Abstract: A system and method of matching multiple scanners using design and defect data are described. A golden wafer is processed using a golden tool. A second wafer is processed using a second tool. Both tools provide focus/exposure modulation. Wafer-level spatial signatures of critical structures for both wafers can be compared to evaluate the behavior of the scanners. Critical structures can be identified by binning defects on the golden wafer having similar patterns. In one embodiment, the signatures must match within a certain percentage or the second tool is characterized as a “no match”. Reticles can be compared in a similar manner, wherein the golden and second wafers are processed using a golden reticle and a second reticle, respectively.

Abstract: This invention relates to a tire-rim assembly which is easily produced at low cost, excellent in durability and capable of notably reducing road noise, and more particularly to a tire-rim assembly comprising a pneumatic tire (1), a rim (2) and a sponge member (4) disposed in a tire internal cavity (3) defined by the pneumatic tire (1) and the rim (2), characterized in that the sponge member (4) has a specific gravity of higher than 0.06 but not higher than 0.25 and/or an air permeability of not higher than 5 cc/cm2/sec.

Abstract: A system and method of matching multiple scanners using design and defect data are described. A golden wafer is processed using a golden tool. A second wafer is processed using a second tool. Both tools provide focus/exposure modulation. Wafer-level spatial signatures of critical structures for both wafers can be compared to evaluate the behavior of the scanners. Critical structures can be identified by binning defects on the golden wafer having similar patterns. In one embodiment, the signatures must match within a certain percentage or the second tool is characterized as a “no match”. Reticles can be compared in a similar manner, wherein the golden and second wafers are processed using a golden reticle and a second reticle, respectively.

Abstract: This invention relates to a tire-rim assembly which is easily produced at low cost, excellent in durability and capable of notably reducing road noise, and more particularly to a tire-rim assembly comprising a pneumatic tire (1), a rim (2) and a sponge member (4) disposed in a tire internal cavity (3) defined by the pneumatic tire (1) and the rim (2), characterized in that the sponge member (4) has a specific gravity of higher than 0.06 but not higher than 0.25 and/or an air permeability of not higher than 5 cc/cm2/sec.

Abstract: An optical device includes an optical waveguide, an optical element, and a resin layer disposed between the optical waveguide and the optical element. The resin layer is formed of a photocurable material alone or in combination with a thermosetting material and includes an optical interconnect for optically connecting the optical waveguide and the optical element. The optical interconnect has a higher refractive index than a region of the resin layer around the optical interconnect. A method for producing the optical device includes providing the photocurable material between the optical waveguide and the optical element, partially irradiating the photocurable material with light to form the optical interconnect, and secondarily irradiating the overall photocurable material with light to cure the overall resin layer.

Abstract: According to the present invention, drive voltage pulses are applied between a pair of electrodes by driving a first power source having a specific voltage from a state in which the electrodes are maintained at the potential of a reference power source that is different from the potential of the ground power source, and then returning it to the reference power source. As a result, the gas discharge current or capacitance charging and discharging current accompanying the application of the drive voltage pulses is prevented from flowing to the first power source line. The above-mentioned gas discharge current or capacitance charging and discharging current resulting from the application of the drive voltage pulses flows to the first power source or the reference power source electrically separated from the ground power source, and does not flow to the ground power source line, so no noise is generated on the first power source.

Abstract: A photo-curable resin composition includes a photo-acid generator, a dye having an absorption in a range of 760 to 2,000 nm, and a cationic photopolymerizable composition, wherein the photo-acid generator generates an acid by irradiation of near-infrared light to initiate cationic polymerization reaction for curing. Alternatively, a photo-curable resin composition includes a radical generator, a dye having an absorption in a range of 760 to 2,000 nm, and a radical photopolymerizable composition, wherein radical polymerization reaction is initiated by irradiation of near-infrared light to perform curing.

Abstract: An optical device includes an optical waveguide, an optical element, and a resin layer disposed between the optical waveguide and the optical element. The resin layer is formed of a photocurable material alone or in combination with a thermosetting material and includes an optical interconnect for optically connecting the optical waveguide and the optical element. The optical interconnect has a higher refractive index than a region of the resin layer around the optical interconnect. A method for producing the optical device includes providing the photocurable material between the optical waveguide and the optical element, partially irradiating the photocurable material with light to form the optical interconnect, and secondarily irradiating the overall photocurable material with light to cure the overall resin layer.

Abstract: A method for manufacturing an optical waveguide including a core 1 and a cladding 2 that are integrally formed is provided. The method includes a masking step of masking a monolayer film 11 containing a photobleachable material by sandwiching the monolayer film 11 between a pair of masking members 12A and 12B, a first photoirradiation step of irradiating the monolayer film 11 with light from two opposing directions through the pair of masking members 12A and 12B, a removing step of removing the pair of masking members 12A and 12B from the monolayer film 11, and a second photoirradiation step of irradiating the monolayer film 11 after removing the masking members 12A and 12B with light from the two opposing directions.

