Abstract: An optical coupling element includes a light emitting element and a light receiving element which receives emitted light from the light emitting element. The optical coupling element contains a silicone resin and includes a light transparent resin which covers the light emitting element and the light receiving element and transmits the signal light emitted from the light emitting element to the light receiving element (for example, a specific light transparent gel resin) and a light reflection resin which covers a circumference of the light transparent resin. To the light transparent resin, a dye which absorbs light having a shorter wavelength than a predetermined wavelength range including a light emitting wavelength of the light emitting element is added in a concentration of 0.7% by weight or less.

Abstract: An optical coupling element includes a light emitting element and a light receiving element which receives emitted light from the light emitting element. The optical coupling element contains a silicone resin and includes a light transparent resin which covers the light emitting element and the light receiving element and transmits the signal light emitted from the light emitting element to the light receiving element (for example, a specific light transparent gel resin) and a light reflection resin which covers a circumference of the light transparent resin. To the light transparent resin, a dye which absorbs light having a shorter wavelength than a predetermined wavelength range including a light emitting wavelength of the light emitting element is added in a concentration of 0.7% by weight or less.

Abstract: A semiconductor device package includes a substrate, a semiconductor device formed on the substrate, a ground electrode formed on the substrate, a cover designed for covering the semiconductor device, and a tab unit extending from the cover and for holding the substrate. The cover has an outer surface made of conductive material and an inner surface made of insulation material, where the insulating inner surface faces the semiconductor device. The tab unit has a first contact surface which extends from the conductive outer surface and is contact with the ground electrode.

Abstract: A semiconductor device package includes a substrate, a semiconductor device formed on the substrate, a ground electrode formed on the substrate, a cover designed for covering the semiconductor device, and a tab unit extending from the cover and for holding the substrate. The cover has an outer surface made of conductive material and an inner surface made of insulation material, where the insulating inner surface faces the semiconductor device. The tab unit has a first contact surface which extends from the conductive outer surface and is contact with the ground electrode.

Abstract: An apparatus for preventing a direct turning-in of the supersonic wave from the opening of the sender to the opening of the receiver in a supersonic wave device for a vehicle in which an object placed near the vehicle body id detected by the supersonic wave. A cylindrical turning-in preventive member made of foamed material having discrete bubbles is arranged at the opening of the sender or the receiver.