Abstract: A whetstone pellet 1 is composed of a columnar base body 2 to be fixed on a pedestal 9, and an abrasive grain part 5 containing numerous abrasive grains formed by electroless plating on an end surface 3 of the base body 2. Upon forming the abrasive grain part 5, a plated layer is formed on the end surface 3 of the base body 2 under stirring a plating solution containing abrasive grains, whereby the distribution of the abrasive grains in the abrasive grain part 5 can be uniformized.

Abstract: A grindstone 1 has a pedestal 2 and an abrasive-grain layer 9 provided on the pedestal 2. The abrasive-grain layer 9 is a plating film which contains abrasive grains. An intermediate layer 7 which has physical properties different from those of the abrasive-grain layer 9 is provided between the abrasive-grain layer and the pedestal. The intermediate layer 7 is a plating film which contains abrasive grains, and the plating film of this intermediate layer 7 has a color tone different from the color tone of the plating film of the abrasive-grain layer 9. As being so made up, in the grindstone having an abrasive-grain layer formed of a plating film as a binder, the grindstone lifetime can be judged with ease.

Abstract: A whetstone pellet 1 is composed of a columnar base body 2 to be fixed on a pedestal 9, and an abrasive grain part 5 containing numerous abrasive grains formed by electroless plating on an end surface 3 of the base body 2. Upon forming the abrasive grain part 5, a plated layer is formed on the end surface 3 of the base body 2 under stirring a plating solution containing abrasive grains, whereby the distribution of the abrasive grains in the abrasive grain part 5 can be uniformized.

Abstract: A process for producing a whetstone, wherein a whetstone pellet is composed of at least one columnar base body fixed on a pedestal, and an abrasive grain part, formed on an end surface of the base body, containing numerous abrasive grains formed by electroless plating The abrasive grain part, is a plated layer formed on the end surface of the base body by stirring a plating solution containing abrasive grains, such that the distribution of the abrasive grains in the abrasive grain part is uniformly distributed.

Abstract: A grindstone 1 has a pedestal 2 and an abrasive-grain layer 9 provided on the pedestal 2. The abrasive-grain layer 9 is a plating film which contains abrasive grains. An intermediate layer 7 which has physical properties different from those of the abrasive-grain layer 9 is provided between the abrasive-grain layer and the pedestal. The intermediate layer 7 is a plating film which contains abrasive grains, and the plating film of this intermediate layer 7 has a color tone different from the color tone of the plating film of the abrasive-grain layer 9. As being so made up, in the grindstone having an abrasive-grain layer formed of a plating film as a binder, the grindstone lifetime can be judged with ease.

Abstract: A whetstone pellet 1 is composed of a columnar base body 2 to be fixed on a pedestal 9, and an abrasive grain part 5 containing numerous abrasive grains formed by electroless plating on an end surface 3 of the base body 2.

Abstract: Methods are disclosed for manufacturing coils for use in a charged-particle-beam (CPB) optical system such as would be used in a CPB imaging apparatus or CPB lithography apparatus. In an embodiment, on a surface of a coil substrate is formed a mask layer defining channels corresponding to a coil pattern. Using the mask layer as a mask, a pattern of conductive coil-forming material is applied to the substrate surface in the channels. Coil elements formed on the substrate surface by this method exhibit steep sides and a desired aspect ratio. To such end, the depth of the channels desirably is greater than the desired thickness of the coil elements. Alternatively, a metal layer (for use as an electroplating electrode) is formed on a surface of the substrate. The metal layer is coated with a resist at a thickness of at least 0.1 mm. The resist is removed by lithography from regions where coil elements are to be formed. In the regions, conductive metal is grown by electroplating to form the coil elements.

Abstract: A novel method and apparatus are provided by the invention for the precision-control of the thickness of thin work pieces under lapping in a lapping machine having an upper and lower lapping surface plates rotatable relative to each other sandwiching the work pieces with continuous supply of a lapping fluid therebetween. In the invention, the upper lapping surface place is provided with an opening in the lapping surface, in which an ultrasonic transducer means is mounted capable of projecting an ultrasonic wave to the work piece and receiving the dual echo waves reflected at the upper and the lower surface of the work piece so as that the delay time of the echo waves is transmitted as electrical signals to a control means of the lapping machine where the signals are computed in terms of the thickness of the work pieces and utilized for controlling the operation of the machine.