Abstract: A current sensor is configured such that at least one magnetoelectric conversion element, a conductor, a signal processing IC, an IC supporting portion, and an element supporting portion are encapsulated with an encapsulating portion. The current sensor is comprised of a pair of first lead terminals that is partially exposed outside the encapsulating portion, is electrically connected to the conductor, inputs a measurement current to the conductor, and outputs the measurement current from the conductor; and a metal member that is partially exposed outside the encapsulating portion and is spaced apart from the conductor. The element supporting portion further supports the metal member on a surface on the same side as a first surface on which the IC supporting portion supports the signal processing IC.

Abstract: A current sensor is configured by at least one magnetoelectric conversion element, a conductor, and a signal processing IC being encapsulated by an encapsulating portion. The current sensor includes a pair of first lead terminals that is partially exposed outside of the encapsulating portion, is electrically connected to the conductor, inputs the measurement current to the conductor, and outputs the measurement current from the conductor; a metal member that is partially exposed outside the encapsulating portion and is spaced apart from the conductor; and a supporting portion that supports the at least one magnetoelectric conversion element, the signal processing IC, and the metal member on a first surface, is separated from the conductor, and is separate from the metal member.

Abstract: A current sensor is configured such that at least one magnetoelectric conversion element, a conductor, and a signal processing IC are encapsulated with an encapsulating portion. The current sensor is comprised of a pair of first lead terminals that is partially exposed on a side surface of the encapsulating portion, is electrically connected to the conductor, inputs a measurement current to the conductor, and outputs the measurement current from the conductor; a metal member that is partially exposed on a side surface of the encapsulating portion and is spaced apart from the conductor; and an element supporting portion that is comprised of a metal plate or a semiconductor substrate, supports the at least one magnetoelectric conversion element and a metal member on a surface on a same side as the first surface, and is spaced apart from the conductor.

Abstract: A current sensor is configured such that at least one magnetoelectric conversion element, a conductor, a signal processing IC, an IC supporting portion, and an element supporting portion are encapsulated with an encapsulating portion. The current sensor is comprised of a pair of first lead terminals that is partially exposed outside the encapsulating portion, is electrically connected to the conductor, inputs a measurement current to the conductor, and outputs the measurement current from the conductor; and a metal member that is partially exposed outside the encapsulating portion and is spaced apart from the conductor. The element supporting portion further supports the metal member on a surface on the same side as a first surface on which the IC supporting portion supports the signal processing IC.

Abstract: A current sensor includes at least one magnetoelectric conversion element, a conductor that at least partially surrounds the at least one magnetoelectric conversion element in a plan view and through which a measurement current to be measured with the at least one magnetoelectric conversion element flows, an element supporting portion comprised of a semiconductor substrate, and supports the at least one magnetoelectric conversion element and the conductor on a first surface, a signal processing IC that processes a signal that is output from the at least one magnetoelectric conversion element, an encapsulating portion that encapsulates the at least one magnetoelectric conversion element, the conductor, and the signal processing IC, and a pair of first lead terminals that is partially exposed on a side surface of the encapsulating portion and is electrically connected to the conductor, inputs the measurement current to the conductor and outputs the measurement current from the conductor.

Abstract: A current sensor is configured by at least one magnetoelectric conversion element, a conductor, and a signal processing IC being encapsulated by an encapsulating portion. The current sensor includes a pair of first lead terminals that is partially exposed outside of the encapsulating portion, is electrically connected to the conductor, inputs the measurement current to the conductor, and outputs the measurement current from the conductor; a metal member that is partially exposed outside the encapsulating portion and is spaced apart from the conductor; and a supporting portion that supports the at least one magnetoelectric conversion element, the signal processing IC, and the metal member on a first surface, is separated from the conductor, and is separate from the metal member.

Abstract: A modular jack is composed of: a base connector installed on a printed circuit board, and a socket connector with a parallel crank mechanism at an extremity thereof, the parallel crank mechanism being slidably connected to the base connector and switching an upper housing between a raised state and a lowered state. When the upper housing is laid toward the front side of the socket connector, the socket connector can be housed inside the casing and both faces of the upper housing, the socket housing, and the base housing are made in a flat plate-like shape. This contributes to height reduction in the modular jack. The socket connector is configured such that, when the upper housing is pulled out from a side face of the casing and raised outside the casing, a plug can be electrically connected to the socket connector.

