Patents by Inventor Masako Watanabe
Masako Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8598029Abstract: A semiconductor device, which comprises a workpiece with an outline and a plurality of contact pads and further an external part with a plurality of terminal pads. This part is spaced from the workpiece and the terminal pads are aligned with the workpiece contact pads, respectively. A reflow element interconnects each of the contact pads with its respective terminal pad. Thermoplastic material fills the space between the workpiece and the part; this material adheres to the workpiece, the part and the reflow elements. Further, the material has an outline substantially in line with the outline of the workpiece, and fills the space substantially without voids. Due to the thermoplastic character of the filling material, the finished device can be reworked, when the temperature range for reflowing the reflow elements is reached.Type: GrantFiled: May 8, 2012Date of Patent: December 3, 2013Assignee: Texas Instruments IncorporatedInventors: Masako Watanabe, Masazumi Amagai
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Publication number: 20120220080Abstract: A semiconductor device, which comprises a workpiece with an outline and a plurality of contact pads and further an external part with a plurality of terminal pads. This part is spaced from the workpiece and the terminal pads are aligned with the workpiece contact pads, respectively. A reflow element interconnects each of the contact pads with its respective terminal pad. Thermoplastic material fills the space between the workpiece and the part; this material adheres to the workpiece, the part and the reflow elements. Further, the material has an outline substantially in line with the outline of the workpiece, and fills the space substantially without voids. Due to the thermoplastic character of the filling material, the finished device can be reworked, when the temperature range for reflowing the reflow elements is reached.Type: ApplicationFiled: May 8, 2012Publication date: August 30, 2012Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Masako Watanabe, Masazumi Amagai
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Patent number: 8193085Abstract: A semiconductor device (1700), which comprises a workpiece (1201) with an outline (1711) and a plurality of contact pads (1205) and further an external part (1701) with a plurality of terminal pads (1702). This part is spaced from the workpiece, and the terminal pads are aligned with the workpiece contact pads, respectively. A reflow element (1203) interconnects each of the contact pads with its respective terminal pad. Thermoplastic material (1204) fills the space between the workpiece and the part; this material adheres to the workpiece, the part and the reflow elements. Further, the material has an outline (1711) substantially in line with the outline of the workpiece, and fills the space (1707) substantially without voids. Due to the thermoplastic character of the filling material, the finished device can be reworked, when the temperature range for reflowing the reflow elements is reached.Type: GrantFiled: February 10, 2010Date of Patent: June 5, 2012Assignee: Texas Instruments IncorporatedInventors: Masako Watanabe, Masazumi Amagai
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Publication number: 20100144098Abstract: A semiconductor device (1700), which comprises a workpiece (1201) with an outline (1711) and a plurality of contact pads (1205) and further an external part (1701) with a plurality of terminal pads (1702). This part is spaced from the workpiece, and the terminal pads are aligned with the workpiece contact pads, respectively. A reflow element (1203) interconnects each of the contact pads with its respective terminal pad. Thermoplastic material (1204) fills the space between the workpiece and the part; this material adheres to the workpiece, the part and the reflow elements. Further, the material has an outline (1711) substantially in line with the outline of the workpiece, and fills the space (1707) substantially without voids. Due to the thermoplastic character of the filling material, the finished device can be reworked, when the temperature range for reflowing the reflow elements is reached.Type: ApplicationFiled: February 10, 2010Publication date: June 10, 2010Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Masako WATANABE, Masazumi AMAGAI
