Patents by Inventor Masami Kumei

Masami Kumei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8373185
    Abstract: A light emitting device is provided, including a resin which can be manufactured according to a simple process and deliver a desired scattering property. The light emitting device is manufactured according to a step for mixing two or more types of immiscible liquid materials to obtain a composition containing at least two types of materials phase-separated in a sea-island structure, and a step for arranging the composition in proximity to an LED chip, curing the composition with the sea-island structure being maintained, thereby forming an encapsulation resin. Accordingly, it is possible to form an island region which serves as a scattering center, according to a simple step of mixing materials.
    Type: Grant
    Filed: December 15, 2009
    Date of Patent: February 12, 2013
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Masami Kumei, Soji Owada, Koichi Takayama, Mitsunori Harada
  • Patent number: 8106413
    Abstract: A light emitting device is provided which has a reflector having a reflection surface made of porous alumina having an apparent density of 2.5 to 3.3 g/cm3, and an LED disposed on the reflection surface or near the reflection surface. There are provided: a light emitting device equipped with an LED chip and a reflector having a high reflectivity relative to near infrared to ultraviolet rays irradiated from an LED chip and fluorescent material; and the reflector.
    Type: Grant
    Filed: April 3, 2007
    Date of Patent: January 31, 2012
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Masami Kumei, Takaaki Sakai, Masanori Sato
  • Patent number: 7859001
    Abstract: A semiconductor light emitting apparatus can include a housing filled with a wavelength conversion material-containing resin material which seals a semiconductor light emitting device inside the recess of the housing. A transparent resin material can be charged on the wavelength conversion material-containing resin material, and can be configured to prevent the resin materials from being detached from each other or from other portions, such as a housing. Furthermore, such a semiconductor light emitting apparatus can emit light with less color unevenness. The housing can include a first recessed portion and a second recessed portion. The second recessed portion can have a larger diameter than the first recessed portion so as to form a stepped area at the boundary therebetween. The first recessed portion is filled with the wavelength conversion material-containing resin material as a first resin.
    Type: Grant
    Filed: August 7, 2008
    Date of Patent: December 28, 2010
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Wakako Niino, Masami Kumei, Toshimi Kamikawa, Takashi Ebisutani
  • Publication number: 20100155758
    Abstract: A light emitting device is provided, including a resin which can be manufactured according to a simple process and deliver a desired scattering property. The light emitting device is manufactured according to a step for mixing two or more types of immiscible liquid materials to obtain a composition containing at least two types of materials phase-separated in a sea-island structure, and a step for arranging the composition in proximity to an LED chip, curing the composition with the sea-island structure being maintained, thereby forming an encapsulation resin. Accordingly, it is possible to form an island region which serves as a scattering center, according to a simple step of mixing materials.
    Type: Application
    Filed: December 15, 2009
    Publication date: June 24, 2010
    Inventors: Masami Kumei, Soji Owada, Koichi Takayama, Mitsunori Harada
  • Publication number: 20090039369
    Abstract: A semiconductor light emitting apparatus can include a housing filled with a wavelength conversion material-containing resin material which seals a semiconductor light emitting device inside the recess of the housing. A transparent resin material can be charged on the wavelength conversion material-containing resin material, and can be configured to prevent the resin materials from being detached from each other or from other portions, such as a housing. Furthermore, such a semiconductor light emitting apparatus can emit light with less color unevenness. The housing can include a first recessed portion and a second recessed portion. The second recessed portion can have a larger diameter than the first recessed portion so as to form a stepped area at the boundary therebetween. The first recessed portion is filled with the wavelength conversion material-containing resin material as a first resin.
    Type: Application
    Filed: August 7, 2008
    Publication date: February 12, 2009
    Inventors: Wakako Niino, Masami Kumei, Toshimi Kamikawa, Takashi Ebisutani
  • Publication number: 20070262335
    Abstract: A light emitting device is provided which has a reflector having a reflection surface made of porous alumina having an apparent density of 2.5 to 3.3 g/cm3, and an LED disposed on the reflection surface or near the reflection surface. There are provided: a light emitting device equipped with an LED chip and a reflector having a high reflectivity relative to near infrared to ultraviolet rays irradiated from an LED chip and fluorescent material; and the reflector.
    Type: Application
    Filed: April 3, 2007
    Publication date: November 15, 2007
    Applicant: Stanley Electric Co., Ltd.
    Inventors: Masami Kumei, Takaaki Sakai, Masanori Sato