Abstract: A hollow fiber membrane module includes: a tubular case; a hollow fiber membrane bundle; and a pair of sealing and fixing portions, in which an outside-membrane channel that passes by an outer wall of each of the hollow fiber membranes and an inside-membrane channel that passes through the hollow inside of each of the hollow fiber membranes are formed, moist air flows through the outside-membrane channel, and dry air flows through the inside-membrane channel, whereby moisture in the moist air is supplied to the dry air by a membrane separation effect of the hollow fiber membranes, wherein a plurality of spaces are disposed between the case inner wall and the hollow fiber membrane bundle, and a restriction portion that restricts the hollow fiber membrane from entering into the spaces is partially disposed between the hollow fiber membrane bundle and each of the spaces.

Abstract: A hollow fiber membrane module includes: a tubular case; a hollow fiber membrane bundle; and a pair of sealing and fixing portions, in which an outside-membrane channel that passes by an outer wall of each of the hollow fiber membranes and an inside-membrane channel that passes through the hollow inside of each of the hollow fiber membranes are formed, moist air flows through the outside-membrane channel, and dry air flows through the inside-membrane channel, whereby moisture in the moist air is supplied to the dry air by a membrane separation effect of the hollow fiber membranes, wherein a plurality of spaces are disposed between the case inner wall and the hollow fiber membrane bundle, and a restriction portion that restricts the hollow fiber membrane from entering into the spaces is partially disposed between the hollow fiber membrane bundle and each of the spaces.

Abstract: A novel hydroxyphenylated resin having excellent thermal stability, weather resistance, and electrical properties useful as a resin for a printed circuit board, a resin for sealing a semiconductor, an insulating materials, and the like; a process for preparing the resin; and curable epoxy composition comprising the same. Specifically, the present invention provides a novel resin containing a number of phenolic hydroxyl groups and having a high softening point and substantially no double bonds; and a process for preparing the same wherein a butadiene oligomer and a phenol compound are used as starting materials; and a curable epoxy resin composition comprising the same suitable for applications such as a sealing material.

Abstract: An epoxy resin composition contains an epoxy resin represented by the formula (I) and a curing accelerator: ##STR1## wherein R.sup.1 stands for ##STR2## where G stands for a glycidyl group, R.sup.2 stands for an alkyl group having 1 to 4 carbon atoms, R.sup.3 and R.sup.4 stand for the same or different groups and each denote a hydrogen atom or a glycidyl group, m and x each denote an integer of 0 to 10, n denotes an integer of 0 to 2, provided that m.gtoreq.x and, if m=0, then x=0, in which case at least one of R.sup.3 and R.sup.4 denotes a glycidyl group on the condition that when m.gtoreq.1 and m>x, R.sup.1 may each stand for different groups.

Abstract: A novel hydroxyphenylated resin having excellent thermal stability, weather resistance, and electrical properties useful as a resin for a printed circuit board, a resin for sealing a semiconductor, an insulating materials, and the like; a process for preparing the resin; and curable epoxy composition comprising the same. Specifically, the present invention provides a novel resin containing a number of phenolic hydroxyl groups and having a high softening point and substantially no double bonds; and a process for preparing the same wherein a butadiene oligomer and a phenol compound are used as starting materials; and a curable epoxy resin composition comprising the same suitable for applications such as a sealing material.

Abstract: A phenolic resin is represented by the formula (1) ##STR1## wherein R.sup.1 denotes a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, m denotes an integer of from 0 to 10 and n denotes 0, 1 or 2. A method for producing the phenolic resin involves reacting in the presence of an acid catalyst 3a,4,7,7a-tetrahydroindene and a phenol represented by the formula (2) ##STR2## wherein R.sup.1 denotes a hydrogen atom or an alkyl group having 1 to 4 carbon atoms and n denotes 0, 1 or 2. An epoxy resin composition for encapsulation contains: (a) a curable epoxy resin, (b) the above phenolic resin, (c) a curing promotor, and (d) an inorganic filler.

Abstract: A method is provided for producing a phenolic resin represented by the formula (I) ##STR1## wherein R.sup.1 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, R.sup.2 is a divalent cyclic hydrocarbon residue having 5 to 18 carbon atoms, p is a number of from 0 to 10 and q is a number of 1 or 2. The method involves reacting a phenol with an unsaturated cyclic hydrocarbon compound having two or more carbon-carbon double bonding in the presence of an acid catalyst; and processing a resulting reaction product by a hydrotalcite compound represented by the formula (II)M.sub.1-x.sup.2+ M.sub.x.sup.3+ (OH).sub.2+x-ny A.sub.y.sup.n-.m(H.sub.2 O)(II)where M.sup.2+ is a divalent, magnesium ion, a divalent zinc ion, a divalent calcium ion, a divalent nickel ion, a divalent cobalt ion, a divalent manganese ion or a divalent copper ion, M.sup.3+ is a trivalent aluminum ion, a trivalent iron ion or a trivalent chromium ion, A.sup.n- is HCO.sub.3.sup.-, CO.sub.3.sup.2- or OH.sup.-, and x, y and m each are 0.

Abstract: A thermosetting resin composition having an improved crack resistance comprising 100 weight parts of a curable epoxy resin and 30 to 300 weight parts of a phenol compound-added conjugated diolefin polymer, which is prepared in the presence of aluminum phenoxide as the catalyst. The composition is suitable for resin encapsulation of electronic components.