Abstract: A wiring board and a method for manufacturing the wiring board in which an initial Cu plated layer is formed by plating so as to cover the surface of a metallized layer and then the initial Cu plated layer is heated to be softened or melted. Copper in the softened or melted initial Cu plated layer enters into open pore portions of the metallized layer. In addition, during the heating, components of the metallized layer and components of the initial Cu plated layer are mutually thermally diffused. Consequently, when solidified later (that is, when the initial Cu plated layer becomes a lower Cu plated layer), the adhesiveness between the metallized layer and the lower Cu plated layer is improved due to, for example, an anchoring effect and a mutual thermal diffusion effect.

Abstract: The present invention provides a wiring board having a conductor portion on which mounting is suitably possible and a method for manufacturing the wiring board. Since an initial Cu plated layer is formed by plating so as to cover the surface of a metallized layer and then the initial Cu plated layer is heated to be softened or melted, copper in the softened or melted initial Cu plated layer enters into open pore portions of the metallized layer. In addition, during the heating, components of the metallized layer and components of the initial Cu plated layer are mutually thermally diffused. Consequently, when solidified later (that is, when the initial Cu plated layer becomes a lower Cu plated layer), the adhesiveness between the metallized layer and the lower Cu plated layer is improved due to, for example, an anchoring effect and a mutual thermal diffusion effect, and therefore mountability is improved.

Abstract: A ceramic package includes a ceramic substrate, a metallization layer, a first plating layer, a brazing material layer, and a seal member. The ceramic substrate has a surface, and the metallization layer is disposed along an outer periphery of a predetermined region on the surface. The first plating layer is disposed on the metallization layer. The brazing material layer is disposed on the metallization layer with the first plating layer interposed therebetween. The seal member is joined on the metallization layer via the brazing material layer. In at least one of an outer peripheral portion and an inner peripheral portion of the brazing material layer, an end of the brazing material layer is located outside a region directly below the seal member and the end of the brazing material layer is positioned nearer to the seal member than an end of the metallization layer.

Abstract: A ceramic package includes a ceramic substrate, a metallization layer, a first plating layer, a brazing material layer, and a seal member. The ceramic substrate has a surface, and the metallization layer is disposed along an outer periphery of a predetermined region on the surface. The first plating layer is disposed on the metallization layer. The brazing material layer is disposed on the metallization layer with the first plating layer interposed therebetween. The seal member is joined on the metallization layer via the brazing material layer. In at least one of an outer peripheral portion and an inner peripheral portion of the brazing material layer, an end of the brazing material layer is located outside a region directly below the seal member and the end of the brazing material layer is positioned nearer to the seal member than an end of the metallization layer.

Abstract: In a ceramic package, a seal ring is brazed to a substrate portion. A joint portion of the seal ring includes: a metallization layer; a first plating layer disposed on the metallization layer; and a brazing material layer disposed on the metallization layer with the first plating layer interposed therebetween. An end of the brazing material layer is located outside a region directly below the seal ring and at a position at the seal ring side away from an end of the metallization layer by 0.02 mm or greater.