Patents by Inventor Masami Mori

Masami Mori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6850085
    Abstract: A testing device for a semiconductor integrated circuit of the present invention includes a differential amplifier array module and tester which determine whether an output voltage of a liquid crystal driver LSI is at a proper level and an expected value voltage generator which generates an expected value voltage in accordance with expected value data to output it to the differential amplifier array module. The expected value voltage generator produces expected value data by interpolation in accordance with incoming expected value data fewer in number than the expected value voltage to be generated, so as to be equal in number to the expected value voltage. This makes it possible to carry out an extremely short time and highly accurate test for output voltages of a device under test (liquid crystal driver LSI).
    Type: Grant
    Filed: April 30, 2003
    Date of Patent: February 1, 2005
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Hideaki Sakaguchi, Masami Mori
  • Patent number: 6833715
    Abstract: A semiconductor testing apparatus and a semiconductor testing method are provided which permit an apparatus having an inexpensive configuration to perform, with precision, the acceptance-or-rejection determination and measurement test of a semiconductor integrated circuit having a large number of output terminals each for outputting a multi-gradation level output voltage. The semiconductor testing apparatus includes output voltage testing device and comparison voltage generation data inputting device. The output voltage testing device includes test voltage inputting device, comparison voltage generating device, a high level comparator, a low level comparator, and comparison result outputting device. The high level comparator and the low level comparator constitute comparing device for comparing a voltage to be tested, with a comparison voltage.
    Type: Grant
    Filed: July 11, 2003
    Date of Patent: December 21, 2004
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Hideaki Sakaguchi, Masayuki Ehiro, Masami Mori
  • Publication number: 20040008052
    Abstract: A semiconductor testing apparatus and a semiconductor testing method are provided which permit an apparatus having an inexpensive configuration to perform, with precision, the acceptance-or-rejection determination and measurement test of a semiconductor integrated circuit having a large number of output terminals each for outputting a multi-gradation level output voltage. The semiconductor testing apparatus comprises output voltage testing means and comparison voltage generation data inputting means. The output voltage testing means comprises test voltage inputting means, comparison voltage generating means, a high level comparator, a low level comparator, and comparison result outputting means. The high level comparator and the low level comparator constitute comparing means for comparing a voltage to be tested, with a comparison voltage.
    Type: Application
    Filed: July 11, 2003
    Publication date: January 15, 2004
    Inventors: Hideaki Sakaguchi, Masayuki Ehiro, Masami Mori
  • Publication number: 20030201788
    Abstract: A testing device for a semiconductor integrated circuit of the present invention includes a differential amplifier array module and tester which determine whether an output voltage of a liquid crystal driver LSI is at a proper level and an expected value voltage generator which generates an expected value voltage in accordance with expected value data to output it to the differential amplifier array module. The expected value voltage generator produces expected value data by interpolation in accordance with incoming expected value data fewer in number than the expected value voltage to be generated, so as to be equal in number to the expected value voltage. This makes it possible to carry out an extremely short time and highly accurate test for output voltages of a device under test (liquid crystal driver LSI).
    Type: Application
    Filed: April 30, 2003
    Publication date: October 30, 2003
    Inventors: Hideaki Sakaguchi, Masami Mori
  • Publication number: 20020087721
    Abstract: A plurality of private address spaces where private addresses may possibly overlap are connected with a global address space. Respective private address spaces possess VLAN-IDs as identification information for VLANs. When connecting the respective private address spaces with the Internet, a duplicate network address translating device performs, with VLAN-ID and the private address of the respective private address spaces in pairs, mutual translation between the private address and global address of the Internet. According to another aspect of the invention, a duplicate addresses-handling server is provided with a routing table which shows the relationship between virtual interfaces corresponding to VLAN-IDs and addresses of the respective private address spaces.
    Type: Application
    Filed: December 26, 2001
    Publication date: July 4, 2002
    Inventors: Yoshikazu Sato, Kanji Hiraoka, Masami Mori, Takaaki Miyata
  • Patent number: 6359384
    Abstract: The invention provides an organic EL device comprising a hole injecting electrode, and at least one organic layer disposed between the electrodes, wherein the electron injecting electrode is comprised of an AlLi alloy containing 0.4-14 at % of lithium deposited by a sputtering process. This improves the film formability and adhesion at the interface between the electron injecting electrode and the organic layer, realizing an organic EL device featuring a high luminance, high efficiency, long lifetime, and high display quality.
