Patents by Inventor Masako Ooishi
Masako Ooishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7633153Abstract: A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.Type: GrantFiled: July 16, 2007Date of Patent: December 15, 2009Assignee: Kabushiki Kaisha ToshibaInventors: Kazuo Shimokawa, Takashi Koyanagawa, Masako Ooishi, Tatsuya Yamada, Osamu Usuda, Yoshiki Endo, Taiki Miura, Masaki Toyoshima, Ichiro Omura, Akio Nakagawa, Kenichi Matsushita, Yusuke Kawaguchi, Haruki Arai, Hiroshi Takei, Tomohiro Kawano, Noriaki Yoshikawa, Morio Takahashi, Yasuhito Saito, Masahiro Urase
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Patent number: 7514783Abstract: A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.Type: GrantFiled: August 31, 2005Date of Patent: April 7, 2009Assignee: Kabushiki Kaisha ToshibaInventors: Kazuo Shimokawa, Takashi Koyanagawa, Masako Ooishi, Tatsuya Yamada, Osamu Usuda, Yoshiki Endo, Taiki Miura, Masaki Toyoshima, Ichiro Omura, Akio Nakagawa, Kenichi Matsushita, Yusuke Kawaguchi, Haruki Arai, Hiroshi Takei, Tomohiro Kawano, Noriaki Yoshikawa, Morio Takahashi, Yasuhito Saito, Masahiro Urase
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Publication number: 20070257376Abstract: A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.Type: ApplicationFiled: July 16, 2007Publication date: November 8, 2007Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Kazuo Shimokawa, Takashi Koyanagawa, Masako Ooishi, Tatsuya Yamada, Osamu Usuda, Yoshiki Endo, Taiki Miura, Masaki Toyoshima, Ichiro Omura, Akio Nakagawa, Kenichi Matsushita, Yusuke Kawaguchi, Haruki Arai, Hiroshi Takei, Tomohiro Kawano, Noriaki Yoshikawa, Morio Takahashi, Yasuhito Saito, Masahiro Urase
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Publication number: 20070257708Abstract: A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.Type: ApplicationFiled: July 16, 2007Publication date: November 8, 2007Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Kazuo Shimokawa, Takashi Koyanagawa, Masako Ooishi, Tatsuya Yamada, Osamu Usuda, Yoshiki Endo, Taiki Miura, Masaki Toyoshima, Ichiro Omura, Akio Nakagawa, Kenichi Matsushita, Yusuke Kawaguchi, Haruki Arai, Hiroshi Takei, Tomohiro Kawano, Noriaki Yoshikawa, Morio Takahashi, Yasuhito Saito, Masahiro Urase
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Publication number: 20060055432Abstract: A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.Type: ApplicationFiled: August 31, 2005Publication date: March 16, 2006Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Kazuo Shimokawa, Takashi Koyanagawa, Masako Ooishi, Tatsuya Yamada, Osamu Usuda, Yoshiki Endo, Taiki Miura, Masaki Toyoshima, Ichiro Omura, Akio Nakagawa, Kenichi Matsushita, Yusuke Kawaguchi, Haruki Arai, Hiroshi Takei, Tomohiro Kawano, Noriaki Yoshikawa, Morio Takahashi, Yasuhito Saito, Masahiro Urase