Abstract: A modular jack is composed of: a base connector installed on a printed circuit board, and a socket connector with a parallel crank mechanism at an extremity thereof, the parallel crank mechanism being slidably connected to the base connector and switching an upper housing between a raised state and a lowered state. When the upper housing is laid toward the front side of the socket connector, the socket connector can be housed inside the casing and both faces of the upper housing, the socket housing, and the base housing are made in a flat plate-like shape. This contributes to height reduction in the modular jack. The socket connector is configured such that, when the upper housing is pulled out from a side face of the casing and raised outside the casing, a plug can be electrically connected to the socket connector.

Abstract: An IC card includes a frame of a rectangular border-shape, a printed circuit board, and one pair of shells. The printed circuit board is disposed on an interior portion of the frame and equips an electronic component. The one pair of shells cover the area surrounded by the frame with both faces of the shells, and constitute an outer shell of the IC card. One of the shells has a plurality of intermittent bent pieces on a periphery thereof. The bent pieces face an edge portion of the frame. The bent pieces establish one pair of hook pieces which protrude from a plate thickness surface (a flat side) on a front end portion thereof. Ultrasonic vibration is applied to a front end portion of the bent pieces while an edge portion of the frame is subjected to pressure, joining the bent pieces to the frame.

Abstract: An ultrasonic weld is provided in a cover component, is formed protruding from the cover component, and is provided so that it can join the cover component and the body component together by being fixed to the body component with ultrasonic welding. A locking mechanism is provided so that it can join the cover component and the body component together via engaging portions that engage with each other. The locking mechanism includes a first engaging portion provided in the cover component, and a second engaging portion that is provided in another component fixed to the body component, and that can engage with the first engaging portion. Thus, it is possible to decrease the number of components, and also reduce equipment costs and production control costs.

Abstract: There is provided a mounting apparatus capable of forming dicing tapes in the process of feeding-out a strip material, and sticking the dicing tape to a ring frame to fix a semiconductor wafer. The mounting apparatus 10 sticks the dicing tape to the ring frame RF to fix the semiconductor wafer to the ring frame in a state that the ring frame RF and the semiconductor wafer W are disposed on a table 11. The mounting apparatus 10 includes a pre-cut means 13 for forming a cut L in a state of half cut in a film FL of a strip material A to form a dicing tape T in the process of feeding out the strip material A and a sticking means 34 for peeling off the dicing tape from a base sheet S to stick the dicing tape to the ring frame RF.

Abstract: The present invention provides a card connector that can be loaded on a double-sided printed circuit board and allows intergration of components using common components. A first and a second housing 1, 2 have a pair of cranked hook-shaped projections 17. A first and a second covering plate 5, 6 have a cranked hook-shaped opening 57. The first covering plate 5 can be joined to the second housing 2 by reversing in a left-right direction the first covering plate 5. The second covering plate 6 can be joined to the first housing 1 by reversing in a left-right direction the second covering plate 6. The first and the second housings 1, 2, and the first and the second covering plates 5, 6 can be used as common parts, respectively.

Abstract: An IC card includes a frame with a rectangular border open on one side, a printed circuit board equipping an electronic component, a plate-shaped connector, and one pair of conductive shell plates. The connector constitutes one side of the frame. The one pair of shell plates covers both faces of the frame and the connector. The connector has a housing, a plurality of male contacts arranged in parallel in the interior of the housing, and a short circuit terminal. The male contacts are such that one end portion is a connecting portion to an external terminal and another end portion is connected to the printed circuit board. The short circuit terminals are mounted on the housing such that one end portion is in contact with a predetermined male contact among the plurality of male contacts and another end portion is in contact with an inner wall of a shell plate.