    Type: Grant
    Filed: July 24, 1998
    Date of Patent: March 19, 2002
    Assignee: TDK Corporation
    Inventors: Kenji Nakaya, Isamu Kobori, Masami Mori, Kazutoshi Ohisa, Michio Arai
  • Patent number: 6215245
    Abstract: An organic EL device comprises a film form of cathode prepared by a sputtering technique, and formed of an alloy of sodium and/or potassium. This cathode is improved in terms of its adhesion to the interface between the cathode and an organic layer and electron injection efficiency, resulting in light emission property improvements. In addition, this cathode causes less damage to the organic layer, is effective for prevention of occurrence of dark spots, and suffers from little or no degradation of performance.
    Type: Grant
    Filed: July 6, 1998
    Date of Patent: April 10, 2001
    Assignee: TDK Corporation
    Inventor: Masami Mori
  • Patent number: 6187457
    Abstract: The invention provides an organic electroluminescent light emitting device comprising essentially comprising a substrate, a hole injecting electrode formed on at least said substrate, a light emitting layer and an electron injecting electrode containing a constituting material having a work function of up to 4 eV. The electron injecting electrode has a sealing film on a side thereof not opposite to the substrate. This sealing film contains one or two or more of an oxide, a nitride and a carbide of the constituting material for the electron injecting electrode, and so can be relatively easily formed continuously from the electron injecting electrode without any dedicated equipment for sealing films, while maintaining a high sealing effect. The invention also provides a process of producing such an organic electroluminescent light emitting device.
    Type: Grant
    Filed: October 21, 1998
    Date of Patent: February 13, 2001
    Assignee: TDK Corporation
    Inventors: Michio Arai, Kenji Nakaya, Osamu Onitsuka, Masami Mori
  • Patent number: 6172458
    Abstract: An organic electroluminescent light emitting device comprises a hole injecting electrode, an electron injecting electrode and at least one organic layer between said electrodes. The electron injecting electrode is a film of an AlLi alloy formed by a sputtering technique. The AlLi alloy comprises 0.1 to 20 at % of lithium and contains as a subordinate component at least one of Cu, Mg and Zr in an amount of Cu: ≦10 wt % Mg: ≦5 wt % Zr: ≦0.5 wt % per the total sum of aluminum and lithium.
    Type: Grant
    Filed: April 27, 1998
    Date of Patent: January 9, 2001
    Assignee: TDK Corporation
    Inventors: Kenji Nakaya, Isamu Kobori, Masami Mori, Kazutoshi Ohisa, Michio Arai
  • Patent number: 6118212
    Abstract: An organic EL device of the invention comprises a hole injecting electrode, an electron injecting electrode and at least one organic layer interleaved between them. The electron injecting electrode is a film of an aluminum lithium alloy formed by a sputtering technique and comprising 0.4 to 14 at % of lithium. The electron injecting electrode further includes on a side of the electron injecting electrode that is not opposite to the organic layer a protective electrode comprising at least one of aluminum, aluminum and a transition metal except titanium, titanium, and titanium nitride.
    Type: Grant
    Filed: May 15, 1998
    Date of Patent: September 12, 2000
    Assignee: TDK Corporation
    Inventors: Kenji Nakaya, Isamu Kobori, Masami Mori, Kazutoshi Ohisa, Michio Arai
  • Patent number: 5981092
    Abstract: An organic EL device of the invention includes an inorganic material layer with a resistivity of less than 20 .OMEGA.-cm disposed between an electrode and a light emitting layer. The inorganic material layer contains at least one of indium oxide, tin oxide, and zinc oxide as a primary component, which is the same material as an anode, and at least one of silicon and germanium as an auxiliary component. This improves physical properties at the electrode-organic layer interface and restrains generation of dark spots, establishing an organic EL device featuring a long life, high efficiency and low cost.
