Abstract: It is an object of the present invention to provide a printed circuit board that can be housed at high density in the enclosures of electronic devices. The printed circuit board (40) according to a preferred embodiment of the invention has a construction with a substrate (1), a conductor (7) formed in a flexible region (36) and conductors (8,9) formed in non-flexible regions (46). The conductor (7) formed in the flexible region (36) has a total thickness of 1-30 ?m, and the conductors (8,9) formed in the non-flexible regions (46) have a total thickness of 30-150 ?m.

Abstract: The injection stretch blow molding device includes an injection molding section that produces N (N is an integer equal to or larger 2) preforms by injection molding, a cooling section that subjects the N preforms transferred from the injection molding section to forced cooling, a heating section that continuously transfers and heats the N cooled preforms, and a blow molding section that subjects the N heated preforms to stretch blow molding in n (n is an integer equal to or larger than 2) operations, the blow molding section simultaneously stretch blow molding M (M=N/n, M is a natural number) preforms among the N preforms into M containers.

Abstract: The diversity reception device includes an antenna switching unit configured to select and switch to a determined chain number of antennas out of a plurality of antennas; and an antenna interchange control unit configured to control the antenna switching unit to interchange an antenna. The antenna interchange control unit compares a carrier-to-noise ratio measured by a demodulation circuit of a demodulation unit of each chain, controls the antenna switching unit to sequentially switch connection with an antenna of a chain having a lowest carrier-to-noise ratio to connection with antennas connectable to the chain, and interchanges the antenna of the chain having a lowest carrier-to-noise ratio with an antenna estimated to have a highest carrier-to-noise ratio on the basis of the input level measured by the level detection unit or an antenna having a highest input level measured by the level detection unit among the connection-switched antennas.

Abstract: To eliminate or otherwise reduce unintended movement of a probe tip of a probe assembly being held by a probe arm, the probe assembly includes one or more resilient members that compensate for the contraction or expansion of the probe arm in accordance with the coefficient of thermal expansion of the material from which the probe arm is made. Thus, the probe tip can remain in contact with a sample being measured at the desired location on the sample, during an automated full or wide scale temperature range sweep.

Abstract: It is an object of the present invention to provide a multilayer circuit board that can be housed at high density in the enclosures of electronic devices. According to a preferred embodiment of the invention, a multilayer circuit board (12) has a structure wherein non-flexible printed circuit boards (6) are laminated via cover lays (10) onto both sides of a flexible printed circuit board (1). In the multilayer circuit board (12), the cover lays (10) protect the regions of the printed circuit board (1) where the printed circuit boards (6) are not situated, while also functioning as adhesive layers (11) for bonding with the printed circuit boards (6). In other words, the same layers are used as the cover lays (10) and adhesive layers (11) in the multilayer circuit board (12).

Abstract: By removably disposing a fluid cutoff device in a gas piping, a gas cutoff management function for remote cutting-off/return, etc., can be added to an existing flow measuring unit, and a communicating portion can make bidirectional communications, so that by transmitting an acceptance state of a remote operation from the external device to the external device, higher reliability and safety can be realized, and by detecting use with the fluid cutoff device removed, safety can be further improved while unauthorized use is prevented.

Abstract: It is an object of the present invention to provide a shutoff valve unit which can be easily attached to a gas meter whose casing is formed with a press worked thin plate and has a resistance to foreign materials or water in a piping or a tamper. An inlet pipe 51, a speed reducing chamber 52 arranged in a lower part of the inlet pipe and having a flow passage sectional area larger than a flow passage sectional area of the inlet pipe 51, a transverse passage 53 opened substantially in a horizontal direction from a side surface at a position higher than a bottom surface 52a and a valve chamber 56 having a valve seat hole 54 opened downward to a gas introducing chamber 46 in the gas meter are integrally formed with a synthetic resin, and a shutoff valve 81 is provided which has a valve disk 82 for opening and closing the valve seat hole 54 and incorporates an air-tight structure in a main body to form a shutoff valve unit.

Abstract: An identification display device which is provided in a work unit in which a plurality of work locations are arranged in rows, and which displays for identifying a designated location selected from the work locations, the identification display device includes a database which stores address information of the respective work locations; light-display section which is provided respectively on each of the work locations, and which emits a visible light which contains the address information of the work location in which the light-display section is arranged; a photoreceptor which transmits a photoreception signal which contains at least the address information contained in the light from the light-display section, when the light is received; and a confirmation section which receives the photoreception signal from the photoreceptor, and determines whether or not the address information contained in the photoreception signal matches the address information of the designated location obtained from the database.

