Abstract: A semiconductor wafer testing method includes a pre-test step for forming a temporary test film on a surface of a semiconductor wafer, a test step for testing the semiconductor wafer by applying a probe to the temporary test film and a post-test step for exfoliating the temporary test film from the surface of the semiconductor wafer. The temporary test film includes test electrode groups each provided with a plurality of regularly arranged test electrodes, and wiring patterns for electrically connecting the test electrodes with corresponding ones of semiconductor unit electrodes in respective semiconductor units on the semiconductor wafer. Probe pins of said probe are arranged so as to be aligned with corresponding ones of the test electrodes of the respective test electrode groups.

Abstract: There is disclosed a multi-layer laminate molding having a layer structure that a main material layer made mainly of a polyethylenic resin at the outer side and an ethylene-vinyl acetate copolymer saponified product layer or polyamide resin layer at the inner side are laminated through at least an adhesive material layer, the adhesive material layer comprising a resin composition containing (A) 60 to 95% by weight of at least one resin selected from the-group consisting of (1) a high density polyethylenic resin having specified physical properties, (2) a linear low density polyethylenic resin having specified physical properties, (3) a modified high density polyethylenic resin obtained by grafting unsaturated carboxylic acid and the like onto the above (1), and (4) a modified linear low density polyethylenic resin obtained by grafting unsaturated carboxylic acid and the-like onto the above (2), and containing at least 0.

Abstract: A polyethylenic resin composition comprising: at least one high density polyethylenic resin selected from (a) a high density polyethylenic resin (Resin A) and (b) a modified high density polyethylenic resin as derived by grafting on the Resin A a monomer of unsaturated carboxylic acid or its derivative (Resin B), at least one linear low density polyethylenic resin selected from (c) a linear low density polyethylenic resin (Resin C) and (d) a modified linear low density polyethylenic resin as derived by grafting on the Resin C the monomer as described in (b) above (Resin D), and (e) a linear very low density polyethylenic resin (Resin E) having a density (g/cm.sup.3) of at least 0.890, but less than 0.910, and a melting point of 110.degree. to 125.degree. C. This polyethylenic resin composition is excellent in fuel oil resistance, low temperature impact resistance, and heat resistance, and provides a material having affinity or adhesive properties to various resinous and metallic materials.

Abstract: A medical bag composed of a laminate comprising (i) an inner low-density polyethylene layer, (ii) an intermediate layer of ethylene-vinyl acetate copolymer, ethylene-propylene type elastomer, or ethylene-butene-1 type elasomer, and (iii) an outer low-density polyethylene layer. This bag has excellent sanitariness, flexibility, transparency, and heat-resistance, therefore, is suitable for use as a container of blood and various medicinal liquids.