Abstract: There is provided a current sensor including: a conductor having a first terminal portion for inputting a current and a second terminal portion for outputting the current which are arranged on one side in a first axial direction, the second terminal portion being separated from the first terminal portion in a second axial direction intersecting the first axial direction, a turn portion which is arranged on another side in the first axial direction, a first body portion which connects one end of the turn portion and the first terminal portion, and a second body portion which is separated from the first body portion in the second axial direction, to connect another end of the turn portion and the second terminal portion; a magnetic sensor which is arranged on the conductor or near the conductor; and a package.

Abstract: A floating connector includes a movable housing accommodated in an accommodation portion of a stationary housing in a loosely fitted state and a terminal integrally formed of a single member. The terminal includes a first fixed portion fixed to a first fixing portion of the stationary housing, a second fixed portion fixed to a second fixing portion of the movable housing, a mating terminal fitting portion, and an elastic portion coupling the first fixed portion and the second fixed portion. The elastic portion is elastically deformable along with movement of the movable housing with respect to three orthogonal directions including a connector fitting direction.

Abstract: A current sensor is configured such that at least one magnetoelectric conversion element, a conductor, and a signal processing IC are encapsulated with an encapsulating portion. The current sensor is comprised of a pair of first lead terminals that is partially exposed on a side surface of the encapsulating portion, is electrically connected to the conductor, inputs a measurement current to the conductor, and outputs the measurement current from the conductor; a metal member that is partially exposed on a side surface of the encapsulating portion and is spaced apart from the conductor; and an element supporting portion that is comprised of a metal plate or a semiconductor substrate, supports the at least one magnetoelectric conversion element and a metal member on a surface on a same side as the first surface, and is spaced apart from the conductor.

Abstract: A current sensor comprises a first lead frame, a signal processing IC, first and second magnetoelectric conversion elements, and a second lead frame that partially surrounds the first and second magnetoelectric conversion elements. In a plan view, the first and second magnetoelectric conversion elements may oppose each other with an intermediate portion, through which a current flows in a second direction that intersects with a first direction from the first magnetoelectric conversion element toward the second magnetoelectric conversion element, sandwiched therebetween. First wires may extend in a direction different from the second magnetoelectric conversion element side in the plan view, and be electrically connected to the signal processing IC without traversing the second lead frame. Second wires may extend in a direction different from the first magnetoelectric conversion element side in the plan view, and be electrically connected to the signal processing IC without traversing the second lead frame.

Abstract: A current sensor is configured by at least one magnetoelectric conversion element, a conductor, and a signal processing IC being encapsulated by an encapsulating portion. The current sensor includes a pair of first lead terminals that is partially exposed outside of the encapsulating portion, is electrically connected to the conductor, inputs the measurement current to the conductor, and outputs the measurement current from the conductor; a metal member that is partially exposed outside the encapsulating portion and is spaced apart from the conductor; and a supporting portion that supports the at least one magnetoelectric conversion element, the signal processing IC, and the metal member on a first surface, is separated from the conductor, and is separate from the metal member.

Abstract: An electrical connector includes a housing and a contact having a bellows contact structure. The contact has a substantially rectangular parallelepiped frame body including an upper-surface portion, a lower-surface portion, and a pair of side surface portions facing each other therebetween. At one end of the substantially rectangular parallelepiped frame body in a longitudinal direction, a contact-spring portion for contacting with a mating terminal is provided. At the other end of the substantially rectangular parallelepiped frame body in the longitudinal direction, a fixing portion that is fixed to the housing is provided. The contact has an elastic structure that is included in the substantially rectangular parallelepiped frame body interposed between the contact-spring portion and the fixing portion. The elastic structure of the contact is segmented into the upper-surface portion, the pair of side-surface portions, and the lower-surface portion of the substantially rectangular parallelepiped frame body.

Abstract: A current sensor may include a first support portion and a first lead frame which is made of a material different from that of the first support portion. The current sensor may include: a signal processing IC which has a first surface supported by a first surface of the first support portion and is electrically connected to the first lead frame; at least one magnetoelectric conversion element which is configured separately from the signal processing IC, is mounted on a second surface on a side opposite to the first surface of the signal processing IC, and outputs, to the signal processing IC, a signal processed by the signal processing IC; and a second lead frame which has a second terminal portion, at least a part of which is arranged to face the second surface of the signal processing IC, and through which a measurement current flows.

