Patents by Inventor Masami Hasegawa
Masami Hasegawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210324099Abstract: An objective of the present disclosure is to provide anti-CD137 antigen-binding molecules which have immunocyte-activating effect, cytotoxic activity, or anti-tumor activity, and meanwhile have reduced effect on non-tumor tissues such as normal tissues and produce less side effects, and methods of using the same. Anti-CD137 antigen-binding molecules which have immunocyte-activating effect, cytotoxic activity, or anti-tumor activity, and meanwhile have reduced effect on non-tumor tissues such as normal tissues and produce less side effects, are provided by discovering and producing CD137 antigen-binding molecules whose binding activity to CD137 depends on various substances (for example, small molecule compounds) in target tissues. Methods of using the same, pharmaceutical formulations, and such are also provided. The present disclosure also provides an antigen-binding molecule whose binding activity to an antigen varies depending on a small molecule compound, a preparation method thereof, and uses thereof.Type: ApplicationFiled: August 9, 2019Publication date: October 21, 2021Inventors: Tomoyuki IGAWA, Mika SAKURAI, Shun SHIMIZU, Yuji HORI, Naoka HIRONIWA, Nasa SAVORY, Yoshinori NARITA, Takayuki KAMIKAWA, Taro MIYAZAKI, Shojiro KADONO, Masami HASEGAWA, Kanako TATSUMI, Akira HAYASAKA, Takeaki KAWAI, Futa MIMOTO, Hiroki KAWAUCHI, Masaki KAMIMURA
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Patent number: 9844126Abstract: Provided is a plasma treatment apparatus capable of uniform substrate treatment by correction of unevenness in a plasma density distribution. The apparatus has a configuration such that a substrate is treated with plasma, and an evacuated container is provided with an annular antenna arranged around an outer periphery of the container, and is formed of a power supply container, and a process container where the substrate is placed, which communicates with an internal space of the power supply container. The plasma is generated in the power supply container by radio-frequency power supplied to the antenna. The plasma is diffused into the process container by a magnetic field of solenoid coils arranged around an outer periphery of the antenna. The inclination of the magnetic field is adjusted by an inclination adjustment means for adjusting the inclination of the solenoid coils with respect to the process substrate.Type: GrantFiled: June 15, 2012Date of Patent: December 12, 2017Assignee: Canon Aneiva CorporationInventors: Masayoshi Ikeda, Kiyotaka Sakamoto, Akihiro Sawada, Yasumi Sago, Masami Hasegawa, Motozo Kurita
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Patent number: 9603231Abstract: A processing apparatus includes a substrate supporting unit that supports a substrate in a processing space in which the substrate is processed, a first partitioning member that includes a ceiling portion having an opening and partitions the processing space from an outer space, and a second partitioning member that is attached to the first partitioning member so as to close the opening and partition the processing space from the outer space together with the first partitioning member. The second partitioning member is attached to the first partitioning member so that the second partitioning member is removable from the first partitioning member by moving the second partitioning member toward a space which a lower surface of the ceiling portion faces.Type: GrantFiled: September 18, 2013Date of Patent: March 21, 2017Assignee: Canon Anelva CorporationInventors: Tomoaki Osada, Masami Hasegawa
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Patent number: 9490772Abstract: A ceramic package includes a package body made of a ceramic and including a pair of surfaces, and side surfaces, disposed between four sides of one of the surfaces and four sides of the other surface; a cavity that has an opening in the surface of the package body; a metalizing layer disposed over the surface of the package body surrounding the opening of the cavity; and a metal frame joined to an upper surface of the metalizing layer with a brazing filler metal layer interposed therebetween. The surface surrounding the opening of the cavity includes pairs of opposing side portions and each side portion of at least one of the pairs has a recessed portion in a middle portion of the side portion and a pair of flat portions on respective sides of the recessed portion.Type: GrantFiled: March 4, 2016Date of Patent: November 8, 2016Assignee: NGK SPARK PLUG CO., LTD.Inventor: Masami Hasegawa
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Publication number: 20160268995Abstract: A ceramic package includes a package body made of a ceramic and including a pair of surfaces, and side surfaces, disposed between four sides of one of the surfaces and four sides of the other surface; a cavity that has an opening in the surface of the package body; a metalizing layer disposed over the surface of the package body surrounding the opening of the cavity; and a metal frame joined to an upper surface of the metalizing layer with a brazing filler metal layer interposed therebetween. The surface surrounding the opening of the cavity includes pairs of opposing side portions and each side portion of at least one of the pairs has a recessed portion in a middle portion of the side portion and a pair of flat portions on respective sides of the recessed portion.Type: ApplicationFiled: March 4, 2016Publication date: September 15, 2016Inventor: Masami HASEGAWA