    Type: Grant
    Filed: March 25, 1997
    Date of Patent: November 9, 1999
    Assignee: TDK Corporation
    Inventors: Michio Arai, Masami Mori, Kenji Nakaya
  • Patent number: 5472777
    Abstract: A novel structure has, on a substrate a nonlinear optical thin film having a high .chi..sup.(3) value provided wherein metal fine particles are uniformly dispersed in a ferroelectric or highly dielectric matrix and heat treated whereby the metal fine particles and matrix are improved in crystallinity. The excitation wavelength can be substantially changed by a choice of the heat treating conditions. The crystallinity of the metal fine particles and matrix and .chi..sup.(3) value are improved by selecting a proper substrate or changing the heat treating procedure and conditions. The thin film is further improved in nonlinear optical properties, typically .chi..sup.(3) and .chi..sup.(3) /.alpha. values by using a perovskite type compound ABO.sub.3 having a specific A/B ratio as the matrix material and controlling film deposition conditions for improving the crystallinity of the matrix.
    Type: Grant
    Filed: October 31, 1994
    Date of Patent: December 5, 1995
    Assignee: TDK Corporation
    Inventors: Tohru Kineri, Masami Mori
  • Patent number: 5401569
    Abstract: A novel nonlinear optical thin film having a high .chi..sup.(3) value is provided wherein metal fine particles are uniformly dispersed in a ferroelectric or highly dielectric matrix and heat treated whereby the metal fine particles and matrix are improved in crystallinity. The excitation wavelength can be substantially changed by a choice of the heat treating conditions.The crystallinity of the metal fine particles and matrix and .chi..sup.(3) value are improved by selecting a substrate used or changing the heat treating procedure and heat treating conditions. By forming a portion having a lower content of metal fine particles in a surface portion on an upper and/or lower side of the matrix, the excitation wavelength can be substantially changed and precisely adjusted.
    Type: Grant
    Filed: February 23, 1993
    Date of Patent: March 28, 1995
    Assignee: TDK Corporation
    Inventors: Tohru Kineri, Masami Mori
  • Patent number: 5132322
    Abstract: Compounds that are analogs of etoposide and exhibit antitumor activity are disclosed. The compounds of the present invention have the following formula: ##STR1## where: R.sub.1 is .beta.-OCH.sub.2 CH.sub.2 NH.sub.2 .beta.-NHCH(CH.sub.3)CH.sub.2 OH, .beta.-NHCH.sub.2 CH(CH.sub.3)OH, .beta.-Cl, .beta.-Br, .beta.-OH, .alpha.-OH, .beta.-NH, .alpha.-NH.sub.2, .beta.-NHCH.sub.2 CH.sub.2 OH, .alpha.-NHCH.sub.2 CH.sub.2 OH, .beta.-NHCH.sub.2 CH.sub.2 CH.sub.3, .beta.-NHCH.sub.2 CH.sub.2 OCH.sub.3, .beta.-NHCH.sub.2 CH.dbd.CH.sub.2, .beta.-NHCH.sub.2 CH(OH)CH.sub.3, .beta.-NHCH.sub.2 CH.sub.2 CH.sub.2 OH, .beta.-OCH.sub.2 CH.sub.2 OH, ##STR2## R.sub.2 is H, or Br; R.sub.1 is H, or Br;R.sub.4 is H, or Br;R.sub.5 is H, or Br; andR.sub.6 is H, or --CH.sub.3.
    Type: Grant
    Filed: September 12, 1989
    Date of Patent: July 21, 1992
    Assignee: The University of North Carolina at Chapel Hill
    Inventors: Kuo-Hsiung Lee, Zhe Oing Wang, J. Phillip Bowen, Dora M. Schnur, Yung-Chi Cheng, Su-Ying Liu, Yao H. Kuo, Masami Mori
  • Patent number: 5069838
    Abstract: A method of producing a frame-installed seat pad structure, which includes by steps (a) preparing a mold assembly which includes a mold and a lid, the lid having a foamable material feeding tube connected thereto; (b) preparing an endless elongate member which defines therein and therealong a continuous way, the endless elongate member having an inlet portion matable with the feeding tube of the lid and a plulality of outlet portions; (c) detachably connecting the endless elongate member to the lid having the inlet portion thereof mated with material feeding tube; (d) putting the lid on the mold having the endless elongate member exposed to a cavity of the mold; (e) pouring a foamable plastic material into the material feeding tube, so that the material flows in and along the continuous way and falls into the cavity through the outlet portions; (f) curing the material; and (g) removing the lid from the mold when the material is hardened to a certain degree.