Abstract: A current sensor is configured such that at least one magnetoelectric conversion element, a conductor, a signal processing IC, an IC supporting portion, and an element supporting portion are encapsulated with an encapsulating portion. The current sensor is comprised of a pair of first lead terminals that is partially exposed outside the encapsulating portion, is electrically connected to the conductor, inputs a measurement current to the conductor, and outputs the measurement current from the conductor; and a metal member that is partially exposed outside the encapsulating portion and is spaced apart from the conductor. The element supporting portion further supports the metal member on a surface on the same side as a first surface on which the IC supporting portion supports the signal processing IC.

Abstract: A current sensor includes at least one magnetoelectric conversion element, a conductor that at least partially surrounds the at least one magnetoelectric conversion element in a plan view and through which a measurement current to be measured with the at least one magnetoelectric conversion element flows, an element supporting portion comprised of a semiconductor substrate, and supports the at least one magnetoelectric conversion element and the conductor on a first surface, a signal processing IC that processes a signal that is output from the at least one magnetoelectric conversion element, an encapsulating portion that encapsulates the at least one magnetoelectric conversion element, the conductor, and the signal processing IC, and a pair of first lead terminals that is partially exposed on a side surface of the encapsulating portion and is electrically connected to the conductor, inputs the measurement current to the conductor and outputs the measurement current from the conductor.

Abstract: A current sensor is configured such that at least one magnetoelectric conversion element, a conductor, and a signal processing IC are encapsulated with an encapsulating portion. The current sensor is comprised of a pair of first lead terminals that is partially exposed on a side surface of the encapsulating portion, is electrically connected to the conductor, inputs a measurement current to the conductor, and outputs the measurement current from the conductor; a metal member that is partially exposed on a side surface of the encapsulating portion and is spaced apart from the conductor; and an element supporting portion that is comprised of a metal plate or a semiconductor substrate, supports the at least one magnetoelectric conversion element and a metal member on a surface on a same side as the first surface, and is spaced apart from the conductor.

Abstract: A current sensor is configured by at least one magnetoelectric conversion element, a conductor, and a signal processing IC being encapsulated by an encapsulating portion. The current sensor includes a pair of first lead terminals that is partially exposed outside of the encapsulating portion, is electrically connected to the conductor, inputs the measurement current to the conductor, and outputs the measurement current from the conductor; a metal member that is partially exposed outside the encapsulating portion and is spaced apart from the conductor; and a supporting portion that supports the at least one magnetoelectric conversion element, the signal processing IC, and the metal member on a first surface, is separated from the conductor, and is separate from the metal member.

Abstract: Provided is an electrical connector capable of suppressing damage to a contact and facilitating insertion of a plug connector into an insertion opening. A base connector (10), which has an insertion opening (13a) into which a plug connector (2) is inserted, includes a pair of guide portions (14b) that are provided so as to be capable of protruding and retracting from both width-direction sides of the insertion opening (13a), and that guide both width-direction sides of the plug connector (2) that moves toward the insertion opening (13a).

Abstract: A current sensor is configured such that at least one magnetoelectric conversion element, a conductor, and a signal processing IC are encapsulated with an encapsulating portion. The current sensor is comprised of a pair of first lead terminals that is partially exposed on a side surface of the encapsulating portion, is electrically connected to the conductor, inputs a measurement current to the conductor, and outputs the measurement current from the conductor; a metal member that is partially exposed on a side surface of the encapsulating portion and is spaced apart from the conductor; and an element supporting portion that is comprised of a metal plate or a semiconductor substrate, supports the at least one magnetoelectric conversion element and a metal member on a surface on a same side as the first surface, and is spaced apart from the conductor.

