Patents by Inventor Masaki Taya

Masaki Taya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10937708
    Abstract: A power module that can realize insulation performance by suppressing the occurrence of bubbles in silicone gel and the detachment between the silicone gel and an insulating substrate during high temperature, during low temperature and during low atmospheric pressure, to thereby suppress degradation of insulation performance. The power module includes: an insulating substrate having a front surface on which a power semiconductor element is mounted; a base plate joined to a back surface of the insulating substrate; a case fixed to the base plate and surrounding the insulating substrate; a cover fixed to the case and forming a sealed region; and a silicone gel serving as a filling member filling the entire sealed region and having internal stress maintained at compressive stress.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: March 2, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Masaki Taya
  • Patent number: 10857461
    Abstract: At least one processor of a game control device is configured to: acquire a movement direction of the touch position, when a touch position moves under a state in which a touch panel is being touched; execute first game processing based on the movement direction; detect that the movement direction has changed to any movement direction having an angle of a predetermined angle or more with respect to a movement direction acquired at a predetermined timing; and execute second game processing based on one of the movement direction before the change and the movement direction after the change, when the change in the movement direction is detected.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: December 8, 2020
    Assignee: KONAMI DIGITAL ENTERTAINMENT CO., LTD.
    Inventors: Masaki Nakamura, Yuji Fujishiro, Kenta Ogawa, Yugo Kishino, Kei Masuda, Junichi Taya, Hideto Nishiyama, Taku Hamasaki
  • Patent number: 10773154
    Abstract: At least one processor of a game control device is configured to: display an object on a display region, in a game in which the object is moved in accordance with an operation of a user on a touch panel; set a first region of the display region as an operation region; move the object based on the operation of the user on the operation region; and change the operation region to a second region, in which the object is prevented from being arranged at an edge portion of the second region, in a predetermined game situation, which is one of a situation in which at least a part of the object is outside the first region and a situation in which the object is arranged at an edge portion of the first region.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: September 15, 2020
    Assignee: KONAMI DIGITAL ENTERTAINMENT CO., LTD.
    Inventors: Masaki Nakamura, Yuji Fujishiro, Kenta Ogawa, Yugo Kishino, Kei Masuda, Junichi Taya, Hideto Nishiyama, Taku Hamasaki
  • Patent number: 10720368
    Abstract: A semiconductor device includes: an insulating substrate having an upper surface on which a semiconductor element is mounted; a base plate joined to a lower surface of the insulating substrate; a case member that surrounds the insulating substrate and that is in contact with a surface of the base plate to which the insulating substrate is joined; a sealing resin provided in a region surrounded by the base plate and the case member; a cover member facing a surface of the sealing resin and fixed to the case member; and a holding plate, a lower surface of the holding plate and a portion of a side surface of the holding plate being in close contact with the surface of the sealing resin, an upper surface of the holding plate being fixed to and protruding from a surface of the cover member facing the surface of the sealing resin.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: July 21, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hiroyuki Harada, Kozo Harada, Yasumichi Hatanaka, Takashi Nishimura, Masaki Taya
  • Publication number: 20200038746
    Abstract: At least one memory device of a game system stores a plurality of instructions, which, when executed by at least one processor, cause the at least one processor to: set, on a touch panel, a reception area for receiving a direction designation operation; move, in accordance with a movement of a touch position on the touch panel, an operation position in a direction corresponding to a moving direction of the touch position by a distance longer than a moving distance of the touch position; acquire a designated direction based on a direction from a reference position corresponding to the reception area to the operation position; and execute game processing based on the designated direction.
    Type: Application
    Filed: September 26, 2019
    Publication date: February 6, 2020
    Inventors: Masaki NAKAMURA, Yugo KISHINO, Yuji FUJISHIRO, Kenta OGAWA, Hideki YANAGIHARA, Kei MASUDA, Junichi TAYA, Hideto NISHIYAMA, Taku HAMASAKI
  • Publication number: 20190371686
    Abstract: A semiconductor device includes: an insulating substrate having an upper surface on which a semiconductor element is mounted; a base plate joined to a lower surface of the insulating substrate; a case member that surrounds the insulating substrate and that is in contact with a surface of the base plate to which the insulating substrate is joined; a sealing resin provided in a region surrounded by the base plate and the case member; a cover member facing a surface of the sealing resin and fixed to the case member; and a holding plate, a lower surface of the holding plate and a portion of a side surface of the holding plate being in close contact with the surface of the sealing resin, an upper surface of the holding plate being fixed to and protruding from a surface of the cover member facing the surface of the sealing resin.
