Patents by Inventor Masaki Yoneda
Masaki Yoneda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9859041Abstract: A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.Type: GrantFiled: March 13, 2017Date of Patent: January 2, 2018Assignee: ROHM CO., LTD.Inventor: Masaki Yoneda
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Publication number: 20170287602Abstract: A chip resistor includes first and second electrodes spaced apart from each other, a resistor element arranged on the first and the second electrodes, a bonding layer provided between the resistor element and the two electrodes, and a plating layer electrically connected to the resistor element. The first electrode includes a flat outer side surface, and the resistor element includes a side surface facing in the direction in which the thirst and the second electrodes are spaced. The outer side surface of the first electrode is flush with the side surface of the resistor element. The plating layer covers at least a part of the outer side surface of the first electrode in a manner such that the covering portion of the plating layer extends from one vertical edge of the outer side surface to the other vertical edge.Type: ApplicationFiled: June 21, 2017Publication date: October 5, 2017Inventors: Kenichi HARADA, Masaki YONEDA
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Patent number: 9775247Abstract: [Object] To provide a chip resistor with which laser irradiation requires no extremely high positional accuracy, and a plating layer provided on a base and adjacent to a resistor element can be connected to an external conductive layer. [Solution] A chip resistor includes a base 1, a first principal surface electrode 21, a second principal surface electrode spaced apart from the first principal surface electrode 21 in a first direction X1, a resistor element 4 in contact with the first principal surface electrode 21 and the second principal surface electrode 31, an overcoat 6 covering the resistor element 4, the first principal surface electrode 21 and the second principal surface electrode, a first auxiliary electrode 25 covering the first principal surface electrode 21 and the overcoat 6, and a first plating electrode 27 covering the first auxiliary electrode 25. The first auxiliary electrode 25 includes a portion 259 offset from the first principal surface electrode 21 in the first direction X1.Type: GrantFiled: November 1, 2016Date of Patent: September 26, 2017Assignee: ROHM CO., LTD.Inventor: Masaki Yoneda
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Publication number: 20170271053Abstract: The present invention provides a chip resistor and a method of making the same for alleviating stress resulted from thermal expansion difference and thus suppressing cracks. A chip resistor includes: a substrate, having a carrying surface and a mounting surface facing away from each other; a pair of upper electrodes, disposed at two ends of the carrying surface; a resistor, disposed on the carrying surface and between the pair of upper electrodes, and electrically connected to the pair of upper electrodes; a stress relaxation layer having flexibility and formed on the mounting surface of the substrate; a metal thin film layer, formed on a surface of the stress relaxation layer opposite to the substrate; a side electrode for electrically connecting the upper electrodes and the metal thin film layer; and a plating layer covering the side electrode and the metal thin film layer.Type: ApplicationFiled: March 13, 2017Publication date: September 21, 2017Inventor: Masaki YONEDA
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Patent number: 9711265Abstract: A chip resistor includes first and second electrodes spaced apart from each other, a resistor element arranged on the first and the second electrodes, a bonding layer provided between the resistor element and the two electrodes, and a plating layer electrically connected to the resistor element. The first electrode includes a flat outer side surface, and the resistor element includes a side surface facing in the direction in which the thirst and the second electrodes are spaced. The outer side surface of the first electrode is flush with the side surface of the resistor element. The plating layer covers at least a part of the outer side surface of the first electrode in a manner such that the covering portion of the plating layer extends from one vertical edge of the outer side surface to the other vertical edge.Type: GrantFiled: October 19, 2015Date of Patent: July 18, 2017Assignee: ROHM CO., LTD.Inventors: Kenichi Harada, Masaki Yoneda
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Publication number: 20170186516Abstract: A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.Type: ApplicationFiled: March 13, 2017Publication date: June 29, 2017Inventor: Masaki YONEDA
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Patent number: 9633768Abstract: A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.Type: GrantFiled: June 3, 2014Date of Patent: April 25, 2017Assignee: ROHM CO., LTD.Inventor: Masaki Yoneda
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Publication number: 20170048983Abstract: [Object] To provide a chip resistor with which laser irradiation requires no extremely high positional accuracy, and a plating layer provided on a base and adjacent to a resistor element can be connected to an external conductive layer. [Solution] A chip resistor includes a base 1, a first principal surface electrode 21, a second principal surface electrode spaced apart from the first principal surface electrode 21 in a first direction X1, a resistor element 4 in contact with the first principal surface electrode 21 and the second principal surface electrode 31, an overcoat 6 covering the resistor element 4, the first principal surface electrode 21 and the second principal surface electrode, a first auxiliary electrode 25 covering the first principal surface electrode 21 and the overcoat 6, and a first plating electrode 27 covering the first auxiliary electrode 25. The first auxiliary electrode 25 includes a portion 259 offset from the first principal surface electrode 21 in the first direction X1.Type: ApplicationFiled: November 1, 2016Publication date: February 16, 2017Inventor: Masaki YONEDA