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Patent number: 9295151Abstract: A wiring substrate includes a substrate main body which is formed of a ceramic laminate and has a rectangular shape in plan view, and which has a front surface and a back surface and has four side surfaces, each being located between the front surface and the back surface, and having a groove surface located on a side toward the front surface and a fracture surface located on a side toward the back surface; and a metalized layer which is formed on the front surface of the substrate main body so as to extend along the four side surfaces, and which has a rectangular frame shape in plan view, wherein a horizontal surface of the ceramic laminate of the substrate main body is exposed between the metalized layer and the groove surface of each side surface of the substrate main body.Type: GrantFiled: February 1, 2012Date of Patent: March 22, 2016Assignee: NGK SPARK PLUG CO., LTD.Inventors: Masami Hasegawa, Satoshi Hirayama, Naoki Kito
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Patent number: 9232643Abstract: Provided are a ceramic wiring substrate; a multi-piece ceramic wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the wiring substrate array. The ceramic wiring substrate includes a substrate main body, which has a front surface, a back surface, side surfaces, a groove surface located on a side toward the front surface, and a fracture surface located on a side toward the back surface; and a notch which has a concave shape in plan view, and which is provided on at least one of the side surfaces so as to extend between the front surface and the back surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has curved portions on opposite sides of the notch, the curved portions being convex toward the front surface of the substrate main body in side view.Type: GrantFiled: February 1, 2012Date of Patent: January 5, 2016Assignee: NGK SPARK PLUG CO., LTD.Inventors: Masami Hasegawa, Satoshi Hirayama, Naoki Kito
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Patent number: 9215802Abstract: A wiring substrate includes a substrate body formed of a plate-like ceramic, having a front surface, a back surface, and a height of 0.8 mm or less; a cavity opening at the front surface and having a rectangular shape as viewed in plane; and side walls having a thickness of 0.3 mm or less between a side surface of the cavity and a side surface of the substrate body. The wiring substrate further includes an electrically conductive layer having the form of a frame and formed on the front surface to surround an opening of the cavity; a ceramic surface having the form of a frame and located adjacently to the electrically conductive layer and along the outer periphery of the front surface; and a via conductor formed in the substrate body along the side surface of the cavity between a bottom surface of the cavity and the front surface.Type: GrantFiled: December 25, 2012Date of Patent: December 15, 2015Assignee: NGK SPARK PLUG CO., LTD.Inventors: Jyun Suzuki, Naoki Kito, Masami Hasegawa, Chizuo Nakashima
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Patent number: 9061636Abstract: A front vehicle structure includes: a bumper fascia; a radiator panel upper disposed in a vehicle width direction behind the bumper fascia; and an upper energy absorbing (EA) member for pedestrian protection. The upper EA member is provided in the vehicle width direction in a substantially ? shape as a side view between the top of the bumper fascia and the radiator panel upper. A rear of the upper EA member for pedestrian protection is fixed to the radiator panel upper. An upper projection and a lower projection are respectively formed above and below the upper EA member.Type: GrantFiled: September 12, 2013Date of Patent: June 23, 2015Assignee: FUJI JUKOGYO KABUSHIKI KAISHAInventors: Masami Hasegawa, Hiroshi Suemune, Kazutoshi Hatsusaki, Kazuhiro Oota, Takashi Suzuki
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Publication number: 20150107879Abstract: A wiring substrate includes a substrate main body which is formed of a ceramic laminate and has a rectangular shape in plan view, and which has a front surface and a back surface and has four side surfaces, each being located between the front surface and the back surface, and having a groove surface located on a side toward the front surface and a fracture surface located on a side toward the back surface; and a metalized layer which is formed on the front surface of the substrate main body so as to extend along the four side surfaces, and which has a rectangular frame shape in plan view, wherein a horizontal surface of the ceramic laminate of the substrate main body is exposed between the metalized layer and the groove surface of each side surface of the substrate main body.Type: ApplicationFiled: February 1, 2012Publication date: April 23, 2015Applicants: NGK SPARK PLUG CO., LTD., NGK SPARK PLUG CO., LTD.Inventors: Masami Hasegawa, Satoshi Hirayama, Naoki Kito