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Patent number: 7701071Abstract: A semiconductor device (1700), which comprises a workpiece (1201) with an outline (1711) and a plurality of contact pads (1205) and further an external part (1701) with a plurality of terminal pads (1702). This part is spaced from the workpiece, and the terminal pads are aligned with the workpiece contact pads, respectively. A reflow element (1203) interconnects each of the contact pads with its respective terminal pad. Thermoplastic material (1204) fills the space between the workpiece and the part; this material adheres to the workpiece, the part and the reflow elements. Further, the material has an outline (1711) substantially in line with the outline of the workpiece, and fills the space (1707) substantially without voids. Due to the thermoplastic character of the filling material, the finished device can be reworked, when the temperature range for reflowing the reflow elements is reached.Type: GrantFiled: March 24, 2005Date of Patent: April 20, 2010Assignee: Texas Instruments IncorporatedInventors: Masako Watanabe, Masazumi Amagai
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Publication number: 20100090323Abstract: The present invention provides a spacer sheet for a complex type semiconductor device provided between the semiconductor packages of a complex type semiconductor device formed by laminating plural semiconductor packages, comprising through holes of an array corresponding to electrodes which can be provided onto a substrate of one semiconductor package and which are formed in order to connect and wire one semiconductor package with the other semiconductor package and a space part corresponding to a principal part of the above one semiconductor package mounted on the substrate or a principal part of the other semiconductor package opposed to the substrate and a production process for a complex type semiconductor device in which the above spacer sheet is used.Type: ApplicationFiled: October 22, 2007Publication date: April 15, 2010Applicant: Lintec CorporationInventors: Tomonori Shinoda, Hironori Shizuhata, Hirofumi Shinoda, Yuji Kawamata, Takeshi Tashima, Masato Shimamura, Masako Watanabe, Masazumi Amagai
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Publication number: 20100025837Abstract: The present invention relates to a complex type semiconductor device formed by laminating plural semiconductor packages, wherein it comprises: an upper semiconductor package which comprises a substrate for wiring and connecting provided with electrodes for conducting packages on a lower surface in the upper semiconductor package and a principal part of the upper semiconductor package disposed on an upper surface and/or a lower surface of the above substrate and which constitutes a relatively upper part, a lower semiconductor package which comprises a substrate for wiring and connecting provided with electrodes for conducting packages on an upper surface in the lower semiconductor package and a principal part of the lower semiconductor package disposed on an upper surface and/or a lower surface of the above substrate and which constitutes a relatively lower part, a spacer sheet which comprises a space part corresponding to the principal part of the upper semiconductor package and/or the principal part of thType: ApplicationFiled: October 22, 2007Publication date: February 4, 2010Applicant: LINTEC CORPORATIONInventors: Tomonori Shinoda, Hironori Shizuhata, Hirofumi Shinoda, Yuji Kawamata, Takeshi Tashima, Masato Shimamura, Masako Watanabe, Masazumi Amagai
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Patent number: 7646193Abstract: A device inspection apparatus that is capable of judging the functions of operating control buttons on a cellular phone or like device automatically and easily. The device inspection apparatus comprises an adapter unit 2 on which a cellular phone 1 is mounted; a camera 4 for picking up the image of an LCD panel 3, which serves as a display section for the cellular phone 1; a plunger unit 7, which has a plurality of releases 6 for pressing a key button 5 on the cellular phone 1; a computer 8 for controlling the operation of the plunger unit 7 and exercising control; and a monitor 9 for displaying an LCD panel image and an image based on a signal from the computer 8. A still picture, motion picture, or audio output, which is acquired when a release 6 presses a key button 5, is compared against a predetermined expected image or sound to judge the functionality of the cellular phone 1.Type: GrantFiled: January 24, 2005Date of Patent: January 12, 2010Assignee: Japan Novel CorporationInventors: Yoshio Suzuki, Masako Watanabe
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Publication number: 20080157353Abstract: A microelectronic device package interconnect for electrically connecting a plurality of substrates is provided. The microelectronic device package interconnect comprises an insulative layer positioned on a substrate, wherein the insulative layer has an opening extending through the insulative layer to the substrate. The microelectronic device package interconnect further comprises solder positioned in the opening.Type: ApplicationFiled: December 29, 2006Publication date: July 3, 2008Applicant: Texas Instruments IncorporatedInventors: Masako Watanabe, Masazumi Amagai
