Patents by Inventor Masako Yabe

Masako Yabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing semiconductor device
    Patent number: 5635115
    Abstract: A method for producing a semiconductor device according to the present invention includes the steps of: disposing a functional element in each cavity of a multi-cavity circuit board, the multi-cavity circuit board having a number of cavities opening upward; overlaying a sealing resin sheet with a predetermined thickness containing, as a sealing resin, one of a thermoplastic resin and a thermosetting resin which is melted by heating and is cured by further heating on the multi-cavity circuit board so as to cover all of the cavities thereof; heating and pressurizing the sealing resin sheet on the multi-cavity circuit board so that the sealing resin sheet is melted to be filled in each of the cavities; and curing the molten resin filled in each of the cavities.
    Type: Grant
    Filed: May 22, 1995
    Date of Patent: June 3, 1997
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Masahiro Konishi, Masako Yabe, Toshiro Hida