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Patent number: 9010844Abstract: A vehicle body front structure is provided. In the vehicle body front structure, a front grille and a bumper extend in the up-and-down direction in a front end portion of the vehicle body, the bumper bends and extends rearwardly from the front grille, a front end edge of a front hood is positioned adjacent to a top end portion of the extending bumper, a frame upper portion that supports a radiator extends in the body width direction and is supported on the back side of a front end portion of the front hood, and a box-like hollow impact absorber, which is made of sheet metal and extends in the body width direction, is provided in a space surrounded by the front grille, the bumper, the front end portion of the front hood, and the frame upper portion, and is supported by the frame upper portion via a plurality of legs.Type: GrantFiled: August 13, 2012Date of Patent: April 21, 2015Assignee: Fuji Jukogyo Kabushiki KaishaInventor: Masami Hasegawa
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Patent number: 8987604Abstract: Provided are a ceramic wiring substrate having a side surface which realizes reliable chucking or hooking; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate is formed of a ceramic material, has a square (rectangular) shape in plan view, and which has a front surface, a back surface, and side surfaces each being located between the front surface and the back surface, wherein each side surface has a belt-like uneven surface including a plurality of alternate and parallel convex portions and concave portions which are formed so as to extend along the front surface, and also has a fracture surface located on a side toward the back surface.Type: GrantFiled: February 1, 2012Date of Patent: March 24, 2015Assignee: NGK Spark Plug Co., Ltd.Inventors: Masami Hasegawa, Satoshi Hirayama, Naoki Kito
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Patent number: 8952269Abstract: Provided are a wiring substrate; a multi-piece wiring substrate array; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate includes a substrate main body, which has first and second main surfaces, side surfaces, a groove surface, and a fracture surface; and a notch which has a concave shape in plan view, and which is provided on a side surface on a side toward the first main surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has first curved portions on opposite sides of the notch, the first curved portions being convex toward the first main surface in side view; and also has a second curved portion on a second-main-surface side of the notch, the second curved portion being convex toward the second main surface of the substrate main body in side view.Type: GrantFiled: February 1, 2012Date of Patent: February 10, 2015Assignee: NGK Spark Plug Co., Ltd.Inventors: Masami Hasegawa, Satoshi Hirayama, Naoki Kito
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Patent number: 8814638Abstract: A variable duct apparatus that controls outside air flowing in to a radiator includes a variable louver that is provided so as to extend in the vehicle width direction between a grille opening and a radiator of a vehicle, and regulates the amount of outside air admitted to the radiator, a lower louver that is provided so as to extend in the vehicle width direction between an air inlet and the radiator, and regulates the amount of outside air admitted to the radiator, and a link mechanism that coordinates and synchronizes the variable louver and the lower louver with each other, and interrupts the coordination between the variable louver and the lower louver upon application of an external force to the lower louver to thereby permit swinging of the lower louver.Type: GrantFiled: October 13, 2010Date of Patent: August 26, 2014Assignee: Fuji Jukogyo Kabushiki KaishaInventors: Masami Hasegawa, Hiroyuki Yoshimoto
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Publication number: 20140174803Abstract: A wiring substrate includes a substrate body formed of a plate-like ceramic, having a front surface, a back surface, and a height of 0.8 mm or less; a cavity opening at the front surface and having a rectangular shape as viewed in plane; and side walls having a thickness of 0.3 mm or less between a side surface of the cavity and a side surface of the substrate body. The wiring substrate further includes an electrically conductive layer having the form of a frame and formed on the front surface to surround an opening of the cavity; a ceramic surface having the form of a frame and located adjacently to the electrically conductive layer and along the outer periphery of the front surface; and a via conductor formed in the substrate body along the side surface of the cavity between a bottom surface of the cavity and the front surface.Type: ApplicationFiled: December 25, 2012Publication date: June 26, 2014Inventors: Jyun Suzuki, Naoki Kito, Masami Hasegawa, Chizuo Nakashima