Abstract: A flat display device includes a display panel, a driver integrated circuit chip provided adjacent to the display panel in electrical connection thereto, and a heat sink provided adjacent to the display panel, wherein the heat sink carries thereon the driver integrated circuit chip.

Abstract: A module, for mounting a driver IC constituting a drive circuit of a display apparatus using a flat display panel, is disclosed, which includes a driver IC chip for driving the display electrodes of the flat display panel and a wiring board electrically connected with the driver IC chip. A module for mounting the driver IC having this configuration comprises a first wiring unit formed with a drive power source system wiring for supplying a power source voltage, which is input to the driver IC chip, for driving the flat display panel through the driver IC chip; a second wiring unit formed with a control system wiring for supplying various signals, which are input to the driver IC chip, for controlling the driver IC chip; and a third wiring unit formed with an output terminal wiring taken out from the driver IC chip and connecting to the display electrodes of the flat display panel.

Abstract: A plasma-display-panel display apparatus includes a flat display panel having a plurality of address electrodes and a plurality of scanning electrodes extending transversely to the address electrodes and disposed in confronting relation to the address electrodes with a discharge space defined therebetween. A scanning electrode driver successively supplies scanning pulses to the scanning electrodes with scanning timing, and an address driver supplies address pulses according to display data to the address electrodes in synchronism with the scanning timing. The address electrodes include first and second address electrodes disposed adjacent to each other. The address pulse applied to the first address electrode rises and the address pulse applied to the second address electrode falls with a predetermined time difference therebetween.

Abstract: A module, for mounting a driver IC constituting a drive circuit of a display apparatus using a flat display panel, is disclosed, which includes a driver IC chip for driving the display electrodes of the flat display panel and a wiring board electrically connected with the driver IC chip. A module for mounting the driver IC having this configuration comprises a first wiring unit formed with a drive power source system wiring for supplying a power source voltage, which is input to the driver IC chip, for driving the flat display panel through the driver IC chip; a second wiring unit formed with a control system wiring for supplying various signals, which are input to the driver IC chip, for controlling the driver IC chip; and a third wiring unit formed with an output terminal wiring taken out from the driver IC chip and connecting to the display electrodes of the flat display panel.

Abstract: A gate electrode having a first insulating film laminated in the upper portion thereof is formed on a gate insulating film formed on a semiconductor substrate. A side wall is formed on the side wall of the gate electrode, and an insulating film is formed to cover the gate electrode and the side wall. Ion implantation is performed through the insulating film so that a diffusion layer is formed on the semiconductor substrate. An interlayer dielectric film is formed, and then the interlayer dielectric film and the insulating film are selectively etched so that an opening portion for exposing the gate insulating film is formed in a self-align manner with the gate electrode. Then, the gate insulating film in the bottom portion of the opening portion is removed so that the surface of the semiconductor substrate is exposed. Then, a wiring layer connected to the exposed surface of the semiconductor substrate is formed.

Abstract: A highly reliable and highly characteristic semiconductor memory device capable of being subjected to a heat treatment process at a necessary temperature after forming a ferroelectric capacitor and wiring is provided. In Series connected TC unit ferroelectric RAM, a first contact portion of one of source/drain diffusion layers and a lower electrode and a second contact portion of an upper electrode and the other of the source/drain diffusion layers and are formed of a first oxidation resistant conductive film and a second oxidation resistant conductive film, respectively. By utilizing a memory cell block structure proper to the Series connected TC unit ferroelectric RAM, on a capacitor, provided is a hydrogen blocking film having an opening defined in a region without a memory cell, the region being present for each memory cell block.

Abstract: The present invention relates to a driver IC packaging module and a parallel plate type display device incorporating the same, and a chassis structure for an IC module having a high heat radiation effect or a flat display device having a high heat radiation efficiency can be achieved.

Abstract: A process for eliminating roughness on a silicon nitride trench liner is disclosed. A capping film on the top of the trench is formed in a self-aligned manner. This capping film prevents short circuits between a storage node and a passing word-line.

Abstract: A semiconductor memory device includes a semiconductor substrate having convex and concave portions locally formed in a surface thereof. An anti-reflection film serves as a first mask member and is formed on the semiconductor substrate. A photoresist is formed on the anti-reflection film. The anti-reflection film is partially removed using an opening formed by patterning the photoresist so as to expose an upper surface of the convex portion. The convex portion is etched using the photoresist and the anti-reflection film left in the concave portion. The anti-reflection film and the photoresist are removed, thereby obtaining the semiconductor substrate worked in a self-alignment manner.

Abstract: A semiconductor memory device comprises a memory cell region having an array of plurality of memory cells, and a peripheral circuit region to which a bit line connected to a predetermined number of the memory cells in the memory cell region is extended and connected, the bit line in the memory cell region and the bit line in the peripheral circuit region having substantially the same upper surface height.