Patents by Inventor Masaki Umeda

Masaki Umeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250180452
    Abstract: A crack growth prediction device includes: a parameter input unit to which parameters of initial values of at least a shape of the structure, a force applied to the structure, a material characteristic of the structure, and a crack shape, including uncertainty of each parameter, are each inputted as a probability distribution; a model generation unit which generates a state space model for predicting a crack growth state constituted of a state equation and an observation equation from the inputted parameters; a crack shape measurement unit which measures the crack shape of the structure; and an estimation unit which estimates a posterior distribution including the crack shape and the parameters, from a probability distribution of a measurement value of the crack shape measured by the crack shape measurement unit and uncertainty due to measurement error, and a prior distribution of the crack shape predicted by the state space model.
    Type: Application
    Filed: March 14, 2022
    Publication date: June 5, 2025
    Applicant: Mitsubishi Electric Corporation
    Inventors: Norihiko HANA, Masaki UMEDA, Kenji AMAYA, Rinya HATANAKA
  • Patent number: 12313601
    Abstract: A crack estimation device which accurately estimates a crack inside a structure is provided. The crack estimation device includes: a measurement unit which measures deformation of a measurement plane as a measurement plane deformation vector; a model generation unit which sets deformation of the measurement plane when a crack is generated in a crack generation plane, as a measurement plane estimated change vector for multiple types of crack candidates; and a crack state analysis unit which obtains a similarity between the measurement plane deformation vector and the measurement plane estimated change vector, normalizes the similarity, and estimates the crack generated in the crack generation plane from a result obtained by multiplying a vector of a state quantity indicating a state of the crack generation plane by the normalized similarity for each crack candidate, and adding together results of the multiplication for all the crack candidates.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: May 27, 2025
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Norihiko Hana, Masao Akiyoshi, Masaki Umeda, Kenji Amaya
  • Publication number: 20250131549
    Abstract: A controlling circuitry: generates a shape model of a pipe, set a crack occurrence plane in an inner surface of the pipe and set a measurement plane on the basis of the shape model imparted with a boundary condition including pressure information applied to the inner surface of the pipe, performs control in which a change on the measurement plane when a crack has occurred at the crack occurrence plane is set as a measurement plane estimated change vector, for each of crack candidates; derives deformation on the measurement plane as a measurement plane deformation vector, and calculates a similarity between the derived measurement plane deformation vector and the measurement plane estimated change vector for each crack candidate; and estimate a crack from the similarity and a state quantity deformation vector indicating a deformation state on the crack occurrence plane for each crack candidate.
    Type: Application
    Filed: February 8, 2022
    Publication date: April 24, 2025
    Applicant: Mitsubishi Electric Corporation
    Inventors: Norihiko HANA, Masaki UMEDA, Go KAJIWARA
  • Publication number: 20240353287
    Abstract: An inspection device includes: a data recording unit which records, in advance, change of a natural frequency caused when a rigidity of a supported part of an inspection target object and a damage size of the inspection target object are changed; a measurement unit which measures vibration response of the vibration-applied inspection target object; and an estimation unit which estimates the rigidity of the supported part of the inspection target object and the damage size of the inspection target object, simultaneously, on the basis of change of the natural frequency between a natural frequency of the inspection target object calculated from the vibration response and a natural frequency obtained by measuring the inspection target object whose damage state has already been known, and the change of the natural frequency recorded in the data recording unit.
    Type: Application
    Filed: August 25, 2021
    Publication date: October 24, 2024
    Applicant: Mitsubishi Electric Corporation
    Inventors: Norihiko HANA, Masao AKIYOSHI, Masaki UMEDA, Kenji AMAYA, Takuya IWAMOTO
  • Publication number: 20230251170
    Abstract: A crack estimation device which accurately estimates a crack inside a structure is provided. The crack estimation device includes: a measurement unit which measures deformation of a measurement plane as a measurement plane deformation vector; a model generation unit which sets deformation of the measurement plane when a crack is generated in a crack generation plane, as a measurement plane estimated change vector for multiple types of crack candidates; and a crack state analysis unit which obtains a similarity between the measurement plane deformation vector and the measurement plane estimated change vector, normalizes the similarity, and estimates the crack generated in the crack generation plane from a result obtained by multiplying a vector of a state quantity indicating a state of the crack generation plane by the normalized similarity for each crack candidate, and adding together results of the multiplication for all the crack candidates.
    Type: Application
    Filed: September 16, 2020
    Publication date: August 10, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Norihiko HANA, Masao AKIYOSHI, Masaki UMEDA, Kenji AMAYA
  • Publication number: 20220114713
    Abstract: An image processing method for measuring displacement of an object comprising is provided. The method includes acquiring first sequential images and second sequential images, wherein two adjacent images of the first sequential images include first overlap portions, wherein two adjacent images of the second sequential images include second overlap portions, wherein the first sequential images correspond to a first three dimensional (3D) surface on the object at a first state and the second sequential images correspond to a second 3D surface on the object at a second state.
    Type: Application
    Filed: January 14, 2021
    Publication date: April 14, 2022
    Inventors: Dehong Liu, Laixi Shi, Masaki Umeda, Norihiko Hana