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Patent number: 9520215Abstract: A method of manufacturing a chip resistor includes the following steps. A resistor layer is formed on an obverse surface of a material substrate. A plurality of substrate sections are defined in the material substrate by forming, in the obverse surface of the material substrate, a plurality of first grooves each of which is elongated in a first direction. A conductor layer is formed in each of the first grooves. The substrate sections are cut along lines extending in a second direction different from the first direction.Type: GrantFiled: December 18, 2012Date of Patent: December 13, 2016Assignee: ROHM CO., LTD.Inventor: Masaki Yoneda
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Patent number: 9514867Abstract: A chip resistor includes an insulating substrate, a resistor element arranged on the obverse surface of the substrate, a bonding layer provided between the resistor element and the substrate, a first electrode connected to the resistor element, and a second electrode connected to the resistor element. The second electrode is deviated from the first electrode in a direction perpendicular to the thickness direction of the substrate. The substrate includes a side surface between the obverse surface and the reverse surface. The first electrode covers the resistor element, and also the side surface and the reverse surface of the substrate.Type: GrantFiled: February 25, 2014Date of Patent: December 6, 2016Assignee: ROHM CO., LTD.Inventors: Kenichi Harada, Masaki Yoneda
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Patent number: 9508473Abstract: [Object] To provide a chip resistor with which laser irradiation requires no extremely high positional accuracy, and a plating layer provided on a base and adjacent to a resistor element can be connected to an external conductive layer. [Solution] A chip resistor includes a base 1, a first principal surface electrode 21, a second principal surface electrode spaced apart from the first principal surface electrode 21 in a first direction X1, a resistor element 4 in contact with the first principal surface electrode 21 and the second principal surface electrode 31, an overcoat 6 covering the resistor element 4, the first principal surface electrode 21 and the second principal surface electrode, a first auxiliary electrode 25 covering the first principal surface electrode 21 and the overcoat 6, and a first plating electrode 27 covering the first auxiliary electrode 25. The first auxiliary electrode 25 includes a portion 259 offset from the first principal surface electrode 21 in the first direction X1.Type: GrantFiled: December 10, 2012Date of Patent: November 29, 2016Assignee: ROHM CO., LTD.Inventor: Masaki Yoneda
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Publication number: 20160343480Abstract: There is provided a chip resistor suitable for power detection. The chip resistor includes a resistor having a resistor lower surface and a resistor upper surface which face mutually opposite sides in a thickness direction, a pair of resistor first side surfaces spaced apart from each other in a first direction perpendicular to the thickness direction, and a pair of resistor second side surfaces spaced apart from each other in a second direction perpendicular to both the thickness direction and the first direction, a first electrode formed along one resistor first side surface, and a second electrode formed along the other resistor first side surface, and spaced apart from the first electrode.Type: ApplicationFiled: May 23, 2016Publication date: November 24, 2016Inventors: Kentaro NAKA, Masaki YONEDA
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Publication number: 20160196902Abstract: A chip resistor includes a resistor board, a first electrode, a second electrode and an insulating layer. The second electrode is offset from the first electrode in a lateral direction perpendicular to the thickness direction of the resistor board. The obverse surface of the resistor board includes a first region in contact with the first electrode, a second region in contact with the second electrode and an intermediate region in contact with the insulating layer. The intermediate region is disposed between the first region and the second region in the lateral direction. The first electrode includes a first underlying layer and a first plating layer. The first underlying layer is disposed between the first plating layer and the insulating layer in the thickness direction of the resistor board.Type: ApplicationFiled: March 14, 2016Publication date: July 7, 2016Inventor: Masaki YONEDA
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Patent number: 9305685Abstract: A chip resistor includes a resistor board, a first electrode, a second electrode and an insulating layer. The second electrode is offset from the first electrode in a lateral direction perpendicular to the thickness direction of the resistor board. The obverse surface of the resistor board includes a first region in contact with the first electrode, a second region in contact with the second electrode and an intermediate region in contact with the insulating layer. The intermediate region is disposed between the first region and the second region in the lateral direction. The first electrode includes a first underlying layer and a first plating layer. The first underlying layer is disposed between the first plating layer and the insulating layer in the thickness direction of the resistor board.Type: GrantFiled: July 3, 2014Date of Patent: April 5, 2016Assignee: ROHM CO. LTD.Inventor: Masaki Yoneda
