Patents by Inventor Masami JUTA

Masami JUTA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Insulating component, semiconductor package, and semiconductor apparatus
    Patent number: 11901247
    Abstract: An insulating component includes an insulating substrate, a metal layer, a bond, and a lead terminal. The plate-like insulating substrate has a groove continuous from its upper to side surfaces. The metal layer includes a first metal layer on the upper surface of the insulating substrate and a second metal layer on an inner surface of the groove continuous with the first metal layer. The bond is on an upper surface of the metal layer. The lead terminal is on an upper surface of the first metal layer with the bond in between, and overlaps the grooves. The bond includes a first bond fixing the lead terminal to the first metal layer and a second bond on an upper surface of the second metal layer continuous with the first bond. The groove includes an inner wall having a ridge. The second bond is between the ridge and the lead terminal.
    Type: Grant
    Filed: April 18, 2022
    Date of Patent: February 13, 2024
    Assignee: KYOCERA Corporation
    Inventors: Masami Juta, Daisuke Sakumoto
  • INSULATING COMPONENT, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR APPARATUS
    Publication number: 20220238400
    Abstract: An insulating component includes an insulating substrate, a metal layer, a bond, and a lead terminal. The plate-like insulating substrate has a groove continuous from its upper to side surfaces. The metal layer includes a first metal layer on the upper surface of the insulating substrate and a second metal layer on an inner surface of the groove continuous with the first metal layer. The bond is on an upper surface of the metal layer. The lead terminal is on an upper surface of the first metal layer with the bond in between, and overlaps the grooves. The bond includes a first bond fixing the lead terminal to the first metal layer and a second bond on an upper surface of the second metal layer continuous with the first bond. The groove includes an inner wall having a ridge. The second bond is between the ridge and the lead terminal.
    Type: Application
    Filed: April 18, 2022
    Publication date: July 28, 2022
    Applicant: KYOCERA Corporation
    Inventors: Masami JUTA, Daisuke SAKUMOTO
  • Insulating component, semiconductor package, and semiconductor apparatus
    Patent number: 11335613
    Abstract: An insulating component includes an insulating substrate, a metal layer, a bond, and a lead terminal. The plate-like insulating substrate has a groove continuous from its upper to side surfaces. The metal layer includes a first metal layer on the upper surface of the insulating substrate and a second metal layer on an inner surface of the groove continuous with the first metal layer. The bond is on an upper surface of the metal layer. The lead terminal is on an upper surface of the first metal layer with the bond in between, and overlaps the groove. The bond includes a first bond fixing the lead terminal to the first metal layer and a second bond on an upper surface of the second metal layer continuous with the first bond. The groove includes an inner wall having a ridge. The second bond is between the ridge and the lead terminal.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: May 17, 2022
    Assignee: KYOCERA CORPORATION
    Inventors: Masami Juta, Daisuke Sakumoto
  • INSULATING COMPONENT, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR APPARATUS
    Publication number: 20200058578
    Abstract: An insulating component includes an insulating substrate, a metal layer, a bond, and a lead terminal. The plate-like insulating substrate has a groove continuous from its upper to side surfaces. The metal layer includes a first metal layer on the upper surface of the insulating substrate and a second metal layer on an inner surface of the groove continuous with the first metal layer. The bond is on an upper surface of the metal layer. The lead terminal is on an upper surface of the first metal layer with the bond in between, and overlaps the groove. The bond includes a first bond fixing the lead terminal to the first metal layer and a second bond on an upper surface of the second metal layer continuous with the first bond. The groove includes an inner wall having a ridge. The second bond is between the ridge and the lead terminal.
    Type: Application
    Filed: February 14, 2018
    Publication date: February 20, 2020
    Applicant: KYOCERA Corporation
    Inventors: Masami JUTA, Daisuke SAKUMOTO