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Publication number: 20070243098Abstract: [Problem]Mobile electronic equipment is often dropped during use or transport, and the soldered joints of electronic parts sometimes peel off due to the impact when dropped. In addition, they undergo heat cycles in which internal coils, resistors, and the like generate heat and soldered joints increase in temperature during operation of electronic equipment and cool off during periods of non-use. With a conventional Sn—Ag base lead-free solder, the impact resistance and resistance to heat cycles of minute portions such as solder bumps were not adequate. The present invention provides a lead-free solder alloy, bumps of which have excellent impact resistance and resistance to heat cycles. Means for Solving the Problem The present invention is a lead-free solder alloy comprising 0.1—less than 2.0 mass % of Ag, 0.01-0.1 mass % of Cu, 0.005-0.1 mass % of Zn, and a remainder of Sn, to which Ga, Ge, or P may be added, and to which Ni or Co may be further added.Type: ApplicationFiled: July 29, 2004Publication date: October 18, 2007Inventors: Tsukasa Ohnishi, Tokuro Yamaki, Masazumi Amagai, Masako Watanabe
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Patent number: 7282175Abstract: A lead-free solder includes 0.05-5 mass % of Ag, 0.01-0.5 mass % of Cu, at least one of P, Ge, Ga, Al, and Si in a total amount of 0.001-0.05 mass %, and a remainder of Sn. One or more of a transition element for improving resistance to heat cycles, a melting point lowering element such as Bi, In, or Zn, and an element for improving impact resistance such as Sb may be added.Type: GrantFiled: April 15, 2004Date of Patent: October 16, 2007Assignee: Senju Metal Industry Co., Ltd.Inventors: Masazumi Amagai, Masako Watanabe, Kensho Murata, Yoshitaka Toyoda, Minoru Ueshima, Tsukasa Ohnishi, Takeshi Tashima, Daisuke Souma, Takahiro Roppongi, Hiroshi Okada
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Publication number: 20070205751Abstract: [Object] To provide a device inspection apparatus that is capable of judging the functions of operating control buttons on a cellular phone or like device automatically and easily. [Solution] The device inspection apparatus comprises an adapter unit 2 on which a cellular phone 1 is mounted; a camera 4 for picking up the image of an LCD panel 3, which serves as a display section for the cellular phone 1; a plunger unit 7, which has a plurality of releases 6 for pressing a key button 5 on the cellular phone 1; a computer 8 for controlling the operation of the plunger unit 7 and exercising control, for instance, for judging the contents of the LCD panel 3; and a monitor 9 for displaying an LCD panel image and an image based on a signal from the computer 8. A still picture, motion picture, or audio output, which is acquired when a release 6 presses a key button 5, is compared against a predetermined expected image or sound to judge the functionality of the cellular phone 1.Type: ApplicationFiled: January 24, 2005Publication date: September 6, 2007Applicant: JAPAN NOVEL CORPORATIONInventors: Yoshio Suzuki, Masako Watanabe
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Publication number: 20070170599Abstract: A tape for use as a carrier in semiconductor assembly, which has one or more base sheets 101 of polymeric, preferably thermoplastic, material having first (101a) and second (101b) surfaces. A polymeric adhesive film (102, 104) and a foil (103, 105) of different, preferably inert, material are attached to the base sheet on both the first and second surface sides; they thus provide a thickness (120) to the tape. A plurality of holes is formed through the thickness of the tape; the holes are preferably tapered with an angle between about 70° and 80° with the second tape surface. A reflow metal element (301), with a preferred diameter (302) about equal to the tape thickness, is held in each of the holes.Type: ApplicationFiled: January 24, 2006Publication date: July 26, 2007Inventors: Masazumi Amagai, Masako Watanabe
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Publication number: 20060214314Abstract: A semiconductor device (1700), which comprises a workpiece (1201) with an outline (1711) and a plurality of contact pads (1205) and further an external part (1701) with a plurality of terminal pads (1702). This part is spaced from the workpiece, and the terminal pads are aligned with the workpiece contact pads, respectively. A reflow element (1203) interconnects each of the contact pads with its respective terminal pad. Thermoplastic material (1204) fills the space between the workpiece and the part; this material adheres to the workpiece, the part and the reflow elements. Further, the material has an outline (1711) substantially in line with the outline of the workpiece, and fills the space (1707) substantially without voids. Due to the thermoplastic character of the filling material, the finished device can be reworked, when the temperature range for reflowing the reflow elements is reached.Type: ApplicationFiled: March 24, 2005Publication date: September 28, 2006Inventors: Masako Watanabe, Masazumi Amagai