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Publication number: 20160042844Abstract: A chip resistor includes first and second electrodes spaced apart from each other, a resistor element arranged on the first and the second electrodes, a bonding layer provided between the resistor element and the two electrodes, and a plating layer electrically connected to the resistor element. The first electrode includes a flat outer side surface, and the resistor element includes a side surface facing in the direction in which the thirst and the second electrodes are spaced. The outer side surface of the first electrode is flush with the side surface of the resistor element. The plating layer covers at least a part of the outer side surface of the first electrode in a manner such that the covering portion of the plating layer extends from one vertical edge of the outer side surface to the other vertical edge.Type: ApplicationFiled: October 19, 2015Publication date: February 11, 2016Inventors: Kenichi HARADA, Masaki YONEDA
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Patent number: 9177701Abstract: A chip resistor includes first and second electrodes spaced apart from each other, a resistor element arranged on the first and the second electrodes, a bonding layer provided between the resistor element and the two electrodes, and a plating layer electrically connected to the resistor element. The first electrode includes a flat outer side surface, and the resistor element includes a side surface facing in the direction in which the thirst and the second electrodes are spaced. The outer side surface of the first electrode is flush with the side surface of the resistor element. The plating layer covers at least a part of the outer side surface of the first electrode in a manner such that the covering portion of the plating layer extends from one vertical edge of the outer side surface to the other vertical edge.Type: GrantFiled: February 19, 2014Date of Patent: November 3, 2015Assignee: ROHM CO., LTD.Inventors: Kenichi Harada, Masaki Yoneda
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Publication number: 20150022312Abstract: A chip resistor includes a resistor board, a first electrode, a second electrode and an insulating layer. The second electrode is offset from the first electrode in a lateral direction perpendicular to the thickness direction of the resistor board. The obverse surface of the resistor board includes a first region in contact with the first electrode, a second region in contact with the second electrode and an intermediate region in contact with the insulating layer. The intermediate region is disposed between the first region and the second region in the lateral direction. The first electrode includes a first underlying layer and a first plating layer. The first underlying layer is disposed between the first plating layer and the insulating layer in the thickness direction of the resistor board.Type: ApplicationFiled: July 3, 2014Publication date: January 22, 2015Inventor: Masaki YONEDA
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Publication number: 20140367153Abstract: A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.Type: ApplicationFiled: June 3, 2014Publication date: December 18, 2014Applicant: ROHM CO., LTD.Inventor: Masaki YONEDA
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Publication number: 20140333411Abstract: [Object] To provide a chip resistor with which laser irradiation requires no extremely high positional accuracy, and a plating layer provided on a base and adjacent to a resistor element can be connected to an external conductive layer. [Solution] A chip resistor includes a base 1, a first principal surface electrode 21, a second principal surface electrode spaced apart from the first principal surface electrode 21 in a first direction X1, a resistor element 4 in contact with the first principal surface electrode 21 and the second principal surface electrode 31, an overcoat 6 covering the resistor element 4, the first principal surface electrode 21 and the second principal surface electrode, a first auxiliary electrode 25 covering the first principal surface electrode 21 and the overcoat 6, and a first plating electrode 27 covering the first auxiliary electrode 25. The first auxiliary electrode 25 includes a portion 259 offset from the first principal surface electrode 21 in the first direction X1.Type: ApplicationFiled: December 10, 2012Publication date: November 13, 2014Inventor: Masaki Yoneda
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Publication number: 20140240083Abstract: A chip resistor includes an insulating substrate, a resistor element arranged on the obverse surface of the substrate, a bonding layer provided between the resistor element and the substrate, a first electrode connected to the resistor element, and a second electrode connected to the resistor element. The second electrode is deviated from the first electrode in a direction perpendicular to the thickness direction of the substrate. The substrate includes a side surface between the obverse surface and the reverse surface. The first electrode covers the resistor element, and also the side surface and the reverse surface of the substrate.Type: ApplicationFiled: February 25, 2014Publication date: August 28, 2014Applicant: ROHM CO., LTD.Inventors: Kenichi HARADA, Masaki YONEDA