Abstract: A peeling apparatus 10 includes a peeling table 11 supporting a wafer W on which a sheet S is stuck and a sheet peeling unit 12 disposed above the peeling table 11, in which sheet S can be peeled off with relative movement of the sheet peeling unit 12 and the peeling table 11. The peeling apparatus 10 includes a support roll 20 of peeling tape PT, first and second rolls 30, 31 bonding the peeling tape PT to the sheet S surface, and a winding roll 21 of the peeling tape PT. Peeling-off is performed in a state of forming an initial peeling angle a1 such that a peeling tape PT is folded in an aperture C formed between the second roll 31 and the sheet S, and afterwards the sheet S is peeled off at subsequent peeling angle a2 corresponding to a diameter of the second roll 31.

Abstract: A card connector includes a housing inserted a card therein, a slider, a rotating cam member having a shaft portion that is retained so as to be rotatable by the slider, and a compression coil spring that biases the rotating cam member. The slider includes second chevron teeth that engage with first chevron teeth provided at an end of the rotating cam member. The rotating cam member is provided with a first broad protrusion and a second narrow protrusion alternately at an outer circumference of the shaft portion. When inserting the card, since the rotating cam member turns by a predetermined angle so that the first protrusion faces the starting end of the passage groove, the slider is locked. When pushing the card again, since the rotating cam member turns by a predetermined angle, the second protrusion faces the starting end of the passage groove, the card can be ejected.

Abstract: The electronic card of the present invention enables prevention of failure of an electronic circuit incorporated in the electronic card by establishing an electrostatic shielding unit. A connector has a plurality of contacts and a housing. A container case has a side facing a face of one side of the substrate on which an electronic circuit is imprinted, and a first shell and a second shell of electrically conductive material positioned on a side facing the face of the other side of the substrate, respectively. An opening is established on a front end section relating to insertion and removal of the connector in a housing, and is held in a state in which contacts are exposed internally. An electrostatic shielding unit is of electrically conductive material that is electrically connected to the container case, and is positioned in an exposed state on a surface of the above-mentioned front end section.

Abstract: A wafer W is supported on the rear surface side thereof by a ring frame R by means of a dicing tape T, and a protection tape H is stuck on the front surface side the wafer W. A suction unit 12 includes a table 16 having a suction face 15 in the upper face. The suction face 15 sucks the dicing tape T to hold the wafer W through performing a predetermined suction. At least in a partial area along the periphery of the suction face 15, a groove 24 is formed. By sucking through the suction face 15, the inside of the groove 24 becomes negative pressure and the dicing tape T is sunk therein.

Abstract: An ultrasonic weld is provided in a cover component, is formed protruding from the cover component, and is provided so that it can join the cover component and the body component together by being fixed to the body component with ultrasonic welding. A locking mechanism is provided so that it can join the cover component and the body component together via engaging portions that engage with each other. The locking mechanism includes a first engaging portion provided in the cover component, and a second engaging portion that is provided in another component fixed to the body component, and that can engage with the first engaging portion. Thus, it is possible to decrease the number of components, and also reduce equipment costs and production control costs.

Abstract: An IC card includes a frame of a rectangular border-shape, a printed circuit board, and one pair of shells. The printed circuit board is disposed on an interior portion of the frame and equips an electronic component. The one pair of shells cover the area surrounded by the frame with both faces of the shells, and constitute an outer shell of the IC card. One of the shells has a plurality of intermittent bent pieces on a periphery thereof. The bent pieces face an edge portion of the frame. The bent pieces establish one pair of hook pieces which protrude from a plate thickness surface (a flat side) on a front end portion thereof. Ultrasonic vibration is applied to a front end portion of the bent pieces while an edge portion of the frame is subjected to pressure, joining the bent pieces to the frame.

Abstract: An IC card includes a frame with a rectangular border open on one side, a printed circuit board equipping an electronic component, a plate-shaped connector, and one pair of conductive shell plates. The connector constitutes one side of the frame. The one pair of shell plates covers both faces of the frame and the connector. The connector has a housing, a plurality of male contacts arranged in parallel in the interior of the housing, and a short circuit terminal. The male contacts are such that one end portion is a connecting portion to an external terminal and another end portion is connected to the printed circuit board. The short circuit terminals are mounted on the housing such that one end portion is in contact with a predetermined male contact among the plurality of male contacts and another end portion is in contact with an inner wall of a shell plate.