Patents by Inventor Masami Mouri

Masami Mouri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 9472482
    Abstract: A semiconductor device includes a substrate, a semiconductor element disposed on the substrate, a heat radiating plate disposed on the substrate and covering the semiconductor element, and a connection member connecting an upper surface of the semiconductor element and a lower surface of the heat radiating plate, wherein the connection member includes a first member being in contact with the upper surface of the semiconductor element and having a first melting point, a second member being in contact with the first member, having a larger area than the first member, and having a second melting point higher than the first melting point, and a third member interposed between the second member and the heat radiating plate, having an area smaller than the second member, and having a third melting point lower than the second melting point.
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: October 18, 2016
    Assignee: SOCIONEXT INC.
    Inventors: Takumi Ihara, Masami Mouri
  • Semiconductor device
    Patent number: 8933560
    Abstract: A semiconductor device includes a substrate, a semiconductor element disposed on the substrate, a heat radiating plate disposed on the substrate and covering the semiconductor element, and a connection member connecting an upper surface of the semiconductor element and a lower surface of the heat radiating plate, wherein the connection member includes a first member being in contact with the upper surface of the semiconductor element and having a first melting point, a second member being in contact with the first member, having a larger area than the first member, and having a second melting point higher than the first melting point, and a third member interposed between the second member and the heat radiating plate, having an area smaller than the second member, and having a third melting point lower than the second melting point.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: January 13, 2015
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Takumi Ihara, Masami Mouri
  • SEMICONDUCTOR DEVICE
    Publication number: 20140167246
    Abstract: A semiconductor device includes a substrate, a semiconductor element disposed on the substrate, a heat radiating plate disposed on the substrate and covering the semiconductor element, and a connection member connecting an upper surface of the semiconductor element and a lower surface of the heat radiating plate, wherein the connection member includes a first member being in contact with the upper surface of the semiconductor element and having a first melting point, a second member being in contact with the first member, having a larger area than the first member, and having a second melting point higher than the first melting point, and a third member interposed between the second member and the heat radiating plate, having an area smaller than the second member, and having a third melting point lower than the second melting point.
    Type: Application
    Filed: February 20, 2014
    Publication date: June 19, 2014
    Applicant: FUJITSU SEMICONDUCTOR LIMITED
    Inventors: Takumi Ihara, Masami Mouri
  • Semiconductor device
    Patent number: 8299607
    Abstract: A semiconductor device includes a substrate, a semiconductor element disposed on the substrate, a heat radiating plate disposed on the substrate and covering the semiconductor element, and a connection member connecting an upper surface of the semiconductor element and a lower surface of the heat radiating plate, wherein the connection member includes a first member being in contact with the upper surface of the semiconductor element and having a first melting point, a second member being in contact with the first member, having a larger area than the first member, and having a second melting point higher than the first melting point, and a third member interposed between the second member and the heat radiating plate, having an area smaller than the second member, and having a third melting point lower than the second melting point.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: October 30, 2012
    Assignee: Fujitsi Semiconductor Limited
    Inventors: Takumi Ihara, Masami Mouri
  • SEMICONDUCTOR DEVICE
    Publication number: 20110278715
    Abstract: A semiconductor device includes a substrate, a semiconductor element disposed on the substrate, a heat radiating plate disposed on the substrate and covering the semiconductor element, and a connection member connecting an upper surface of the semiconductor element and a lower surface of the heat radiating plate, wherein the connection member includes a first member being in contact with the upper surface of the semiconductor element and having a first melting point, a second member being in contact with the first member, having a larger area than the first member, and having a second melting point higher than the first melting point, and a third member interposed between the second member and the heat radiating plate, having an area smaller than the second member, and having a third melting point lower than the second melting point.
    Type: Application
    Filed: February 24, 2011
    Publication date: November 17, 2011
    Applicant: FUJITSU SEMICONDUCTOR LIMITED
    Inventors: Takumi Ihara, Masami Mouri
  • Slip down-free socks with a garter
    Patent number: 4502158
    Abstract: Slip down-free socks with an elastic garter which is joined partly by stitching to the front upper part of a rib top in such a manner that, when the socks is put on, it suspends the socks. Instead of the elastic garter, slip down-free socks can have a garter portion of net stitch to be interposed between a welt portion and a leg portion of the socks.
    Type: Grant
    Filed: November 4, 1982
    Date of Patent: March 5, 1985
    Inventors: Masami Mouri, Fumio Uemura