    Type: Application
    Filed: December 14, 2016
    Publication date: December 5, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hiroyuki HARADA, Kozo HARADA, Yasumichi HATANAKA, Takashi NISHIMURA, Masaki TAYA
  • Patent number: 10468315
    Abstract: The power module includes: an insulating substrate having an upper surface on which a semiconductor element is mounted; a base plate joined to a lower surface of the insulating substrate; a case member surrounding the insulating substrate and adhered to the base plate; a sealing resin provided in a region surrounded by the base plate and the case member, so as to seal the insulating substrate; and a holding plate projecting from an inner wall of the case member to above an outer peripheral portion of the insulating substrate, the holding plate being fixed to the inner wall, the holding plate being in contact with the sealing resin.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: November 5, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kozo Harada, Hiroyuki Harada, Yasumichi Hatanaka, Takashi Nishimura, Masaki Taya
  • Publication number: 20190262700
    Abstract: At least one processor of a game control device is configured to: display an object on a display region, in a game in which the object is moved in accordance with an operation of a user on a touch panel; set a first region of the display region as an operation region; move the object based on the operation of the user on the operation region; and change the operation region to a second region, in which the object is prevented from being arranged at an edge portion of the second region, in a predetermined game situation, which is one of a situation in which at least a part of the object is outside the first region and a situation in which the object is arranged at an edge portion of the first region.
    Type: Application
    Filed: May 15, 2019
    Publication date: August 29, 2019
    Inventors: Masaki NAKAMURA, Yuji FUJISHIRO, Kenta OGAWA, Yugo KISHINO, Kei MASUDA, Junichi TAYA, Hideto NISHIYAMA, Taku HAMASAKI
  • Publication number: 20190262709
    Abstract: At least one processor of a game control device is configured to: acquire a movement direction of the touch position, when a touch position moves under a state in which a touch panel is being touched; execute first game processing based on the movement direction; detect that the movement direction has changed to any movement direction having an angle of a predetermined angle or more with respect to a movement direction acquired at a predetermined timing; and execute second game processing based on one of the movement direction before the change and the movement direction after the change, when the change in the movement direction is detected.
    Type: Application
    Filed: May 15, 2019
    Publication date: August 29, 2019
    Inventors: Masaki NAKAMURA, Yuji FUJISHIRO, Kenta OGAWA, Yugo KISHINO, Kei MASUDA, Junichi TAYA, Hideto NISHIYAMA, Taku HAMASAKI
  • Publication number: 20190214322
    Abstract: A power module that can realize insulation performance by suppressing the occurrence of bubbles in silicone gel and the detachment between the silicone gel and an insulating substrate during high temperature, during low temperature and during low atmospheric pressure, to thereby suppress degradation of insulation performance. The power module includes: an insulating substrate having a front surface on which a power semiconductor element is mounted; a base plate joined to a back surface of the insulating substrate; a case fixed to the base plate and surrounding the insulating substrate; a cover fixed to the case and forming a sealed region; and a silicone gel serving as a filling member filling the entire sealed region and having internal stress maintained at compressive stress.
    Type: Application
    Filed: July 28, 2017
    Publication date: July 11, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventor: Masaki TAYA
  • Publication number: 20180323120
    Abstract: The power module includes: an insulating substrate having an upper surface on which a semiconductor element is mounted; a base plate joined to a lower surface of the insulating substrate; a case member surrounding the insulating substrate and adhered to the base plate; a sealing resin provided in a region surrounded by the base plate and the case member, so as to seal the insulating substrate; and a holding plate projecting from an inner wall of the case member to above an outer peripheral portion of the insulating substrate, the holding plate being fixed to the inner wall, the holding plate being in contact with the sealing resin.
    Type: Application
    Filed: November 1, 2016
    Publication date: November 8, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kozo HARADA, Hiroyuki HARADA, Yasumichi HATANAKA, Takashi NISHIMURA, Masaki TAYA
  • Publication number: 20180068918
    Abstract: A power module will be provided which can suppress insulation performance deterioration caused by heat cycle to ensure insulation performance, by suppressing generation of bubbles and occurrence of detachments between silicone gel and an insulating substrate at a high or low temperature or at a high working voltage.
