Abstract: There is provided a semiconductor component including: a semiconductor substrate of a first conduction type; a semiconductor layer of a second conduction type that is formed on the semiconductor substrate and is PN-joined with the semiconductor substrate; an insulator layer laminated on the semiconductor layer; a metal layer laminated on the insulator layer at a pre-specified region; a semiconductor of the second conduction type at a side of the semiconductor layer at which the insulating layer is laminated, the semiconductor being formed directly under the metal layer such that incident light that is incident from the metal layer side is not illuminated onto the semiconductor layer, and the semiconductor containing more impurities than the semiconductor layer; and a conduction portion that conducts between the metal layer and the semiconductor.

Abstract: A semiconductor device, includes a semiconductor substrate; a first insulating layer formed on the semiconductor substrate; a first electrode formed on the first insulating layer; an interlayer dielectric formed over the first electrode; a wiring layer formed over the interlayer dielectric; a first contact hole formed through the interlayer dielectric between the first electrode and the wiring layer; and a barrier metal layer formed on an inner surface of the first contact hole. The first contact hole is formed to pass through the first electrode and reach an inside of the first insulating layer.

Abstract: A semiconductor device, includes a semiconductor substrate; a first insulating layer formed on the semiconductor substrate; a first electrode formed on the first insulating layer; an interlayer dielectric formed over the first electrode; a wiring layer formed over the interlayer dielectric; a first contact hole formed through the interlayer dielectric between the first electrode and the wiring layer; and a barrier metal layer formed on an inner surface of the first contact hole. The first contact hole is formed to pass through the first electrode and reach an inside of the first insulating layer.

Abstract: A simplified manufacturing process of a semiconductor memory 10, in which after a layer-built structure is formed of a control-gate conductive layer 19, an intergate insulating film 17, and a floating-gate conductive layer 18, a contact hole for a connector 21 for connecting the floating-gate conductive layer 18 and the control-gate conductive layer 19 together is formed in two stages: by forming a first contact hole 24 passing through the control-gate conductive layer 19 and opening above the intergate insulating film 17, and then forming a second contact hole 26 passing through the intergate insulating film 17 and opening to the floating-gate conductive layer 18, and the first contact hole 24 is formed in conjunction with patterning of a control gate g1, and the second contact hole 26 is formed in conjunction with the formation of a drain contact hole 20.

Abstract: A plurality of stack type transistors each formed by successively stacking a tunnel oxide, a floating gate, an ONO stacked insulating film and a control gate on one another are provided on a silicon semiconductor substrate. A select transistor is provided adjacent to each of the stack type transistors. A flash memory cell is made up of two transistors: the stack type transistor and the select transistor. Owing to the present construction, a flash memory cell can be achieved which is operable at a low voltage, excellent in rewrite endurance, rewritable on a one-pulse basis and free from verification and overerasing cares. Accordingly, a high-reliable flash memory can be realized.