Patents by Inventor Masako Ueba

Masako Ueba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Coated conductive particle coated conductive particle manufacturing method anisotropic conductive material and conductive connection structure
    Patent number: 7291393
    Abstract: An objective of the invention is to provide a coated conductive particle having superior connection reliability, a method for manufacturing such coated conductive particle, an anisotropic conductive material and a conductive-connection structure. A coated conductive particle comprising a particle having a surface made of conductive metal and an insulating particles to coat the surface of the particle having the surface made of conductive metal there with, wherein the insulating particles are chemically bonded to the particle having the surface made of conductive metal via a functional group (A) having a bonding property to the conductive metal so that a single coating layer is formed.
    Type: Grant
    Filed: September 17, 2002
    Date of Patent: November 6, 2007
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Takeshi Wakiya, Yoshikazu Yoneda, Masako Ueba
  • Coated conductive particle coated conductive particle manufacturing method anisotropic conductive material and conductive connection structure
    Publication number: 20060154070
    Abstract: An objective of the invention is to provide a coated conductive particle having superior connection reliability, a method for manufacturing such coated conductive particle, an anisotropic conductive material and a conductive-connection structure. A coated conductive particle comprising a particle having a surface made of conductive metal and an insulating particles to coat the surface of the particle having the surface made of conductive metal there with, wherein the insulating particles are chemically bonded to the particle having the surface made of conductive metal via a functional group (A) having a bonding property to the conductive metal so that a single coating layer is formed.
    Type: Application
    Filed: September 17, 2002
    Publication date: July 13, 2006
    Inventors: Takeshi Wakiya, Yoshikazu Yoneda, Masako Ueba