    Type: Application
    Filed: February 19, 2016
    Publication date: March 8, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventor: Masaki TAYA
  • Patent number: 9736943
    Abstract: A power module includes: a plurality of partition wall plates that are provided in a case and form a trench; a plurality of relay terminals whose electric potentials are different, that are formed so that the plurality of partition wall plates are positioned therebetween and that are formed to be opposed with each other; a printed circuit board to which the plurality of relay terminals is connected and which is provided with a slit at a position opposing the trench; and a shielding plate that is placed so that one end portion of the shielding plate is positioned in the trench, and so that an amount by which the other end portion thereof protrudes from the slit is larger than amounts by which the relay terminals protrude from the printed circuit board. The power module ensures insulation inside the power module.
    Type: Grant
    Filed: May 19, 2014
    Date of Patent: August 15, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventor: Masaki Taya
  • Patent number: 9673118
    Abstract: A power module providing an improved manufacture yield and having an ensured stable joint strength and accordingly improved reliability is provided. The power module includes: a base portion having one surface on which an electrode portion is formed; a conductor portion disposed to face the one surface of the base portion on which the electrode portion is formed, for making electrical connection with the outside; and an interconnect portion connected to the electrode portion formed on the one surface of the base portion and to the surface of the conductor portion facing the one surface of the base portion for electrically connecting the electrode portion to the conductor portion.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: June 6, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventor: Masaki Taya
  • Patent number: 9521737
    Abstract: In a power module, a power semiconductor element is mounted on a heat dissipation substrate having a tilted part formed at an end portion thereof, a resin case is arranged so as to surround the power semiconductor element and to contact the heat dissipation substrate, and a cooling fin is arranged so as to contact a surface of the heat dissipation substrate opposite a surface of the heat dissipation substrate on which the power semiconductor element is mounted. The power module includes pressure member contacting the tilted part of the heat dissipation substrate to press the heat dissipation substrate against the cooling fin.
    Type: Grant
    Filed: May 20, 2013
    Date of Patent: December 13, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shinichi Izuo, Masaki Taya, Taichi Obara, Nobuya Nishida
  • Publication number: 20160300770
    Abstract: A power module providing an improved manufacture yield and having an ensured stable joint strength and accordingly improved reliability is provided. The power module includes: a base portion having one surface on which an electrode portion is formed; a conductor portion disposed to face the one surface of the base portion on which the electrode portion is formed, for making electrical connection with the outside; and an interconnect portion connected to the electrode portion formed on the one surface of the base portion and to the surface of the conductor portion facing the one surface of the base portion for electrically connecting the electrode portion to the conductor portion.
    Type: Application
    Filed: July 31, 2014
    Publication date: October 13, 2016
    Applicant: Mitsubishi Electric Corporation
    Inventor: Masaki TAYA
  • Publication number: 20160157351
    Abstract: A power module includes: a plurality of partition wall plates that are provided in a case and form a trench; a plurality of relay terminals whose electric potentials are different, that are formed so that the plurality of partition wall plates are positioned therebetween and that are formed to be opposed with each other; a printed circuit board to which the plurality of relay terminals is connected and which is provided with a slit at a position opposing the trench; and a shielding plate that is placed so that one end portion of the shielding plate is positioned in the trench, and so that an amount by which the other end portion thereof protrudes from the slit is larger than amounts by which the relay terminals protrude from the printed circuit board. The power module ensures insulation inside the power module.
    Type: Application
    Filed: May 19, 2014
    Publication date: June 2, 2016
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Masaki TAYA
  • Publication number: 20150289356
    Abstract: In a power module, a power semiconductor element is mounted on a heat dissipation substrate having a tilted part formed at an end portion thereof, a resin case is arranged so as to surround the power semiconductor element and to contact the heat dissipation substrate, and a cooling fin is arranged so as to contact a surface of the heat dissipation substrate opposite a surface of the heat dissipation substrate on which the power semiconductor element is mounted. The power module includes pressure member contacting the tilted part of the heat dissipation substrate to press the heat dissipation substrate against the cooling fin.
    Type: Application
    Filed: May 20, 2013
    Publication date: October 8, 2015
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shinichi Izuo, Masaki Taya, Taichi Obara, Nobuya Nishida