Abstract: A current sensor is configured such that at least one magnetoelectric conversion element, a conductor, a signal processing IC, an IC supporting portion, and an element supporting portion are encapsulated with an encapsulating portion. The current sensor is comprised of a pair of first lead terminals that is partially exposed outside the encapsulating portion, is electrically connected to the conductor, inputs a measurement current to the conductor, and outputs the measurement current from the conductor; and a metal member that is partially exposed outside the encapsulating portion and is spaced apart from the conductor. The element supporting portion further supports the metal member on a surface on the same side as a first surface on which the IC supporting portion supports the signal processing IC.

Abstract: A current sensor is configured by at least one magnetoelectric conversion element, a conductor, and a signal processing IC being encapsulated by an encapsulating portion. The current sensor includes a pair of first lead terminals that is partially exposed outside of the encapsulating portion, is electrically connected to the conductor, inputs the measurement current to the conductor, and outputs the measurement current from the conductor; a metal member that is partially exposed outside the encapsulating portion and is spaced apart from the conductor; and a supporting portion that supports the at least one magnetoelectric conversion element, the signal processing IC, and the metal member on a first surface, is separated from the conductor, and is separate from the metal member.

Abstract: A current sensor is configured such that at least one magnetoelectric conversion element, a conductor, and a signal processing IC are encapsulated with an encapsulating portion. The current sensor is comprised of a pair of first lead terminals that is partially exposed on a side surface of the encapsulating portion, is electrically connected to the conductor, inputs a measurement current to the conductor, and outputs the measurement current from the conductor; a metal member that is partially exposed on a side surface of the encapsulating portion and is spaced apart from the conductor; and an element supporting portion that is comprised of a metal plate or a semiconductor substrate, supports the at least one magnetoelectric conversion element and a metal member on a surface on a same side as the first surface, and is spaced apart from the conductor.

Abstract: A current sensor is configured such that at least one magnetoelectric conversion element, a conductor, a signal processing IC, an IC supporting portion, and an element supporting portion are encapsulated with an encapsulating portion. The current sensor is comprised of a pair of first lead terminals that is partially exposed outside the encapsulating portion, is electrically connected to the conductor, inputs a measurement current to the conductor, and outputs the measurement current from the conductor; and a metal member that is partially exposed outside the encapsulating portion and is spaced apart from the conductor. The element supporting portion further supports the metal member on a surface on the same side as a first surface on which the IC supporting portion supports the signal processing IC.

Abstract: A current sensor includes at least one magnetoelectric conversion element, a conductor that at least partially surrounds the at least one magnetoelectric conversion element in a plan view and through which a measurement current to be measured with the at least one magnetoelectric conversion element flows, an element supporting portion comprised of a semiconductor substrate, and supports the at least one magnetoelectric conversion element and the conductor on a first surface, a signal processing IC that processes a signal that is output from the at least one magnetoelectric conversion element, an encapsulating portion that encapsulates the at least one magnetoelectric conversion element, the conductor, and the signal processing IC, and a pair of first lead terminals that is partially exposed on a side surface of the encapsulating portion and is electrically connected to the conductor, inputs the measurement current to the conductor and outputs the measurement current from the conductor.

Abstract: A current sensor is configured by at least one magnetoelectric conversion element, a conductor, and a signal processing IC being encapsulated by an encapsulating portion. The current sensor includes a pair of first lead terminals that is partially exposed outside of the encapsulating portion, is electrically connected to the conductor, inputs the measurement current to the conductor, and outputs the measurement current from the conductor; a metal member that is partially exposed outside the encapsulating portion and is spaced apart from the conductor; and a supporting portion that supports the at least one magnetoelectric conversion element, the signal processing IC, and the metal member on a first surface, is separated from the conductor, and is separate from the metal member.

Abstract: A modular jack is composed of: a base connector installed on a printed circuit board, and a socket connector with a parallel crank mechanism at an extremity thereof, the parallel crank mechanism being slidably connected to the base connector and switching an upper housing between a raised state and a lowered state. When the upper housing is laid toward the front side of the socket connector, the socket connector can be housed inside the casing and both faces of the upper housing, the socket housing, and the base housing are made in a flat plate-like shape. This contributes to height reduction in the modular jack. The socket connector is configured such that, when the upper housing is pulled out from a side face of the casing and raised outside the casing, a plug can be electrically connected to the socket connector.