Patents by Inventor Masaki Wakamatsu

Masaki Wakamatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WOOD TREATMENT AND TREATED WOOD
    Publication number: 20110159301
    Abstract: Wood is treated with a film-forming silicone emulsion composition, a boron compound, and a di- or trivalent metal salt. The wood can be endowed with water repellency, water absorption prevention, dimensional stability, termite control and antifungal properties without altering the appearance and quality of wood. The treatment is also effective in preventing the boron compound from being leached out in water.
    Type: Application
    Filed: December 23, 2010
    Publication date: June 30, 2011
    Applicant: NISSIN CHEMICAL INDUSTRY CO, LTD
    Inventors: Masaki Wakamatsu, Akira Yamamoto
  • Transgenic non-human mammal
    Patent number: 7550649
    Abstract: An object of the present invention is to provide a model animal of Parkinson's disease comprising an ?-synuclein gene introduced therein. The present invention provides a transgenic non-human mammal or a portion thereof, wherein an ?-synuclein gene is introduced and the gene is expressed in neurons, and the number of dopamine-producing neurons in the substantial nigra is significantly decreased as compared with that of a wild-type animal.
    Type: Grant
    Filed: October 28, 2004
    Date of Patent: June 23, 2009
    Assignee: Taisho Pharmaceutical Co., Ltd.
    Inventors: Makoto Yoshimoto, Masaki Wakamatsu, Aiko Ishii
  • Transgenic non-human mammal
    Publication number: 20070192879
    Abstract: An object of the present invention is to provide a model animal of Parkinson's disease comprising an ?-synuclein gene introduced therein. The present invention provides a transgenic non-human mammal or a portion thereof, wherein an ?-synuclein gene is introduced and the gene is expressed in neurons, and the number of dopamine-producing neurons in the substantial nigra is significantly decreased as compared with that of a wild-type animal.
    Type: Application
    Filed: October 28, 2004
    Publication date: August 16, 2007
    Inventors: Makoto Yoshimoto, Masaki Wakamatsu, Aiko Ishii
  • Sheet-framed IC carrier, method for producing the same, and IC carrier case
    Patent number: 6776347
    Abstract: A sheet-framed IC carrier has a sheet frame having an aperature, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperature of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.
    Type: Grant
    Filed: January 2, 2002
    Date of Patent: August 17, 2004
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Seiichi Nishikawa, Hiroshi Harima, Kazuyoshi Irisawa, Jun Takahashi, Akiko Moriyama, Mayumi Inada, Yoshikazu Fukushima, Masaki Wakamatsu
  • Sheet-framed IC carrier, method for producing the same, and IC carrier case
    Patent number: 6398114
    Abstract: A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.
    Type: Grant
    Filed: October 30, 1997
    Date of Patent: June 4, 2002
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Seiichi Nishikawa, Hiroshi Harima, Kazuyoshi Irisawa, Jun Takahashi, Akiko Moriyama, Mayumi Inada, Yoshikazu Fukushima, Masaki Wakamatsu
  • Sheet-framed IC carrier, method for producing the same, and IC carrier case
    Publication number: 20020050527
    Abstract: A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is stuck on the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.
    Type: Application
    Filed: January 2, 2002
    Publication date: May 2, 2002
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Seiichi Nishikawa, Hiroshi Harima, Kazuyoshi Irisawa, Jun Takahashi, Akiko Moriyama, Mayumi Inada, Yoshikazu Fukushima, Masaki Wakamatsu
  • Sheet-framed IC carrier, method for producing the same, and IC carrier case
    Patent number: 5757116
    Abstract: A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.
    Type: Grant
    Filed: August 19, 1996
    Date of Patent: May 26, 1998
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Seiichi Nishikawa, Hiroshi Harima, Kazuyoshi Irisawa, Jun Takahashi, Akiko Moriyama, Mayumi Inada, Yoshikazu Fukushima, Masaki Wakamatsu
  • Sheet-framed IC carrier, method for producing the same, and IC carrier case
    Patent number: 5581065
    Abstract: A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.
    Type: Grant
    Filed: July 28, 1994
    Date of Patent: December 3, 1996
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Seiichi Nishikawa, Hiroshi Harima, Kazuyoshi Irisawa, Jun Takahashi, Akiko Moriyama, Mayumi Inada, Yoshikazu Fukushima, Masaki Wakamatsu