Abstract: A semiconductor memory device according to the present invention includes a first memory cell, a second memory cell, a dummy transistor, and a voltage control circuit. The first memory cell has a first transistor that is coupled to a first word line, a first source line, and a bit line. The second memory cell has a second transistor that is coupled to a second word line, a second source line, and the bit line. The dummy transistor has the same structure as the first transistor and is coupled to a dummy word line, a dummy source line, and a dummy bit line. When a predetermined voltage for writing data into the first memory cell is to be applied to the first word line, the voltage control circuit couples the dummy bit line to the second source line and applies the predetermined voltage to the first dummy word line.

Abstract: A semiconductor memory device according to the present invention includes a first memory cell, a second memory cell, a dummy transistor, and a voltage control circuit. The first memory cell has a first transistor that is coupled to a first word line, a first source line, and a bit line. The second memory cell has a second transistor that is coupled to a second word line, a second source line, and the bit line. The dummy transistor has the same structure as the first transistor and is coupled to a dummy word line, a dummy source line, and a dummy bit line. When a predetermined voltage for writing data into the first memory cell is to be applied to the first word line, the voltage control circuit couples the dummy bit line to the second source line and applies the predetermined voltage to the first dummy word line.

Abstract: A semiconductor memory device according to the present invention includes a first memory cell, a second memory cell, a dummy transistor, and a voltage control circuit. The first memory cell has a first transistor that is coupled to a first word line, a first source line, and a bit line. The second memory cell has a second transistor that is coupled to a second word line, a second source line, and the bit line. The dummy transistor has the same structure as the first transistor and is coupled to a dummy word line, a dummy source line, and a dummy bit line. When a predetermined voltage for writing data into the first memory cell is to be applied to the first word line, the voltage control circuit couples the dummy bit line to the second source line and applies the predetermined voltage to the first dummy word line.

Abstract: A semiconductor memory device according to the present invention includes a first memory cell, a second memory cell, a dummy transistor, and a voltage control circuit. The first memory cell has a first transistor that is coupled to a first word line, a first source line, and a bit line. The second memory cell has a second transistor that is coupled to a second word line, a second source line, and the bit line. The dummy transistor has the same structure as the first transistor and is coupled to a dummy word line, a dummy source line, and a dummy bit line. When a predetermined voltage for writing data into the first memory cell is to be applied to the first word line, the voltage control circuit couples the dummy bit line to the second source line and applies the predetermined voltage to the first dummy word line.

Abstract: A non-volatile semiconductor memory device includes a sense amplifier, first and second bit lines that are connected to the sense amplifier, a first memory cell column that is connected to the first bit line, the first memory cell column being formed by a plurality of MONOS type transistors, a first constant current source that is connected to the second bit line, the first constant current source generating a reference current for the first memory cell column, and a first switch that is provided between the first constant current source and the second bit line, the first switch being formed by a MONOS type transistor.

Abstract: A non-volatile semiconductor memory device includes a sense amplifier, first and second bit lines that are connected to the sense amplifier, a first memory cell column that is connected to the first bit line, the first memory cell column being formed by a plurality of MONOS type transistors, a first constant current source that is connected to the second bit line, the first constant current source generating a reference current for the first memory cell column, and a first switch that is provided between the first constant current source and the second bit line, the first switch being formed by a MONOS type transistor.

Abstract: A plurality of bit line pairs are provided in a semiconductor memory device. A plurality of memory cells are connected to the first bit line pairs. Also, in the semiconductor memory device, there are provided a first sense amplifier, a second bit line pair and a second sense amplifier. The first sense amplifier reads and amplifies a potential difference between the first bit line pair. A signal output from the first sense amplifier is transmitted to the second bit line pair. The second sense amplifier amplifies a potential difference between the second bit line pair. A precharge circuit is built in the second sense amplifier. The first bit line pairs are precharged by the precharge circuit.

Abstract: A semiconductor dynamic random access memory device has first open bit lines arranged in parallel and second open bit lines respectively paired with the first open bit lines so as to form bit line pairs and a sense amplifier shared between the bit line pairs so as to increase the magnitude of a potential difference indicative of a data bit sequentially supplied from the bit line pairs, and either high or low level indicative of the data bit is supplied to both first and second bit lines of the selected bit line pair upon completion of the sense amplification, thereby equalizing electric influence on the adjacent open bit lines.