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Publication number: 20140084608Abstract: A front vehicle structure includes: a bumper fascia; a radiator panel upper disposed in a vehicle width direction behind the bumper fascia; and an upper energy absorbing (EA) member for pedestrian protection. The upper EA member is provided in the vehicle width direction in a substantially ? shape as a side view between the top of the bumper fascia and the radiator panel upper. A rear of the upper EA member for pedestrian protection is fixed to the radiator panel upper. An upper projection and a lower projection are respectively formed above and below the upper EA member.Type: ApplicationFiled: September 12, 2013Publication date: March 27, 2014Applicant: Fuji Jukogyo Kabushiki KaishaInventors: Masami HASEGAWA, Hiroshi SUEMUNE, Kazutoshi HATSUSAKI, Kazuhiro OOTA, Takashi SUZUKI
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Publication number: 20140034369Abstract: Provided are a ceramic wiring substrate having a side surface which realizes reliable chucking or hooking; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate is formed of a ceramic material, has a square (rectangular) shape in plan view, and which has a front surface, a back surface, and side surfaces each being located between the front surface and the back surface, wherein each side surface has a belt-like uneven surface including a plurality of alternate and parallel convex portions and concave portions which are formed so as to extend along the front surface, and also has a fracture surface located on a side toward the back surface.Type: ApplicationFiled: February 1, 2012Publication date: February 6, 2014Applicant: NGK SPARK PLUG CO., LTD.Inventors: Masami Hasegawa, Satoshi Hirayama, Naoki Kito
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Publication number: 20140034372Abstract: Provided are a ceramic wiring substrate; a multi-piece ceramic wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the wiring substrate array. The ceramic wiring substrate includes a substrate main body, which has a front surface, a back surface, side surfaces, a groove surface located on a side toward the front surface, and a fracture surface located on a side toward the back surface; and a notch which has a concave shape in plan view, and which is provided on at least one of the side surfaces so as to extend between the front surface and the back surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has curved portions on opposite sides of the notch, the curved portions being convex toward the front surface of the substrate main body in side view.Type: ApplicationFiled: February 1, 2012Publication date: February 6, 2014Applicant: NGK SPARK PLUG CO., LTD.Inventors: Masami Hasegawa, Satoshi Hirayama, Naoki Kito
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Publication number: 20140037912Abstract: Provided are a wiring substrate; a multi-piece wiring substrate array; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate includes a substrate main body, which has first and second main surfaces, side surfaces, a groove surface, and a fracture surface; and a notch which has a concave shape in plan view, and which is provided on a side surface on a side toward the first main surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has first curved portions on opposite sides of the notch, the first curved portions being convex toward the first main surface in side view; and also has a second curved portion on a second-main-surface side of the notch, the second curved portion being convex toward the second main surface of the substrate main body in side view.Type: ApplicationFiled: February 1, 2012Publication date: February 6, 2014Applicant: NGK SPARK PLUG CO., LTD.Inventors: Masami Hasegawa, Satoshi Hirayama, Naoki Kito
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Publication number: 20140020833Abstract: A substrate processing apparatus for processing a substrate with plasma including: a container including a first container member that forms a processing space in which the substrate is processed, and a second container member that forms a plasma generation space in which plasma is generated a gas introduction unit for introducing gas into the container; a plasma generation unit including an antenna that is provided in an external space of the container and configured to excite the gas in the plasma generation space with an electric field that is generated by a high-frequency voltage fed from a power supply; and a substrate holding unit that is capable of holding the substrate. A coating film that contains a semiconductor material is formed on a surface of the second container member that is arranged close to the antenna.Type: ApplicationFiled: September 24, 2013Publication date: January 23, 2014Applicant: CANON ANELVA CORPORATIONInventors: Tatsuhiko Yoshida, Masami Hasegawa, Tomoaki Osada