Abstract: This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 ?m.

Abstract: It is an object of the present invention to provide a printed circuit board that can be housed at high density in the enclosures of electronic devices. The printed circuit board (40) according to a preferred embodiment of the invention has a construction with a substrate (1), a conductor (7) formed in a flexible region (36) and conductors (8,9) formed in non-flexible regions (46). The conductor (7) formed in the flexible region (36) has a total thickness of 1-30 ?m, and the conductors (8,9) formed in the non-flexible regions (46) have a total thickness of 30-150 ?m.

Abstract: This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 ?m.

Abstract: By removably disposing a fluid cutoff device in a gas piping, a gas cutoff management function for remote cutting-off/return, etc., can be added to an existing flow measuring unit, and a communicating portion can make bidirectional communications, so that by transmitting an acceptance state of a remote operation from the external device to the external device, higher reliability and safety can be realized, and by detecting use with the fluid cutoff device removed, safety can be further improved while unauthorized use is prevented.

Abstract: An identification display device which is provided in a work unit in which a plurality of work locations are arranged in rows, and which displays for identifying a designated location selected from the work locations, the identification display device includes a database which stores address information of the respective work locations; light-display section which is provided respectively on each of the work locations, and which emits a visible light which contains the address information of the work location in which the light-display section is arranged; a photoreceptor which transmits a photoreception signal which contains at least the address information contained in the light from the light-display section, when the light is received; and a confirmation section which receives the photoreception signal from the photoreceptor, and determines whether or not the address information contained in the photoreception signal matches the address information of the designated location obtained from the database.

Abstract: It is an object of the present invention to provide a multilayer circuit board that can be housed at high density in the enclosures of electronic devices. According to a preferred embodiment of the invention, a multilayer circuit board (12) has a structure wherein non-flexible printed circuit boards (6) are laminated via cover lays (10) onto both sides of a flexible printed circuit board (1). In the multilayer circuit board (12), the cover lays (10) protect the regions of the printed circuit board (1) where the printed circuit boards (6) are not situated, while also functioning as adhesive layers (11) for bonding with the printed circuit boards (6). In other words, the same layers are used as the cover lays (10) and adhesive layers (11) in the multilayer circuit board (12).

Abstract: To eliminate or otherwise reduce unintended movement of a probe tip of a probe assembly being held by a probe arm, the probe assembly includes one or more resilient members that compensate for the contraction or expansion of the probe arm in accordance with the coefficient of thermal expansion of the material from which the probe arm is made. Thus, the probe tip can remain in contact with a sample being measured at the desired location on the sample, during an automated full or wide scale temperature range sweep.

Abstract: This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 ?m.

Abstract: This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 ?m.

Abstract: An object of the present invention is to provide a means for the measurement of amylase activity that exists in a biological sample such as saliva in a more convenient manner and particularly to provide a means (method and reagent) where a sample containing amylase in high concentration is directly measured without dilution. In the present invention, there has been found a method, which is an enzymatic method using a modified oligosaccharide substrate, comprising adding saccharide such as oligosaccharide that is competitive to the oligosaccharide substrate whereupon amylase activity in an amylase sample having a high activity value can be directly measured without dilution, and a result, the present invention has been achieved.

Abstract: An object of the present invention is to provide a means for measuring amylase activity existing in biological samples such as saliva in a more convenient manner and is particularly to provide a means (reagent for measurement, method for measurement and apparatus) by which a sample containing high concentrations of amylase is measured. There has been found a means (reagent for measurement, method for measurement and apparatus), whereby amylase activity in an amylase sample having a high activity value can be quite conveniently measured by making an oligosaccharide substrate carry on a support in an enzymatic method for measuring amylase activity using a modified oligosacharide substrate, whereupon the present invention has been achieved.

Abstract: In a film-type battery, it is possible to increase energy density, however, it is difficult to obtain a high performance characteristic. Contrary to the above, a film-type storage device and an electric device including the film-type storage device having a storage body, which has a pair of positive and negative electrodes, and is sealed with a surface film, at least a part of which is sealed; and connecting terminals for connecting the positive and negative electrodes to the outside, a part of each of which is exposed, in which the exposed portions of the connecting terminals are located at non-sealed portions, can solve the above problem.