Abstract: There is disclosed a method for static elimination of a cleaning target in a cleaning step is carried out by disposing in a cleaning apparatus a conducting means capable of coming into contact with and separating from the cleaning target at a plurality of portions thereof, bringing the conducting means into contact with the plurality of portions of the cleaning target, and eliminating, by grounding via the conducting means, the static electrification on the cleaning target that is caused by a cleaning member during cleaning. A static elimination assembly carrying out this method is also disclosed.

Abstract: There is disclosed a method for static elimination of a cleaning target in a cleaning step is carried out by disposing in a cleaning apparatus a conducting means capable of coming into contact with and separating from the cleaning target at a plurality of portions thereof, bringing the conducting means into contact with the plurality of portions of the cleaning target, and eliminating, by grounding via the conducting means, the static electrification on the cleaning target that is caused by a cleaning member during cleaning. A static elimination assembly carrying out this method is also disclosed.

Abstract: A solder receiving method for a printed circuit board having electronic components soldered thereon includes the steps of forming, in a recovering apparatus body, a solder alloy layer, a metal particle layer and a liquid heat medium layer according to differences in specific gravity thereof, and dipping the printed circuit board having the electronic components soldered thereon into the recovering apparatus. An additional step includes spraying, onto the printed circuit having the electronic components soldered thereon, a mixed fluid composed of metal particles and a liquid heat medium, kept at a temperature above the melting point of a solder alloy, to scrape a solder alloy and the electronic components off the printed circuit board, so that it is possible to efficiently recover solder from the printed circuit board having the electronic components soldered thereon.