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Patent number: 7029542Abstract: A lead-free solder alloy comprises 1.0–5.0 wt % Ag, 0.01–0.5 wt % Ni, one or both of (a) 0.001–0.05 wt % Co and (b) at least one of P, Ge, and Ga in a total amount of 0.001–0.05 wt %, and a remainder of Sn. The solder can form solder bumps which have a high bonding strength and which do not undergo yellowing after soldering.Type: GrantFiled: July 8, 2003Date of Patent: April 18, 2006Assignee: Senju Metal Industry Co., Ltd.Inventors: Masazumi Amagai, Masako Watanabe, Kensho Murata, Osamu Munekata, Yoshitaka Toyoda, Minoru Ueshima, Tsukasa Ohnishi, Hiroshi Okada
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Patent number: 6887778Abstract: A semiconductor device and its manufacturing method with which the connection reliability can be improved without complicating the manufacturing process. Semiconductor chip 102 is mounted on the principal surface of insulated substrate 104, and a conductive paste containing a heat-curing epoxy resin is supplied to via holes 116 from the back of insulated substrate 104. Then, solder balls 118 are transferred onto the conductive paste of insulated substrate 104, and reflow soldering is applied in order to bond solder balls 118 to insulated substrate 104. During the reflow soldering, the heat-curing epoxy resin forms resin parts 120 around solder balls 118.Type: GrantFiled: September 24, 2002Date of Patent: May 3, 2005Assignee: Texas Instruments IncorporatedInventors: Masako Watanabe, Mutsumi Masumoto
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Publication number: 20050036902Abstract: A lead-free solder alloy comprises 1.0-5.0 wt % Ag, 0.01-0.5 wt % Ni, one or both of (a) 0.001-0.05 wt % Co and (b) at least one of P, Ge, and Ga in a total amount of 0.001-0.05 wt %, and a remainder of Sn. The solder can form solder bumps which have a high bonding strength and which do not undergo yellowing after soldering.Type: ApplicationFiled: July 8, 2003Publication date: February 17, 2005Inventors: Masazumi Amagai, Masako Watanabe, Osamu Munekata, Yoshitaka Toyoda, Minoru Ueshima, Tsukasa Ohnishi, Hiroshi Okada
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Publication number: 20040262779Abstract: A lead-free solder includes 0.05-5 mass % of Ag, 0.01-0.5 mass % of Cu, at least one of P, Ge, Ga, Al, and Si in a total amount of 0.001-0.05 mass %, and a remainder of Sn. One or more of a transition element for improving resistance to heat cycles, a melting point lowering element such as Bi, In, or Zn, and an element for improving impact resistance such as Sb may be added.Type: ApplicationFiled: April 15, 2004Publication date: December 30, 2004Inventors: Masazumi Amagai, Masako Watanabe, Kensho Murata, Yoshitaka Toyoda, Minoru Ueshima, Tsukasa Ohnishi, Takeshi Tashima, Daisuke Souma, Takahiro Roppongi, Hiroshi Okada
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Patent number: 6762506Abstract: Apparatus and method for assembling a semiconductor device on a wiring substrate is disclosed, wherein Pb (lead) is not used and the chance of generation of defects is reduced. Semiconductor package (100) has solder balls (114) containing Sn (tin), Ag (silver) and Cu (copper). Wiring substrate 200 has connecting terminals 208 for connecting solder balls (114). The connecting terminals (208) have an Au (gold) layer (212) and a Ni layer (210). In the operation for assembling semiconductor package (100) onto wiring substrate (200), because solder balls (114) are heated and fixed on connecting terminals (208), Au in Au layer (212) diffuses into balls (114). Because Au is contained in solder balls (114), a high bonding strength is obtained, and the chance of generation of defects is reduced.Type: GrantFiled: January 7, 2003Date of Patent: July 13, 2004Assignee: Texas Instruments IncorporatedInventors: Masazumi Amagai, Masako Watanabe
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Publication number: 20030173587Abstract: Apparatus and method for assembling a semiconductor device on a wiring substrate is disclosed, wherein Pb (lead) is not used and the chance of generation of defects is reduced. Semiconductor package (100) has solder balls (114) containing Sn (tin), Ag (silver) and Cu (copper). Wiring substrate 200 has connecting terminals 208 for connecting solder balls (114). The connecting terminals (208) have an Au (gold) layer (212) and a Ni layer (210). In the operation for assembling semiconductor package (100) onto wiring substrate (200), because solder balls (114) are heated and fixed on connecting terminals (208), Au in Au layer (212) diffuses into balls (114). Because Au is contained in solder balls (114), a high bonding strength is obtained, and the chance of generation of defects is reduced.Type: ApplicationFiled: January 7, 2003Publication date: September 18, 2003Inventors: Masazumi Amagai, Masako Watanabe