirror.

Abstract: A photo detector IC (PDIC) is connected with a flexible printed circuit board (FPC). A signal converted into a voltage through light-to-voltage conversion in the PDIC is connected with the drain of a field effect transistor (FET), while the source of the FET is connected to an output terminal. A signal from the output terminal is input into a signal processing board of the main body via the FPC serving as an equivalent circuit composed of a coil and a capacitor. The gate of the FET is connected with a variable voltage source. Peaking occurs due to inductor components and capacitance components of the FPC. However, by application of voltage to the variable voltage source, the gate voltage value of the FET is adjusted to be an optimal value, whereby the peaking is suppressed by the on-resistance of the FET.

Abstract: The test circuit according to the present invention includes: a plurality of light-receiving elements; a plurality of amplifiers, each of which converts, into a voltage, a photoelectric current supplied from one of the light-receiving elements; and an electric current supplying unit which supplies an electric current to each of the light-receiving elements and each of the amplifiers.

Abstract: The present invention provides a thermocompression bonding head capable of mounting an electric component on a wiring board in a short time with high connection reliability, and provides a mounting device using the same. A thermocompression bonding head 3 includes a heatable metal head body 5 having an elastic pressure-bonding member 7 made of elastomer and a metal pressing member 5b. The metal pressing member 5b, corresponding to an electric component 20 as a target to be bonded with pressure, is provided as a united body with the head body 5, and the elastic pressure-bonding member 7 is attached to the head body 5 such that a pressing surface 50 of the metal pressing member 5b is exposed in a recessed state on the periphery of the metal pressing member 5b. The head body 5 is made of a frame-shaped member having a concave portion 5a, and the metal pressing member 5b is integrally formed in the concave portion 5a of the head body 5.

Abstract: A method of producing an electric component-mounted substrate having a cavity structure is provided. Because a supporting substrate and electric components and are connected together to a first face of a base substrate, the number of steps for the connection is reduced to shorten the producing time. When electric components are to be connected to a second face, the base substrate is supported by the supporting substrate, and the electric components and connected to the first face do not contact a processing table and therefore they undergo no damage. Thus, an electric component-mounted substrate having high reliability can be produced in a short time.