    Type: Grant
    Filed: March 28, 1990
    Date of Patent: December 3, 1991
    Assignee: Ikeda Bussan Co., Ltd.
    Inventors: Masami Mori, Norio Yanagishita, Ichiro Matsuura, Kiichiro Ishimaru, Hisayoshi Mizuno
  • Patent number: 5053271
    Abstract: A skin covered foamed plastic article capable of providing improved softness, feel and comfortableness by reducing the amount of penetration of the liquid foam resin into the skin cover with a thin wadding. The article includes a wadding to be attached on a back side of the surface skin and to make a direct contact with the pad member, having a soft layer contacting the surface skin and a hard layer contacting the pad member which has a constant thickness and is made to be harder than both the soft layer and the pad member.
    Type: Grant
    Filed: October 27, 1989
    Date of Patent: October 1, 1991
    Assignee: Ikeda Bussan Co., Ltd.
    Inventors: Masami Mori, Norio Yanagishita
  • Patent number: 5018958
    Abstract: A mold for skin covered foamed plastic molding capable of preventing penetration of the liquid foam resin to be poured on a skin cover without manual operation of target plate or use of double side adhesive tapes, and also capable of improving the efficiency of manufacturing process. The mold includes an element removably attached on the upper mold below the injection hole, for receiving the liquid foam resin before the liquid foam resin falls on the skin cover.
    Type: Grant
    Filed: March 28, 1989
    Date of Patent: May 28, 1991
    Assignee: Ikeda Bussan Co., Ltd.
    Inventors: Hisayoshi Mizuno, Masami Mori
  • Patent number: 5011394
    Abstract: A mold for skin covered foamed plastic molding which utilizes a middle mold to be placed between an upper mold and a lower mold capable of preventing penetration of the liquid foam resin to be poured onto the skin cover, and also capable of improving the efficiency of the manufacturing process. The mold includes a middle mold configured for reducing pressure exerted by the liquid foam resin falling on the skin cover.
    Type: Grant
    Filed: March 28, 1989
    Date of Patent: April 30, 1991
    Assignee: Ikeda Bussan Co., Ltd.
    Inventors: Hiroyuki Katagiri, Hisayoshi Mizuno, Masami Mori
  • Patent number: 4959184
    Abstract: A method of producing a skin-covered foamed plastic article, which includes preparing a lower mold which has a cavity formed therein; putting a bag-shaped outer skin member into the cavity, the skin member having a porous inner layer; pouring a foamable material for the foamed plastic article into the bag-shaped outer skin member; and controlling a pressure in the cavity in such a manner that the inner layer becomes saturated to a predetermined degree during curing of the material.
    Type: Grant
    Filed: October 20, 1988
    Date of Patent: September 25, 1990
    Assignee: Ikeda Bussan Co., Ltd.
    Inventors: Mikio Akai, Masami Mori
  • Patent number: 4824070
    Abstract: A mold assembly for producing a skin-covered foamed plastic article is disclosed, which includes a lower mold having a cavity formed therein, the lower mold having a first flange portion which extends around a mouth of the lower mold; an upper mold which is to be put on the lower mold to close the cavity, the upper mold having a second flange portion which is mated with the first flange portion of the lower mold when the two molds are properly coupled; a recess at an inside part of the first flange portion which is defined by a horizontal wall and a vertical wall; a press plate which is pivotally connected to the horizontal wall of the recess; a spring for biasing the press plate in a direction to achieve an abutment with the horizontal wall; and a press structure provided on the second flange portion of the upper mold, the press structure abutting on the press plate to press the same toward the horizontal wall when the upper mold is properly mounted on the lower mold.
    Type: Grant
    Filed: June 29, 1988
    Date of Patent: April 25, 1989
    Assignee: Ikeda Bussan Co., Ltd.
    Inventors: Hisayoshi Mizuno, Masami Mori