Patents by Inventor Masako AOKI

Masako AOKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POLISHING LIQUID, POLISHING LIQUID SET AND POLISHING METHOD
    Publication number: 20240052222
    Abstract: A polishing liquid containing abrasive grains including a hydroxide of a tetravalent metal element, a polymer including a structure unit represented by Formula (1) below, and a liquid medium. [in Formula (1), * represents a bonding hand.
    Type: Application
    Filed: April 20, 2021
    Publication date: February 15, 2024
    Inventors: Daisuke IIKURA, Masako AOKI
  • POLISHING LIQUID AND POLISHING METHOD
    Publication number: 20230145080
    Abstract: A polishing liquid containing: abrasive grains containing a hydroxide of a tetravalent metal element; a monovalent acid component having no carboxy group; and a non-ionic polymer, in which a pH is 4.5 or less. A polishing method including a step of polishing a surface to be polished by using this polishing liquid.
    Type: Application
    Filed: November 11, 2020
    Publication date: May 11, 2023
    Inventors: Daisuke IIKURA, Masako AOKI
  • POLISHING LIQUID AND POLISHING METHOD
    Publication number: 20230128096
    Abstract: A polishing liquid containing: abrasive grains containing a hydroxide of a tetravalent metal element; and a nitrogen-containing compound having a hydrocarbon group having 6 or more carbon atoms and bonded to a nitrogen atom, in which the nitrogen-containing compound contains at least one selected from the group consisting of a quaternary ammonium salt, tertiary amine, and a heterocyclic compound having a quaternary nitrogen atom constituting a heterocyclic ring. A polishing method including a step of polishing a surface to be polished by using this polishing liquid.
    Type: Application
    Filed: November 11, 2020
    Publication date: April 27, 2023
    Inventors: Daisuke IIKURA, Masako AOKI
  • Polishing liquid, polishing liquid set, and substrate polishing method
    Patent number: 11046869
    Abstract: A polishing liquid comprising a liquid medium, an abrasive grain and a polymer, wherein the polymer includes a first molecular chain having a functional group directly bonded thereto, and a second molecular chain branched from the first molecular chain, and the functional group is at least one selected from the group consisting of a carboxyl group, a carboxylic acid salt group, a hydroxyl group, a sulfo group and a sulfonic acid salt group.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: June 29, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Toshiaki Akutsu, Hisataka Minami, Tomohiro Iwano, Tetsuro Yamashita, Masako Aoki, Masato Fukasawa
  • POLISHING LIQUID, POLISHING LIQUID SET, AND SUBSTRATE POLISHING METHOD
    Publication number: 20180258319
    Abstract: A polishing liquid comprising a liquid medium, an abrasive grain and a polymer, wherein the polymer includes a first molecular chain having a functional group directly bonded thereto, and a second molecular chain branched from the first molecular chain, and the functional group is at least one selected from the group consisting of a carboxyl group, a carboxylic acid salt group, a hydroxyl group, a sulfo group and a sulfonic acid salt group.
    Type: Application
    Filed: June 13, 2016
    Publication date: September 13, 2018
    Inventors: Toshiaki AKUTSU, Hisataka MINAMI, Tomohiro IWANO, Tetsuro YAMASHITA, Masako AOKI, Masato FUKASAWA